Elantas (Altana) Conathane CE-1164 Datasheet Elantas (Altana) Conathane CE-1164

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  • Description for Elantas (Altana) Conathane CE-1164

    A single-component, air drying, room temperature curing, polyurethane conformal coating. Maintains excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions.

    *See Terms of Use Below

    Brand Conathane, Cytec
    Chemical Resistance Excellent, Chemical Resistance: Excellent
    Application Type Conformal coating
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Phenolic, Epoxy-glass
    Industry Electrical, Printed circuit boards, Electronic components
    Manufacturer Elantas (Altana)
    Chemistry Solvent-based, Polyurethane, Solvent-borne
    Cure Method Air dry
    Cure Temperature (°C) 25, 20 to 25 Room Temperature, 60, 25
    Cure Time (min) 1,440, 7,200 to 10,080, 180, 2,880 to 4,320, Fast
    Viscosity (cPs) 100
    Color Light amber, Clear, Transparent
    High Temperature Resistance (°C) 125
    Low Temperature Resistance (°C) -65
    Other Resistance Non-Nutrient
    Volume Resistivity (O) 1.5e15 (ohms/cm)
    Key Specifications IPC-CC-830B, Mil-Spec (United States Military Standard): I-46058-C: MIL-STD-810B; MIL-I-46058C, Type UR; MIL-STD 8108B, Mil-Spec (United States Military Standard): MIL-STD-810B; MIL-I-46058C, Type UR; MIL-STD 8108B

  • Technical Data for Elantas (Altana) Conathane CE-1164

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    Overview
    • Chemical Resistance
      • Chemical Resistance - Excellent
      • Chemical Resistance : Relative Solvent Resistance - Excellent
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
      • Phenolic
      • Epoxy - Epoxy-glass
    • Industry
      • Electronics - Electrical, Electronic components
      • Printed Circuit Board (PCB) - Printed circuit boards
    • Chemistry
    • Application Method
      • Brush - Brush Applied
      • Spray - Spray Coating
      • Dip - Dip Coating
    • Cure Method
      • Room Temperature / Air Dry - Air dry
    • Color
      • Clear / Transparent - Clear, Transparent
      • Red - Light amber
    • Key Specifications
      • IPC (Association Connecting Electronics Industries) - IPC-CC-830B
      • Mil-Spec (United States Military Standard) : I-46058-C : Type UR - MIL-STD-810B; MIL-I-46058C, Type UR; MIL-STD 8108B
      • Mil-Spec (United States Military Standard) : STD 8108B - MIL-STD-810B; MIL-I-46058C, Type UR; MIL-STD 8108B
      • Mil-Spec (United States Military Standard) : STD-810B - MIL-STD-810B; MIL-I-46058C, Type UR; MIL-STD 8108B
    • Brand
      • Conathane
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 20 to 25 Room Temperature, 60, 25 Test Method
    Cure Time (min) 1,440, 7,200 to 10,080, 180, 2,880 to 4,320, Fast Test Method
    Viscosity (cPs) 100 Test Method
    Tack Free Time (min) 20 to 30 Test Method
    Bond Strength
    General Bond Strength (psi) Excellent
    Material Resistance
    High Temperature Resistance (°C) 125
    Low Temperature Resistance (°C) -65
    Moisture/Humidity Resistance Humidity resistance
    Other Resistance Non-Nutrient Test Method
    Conductivity
    Dissipation Factor 0.02000 Test Method
    Insulation Resistance (O) 2.5e13 (ohms), 1.3e10 (ohms), 4.5e12 (ohms) Test Method
    Dielectric Strength (V/mil) 3,500 Test Method
    Dielectric Constant 2.70 Test Method
    Volume Resistivity (O) 1.5e15 (ohms/cm) Test Method
    Hardness
    Flexibility Excellent, No cracking or crazing Test Method
    Other Properties
    Specific Gravity 1.050 Test Method
    Flash Point (°F) 55.4, 44.6 Test Method
    % Solids (%) 50 Test Method
    Business Information
    Shelf Life Details Maintain containers at temperatures of 65 °F-85 °F and keep securely closed when not in use. Moisture may cause polymerization. To extend shelf life once opened, containers should be flushed with nitrogen (see CONAP® Dri- Purge) each time they are opened unless the contents are used within one day.;CONATHANE CE-1164 has a minimum shelf life of 18 months from date of manufacture when stored in original unopened containers at 65 °F-85 °F.
    Shelf Life Temperature (°F) 65 to 85
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18

  • Best Practices for Elantas (Altana) Conathane CE-1164

    *See Terms of Use Below

    1. Application

      CONATHANE® CE-1164 is a high-performance conformal coating specifically designed as an electrical insulating coating for printed circuitry and components. The ultimate performance of the cured film is dependent on process controls used in application of the coating. Cleanliness of the substrate is a major factor in promoting adhesion and preventing under-film corrosion. Assemblies must be clean, oil-free, and dry. For specific recommendations, please request Technical Bulletin C-115.

      CE-1164 may be applied by spraying, dipping, or brushing. If viscosity reduction is desired, dilutions of 10-20% by weight with CONAP® S-8 solvent are recommended for most applications. It should be noted that CE-1164 reacts with moisture in the air, and dip tanks should be covered and blanketed with dry air or nitrogen when not in use to prevent waste of material in the tank.

      Two coats are recommended for optimum protection. A total cured film thickness of 2 ± 1 mil is recommended. CE-1164 may be re-coated, if desired, after the previous film is tack-free.

  • Comparable Materials for Elantas (Altana) Conathane CE-1164

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    Spec Engine® Results

    • Miller-Stephenson
      MS-470C(Miller-Stephenson)

      A non-flammable, solvent-based, one-component polyurethane conformal coating provided in the convenience of aerosol.

    • Henkel
      Hysol PC18M(Henkel)

      Flexible solvent-based, one component, urethane coating. Provides good thermal shock resistance. MIL-I-46058C.

    • Miller-Stephenson
      MS-472C(Miller-Stephenson)

      A non-flammable, solvent-based, one-component polyurethane conformal coating that be applied by brush, spray or dip methods.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
25°C
20 to 25°C Room Temperature Post Cure
60°C Alternatively
25°C Alternatively
Cure Time Test Methods
Cure Time Test Method
1,440 min
7,200 to 10,080 min Post Cure
180 min Alternatively
2,880 to 4,320 min Alternatively
Fast
Tack Free Time Test Methods
Tack Free Time Test Method
20 to 30 min Approximately
Viscosity Test Methods
Viscosity Test Method Temperature
100 cPs Brookfield 25°C
Other Resistance Test Methods
Other Resistance Test Method
Non-Nutrient Fungus Resistance, ASTM G-21
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
2.70 25°C Room Temperature 1 MHz; ASTM D150
Dielectric Strength Test Methods
Dielectric Strength Test Method
3,500 V/mil ASTM D149
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.02000 25°C Room Temperature 1 MHz; ASTM D150
Insulation Resistance Test Methods
Insulation Resistance Temperature Test Method
2.5e13 (ohms) 25°C Initially @ 25°C and 50% R.H, 2.0 mil films, MIL-I-46058C
1.3e10 (ohms) 65°C After 10 Days @ 65°C and 95% R.H, 2.0 mil films, MIL-I-46058C
4.5e12 (ohms) 25°C Room Temperature After conditioning 24 hours @ 25°C and 50% R.H, 2.0 mil films
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
1.5e15 (ohms/cm) 25°C Room Temperature
Flexibility Test Methods
Flexibility Test Method
Excellent
No cracking or crazing 1/8” diameter mandrel, MIL-I-46058C
Flash Point Test Methods
Flash Point Test Method
13.0°C Closed Cup
7.0°C ASTM D93
% Solids Test Methods
% Solids Test Method
50 % 135°C for 45 min
Specific Gravity Test Methods
Specific Gravity Temperature
1.050 25°C Room Temperature