Elantas (Altana) EN-16

Elantas (Altana) EN-16 Datasheet
  • Description for Elantas (Altana) EN-16

    High reliability systems have excellent hydrolytic stability, outstanding electrical properties over a wide temperature <br/>range, excellent thermal shock resistance, low temperature elasticity, low exotherm, and minimal shrinkage.

    *See Terms of Use Below

    Brand Cytec
    Application Type Conformal Coating, Potting, Encapsulating
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Manufacturer Elantas (Altana)
    Chemistry polyurethane
    Cure Method Part A/Part B
    Cure Temperature (°C) 25, 80
    Cure Time (min) 10,080, 960
    Viscosity (cPs) 4,000
    Color Amber
    Fungus Resistance Fungus Resistance
    Arc Resistance (sec) Arc Resistance
  • Technical Data for Elantas (Altana) EN-16

    Overview
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 80
    Cure Time (min) 10,080, 960
    Viscosity (cPs) 4,000 Test Method
    Linear Shrinkage (%) 2.60
    Work / Pot Time (min) 30 Test Method
    Mix Ratio 4:1 (by volume), 100:25 (by weight)
    Bond Strength
    Tear Strength (piw) 418 (pli)
    Tensile Strength (psi) 4,220
    Material Resistance
    Fungus Resistance Fungus Resistance
    Arc Resistance (sec) Arc Resistance
    Conductivity
    Dissipation Factor 0.02600, 0.08300 Test Method
    Insulation Resistance (O) 1.5e11 (ohms), Insulation Resistance
    Dielectric Strength (V/mil) 481 (vpm) Test Method
    Dielectric Constant 6.38, 4.48 Test Method
    Hardness
    Shore A Hardness 75 to 85
    Elongation (%) 512
    Other Properties
    Specific Gravity 1.060 Test Method
    Business Information
    Shelf Life Details All Systems should be stored at temperatures of 65°F to 85°F in tightly closed containers. If containers are opened and the contents only partially used, the container should be flushed with dry nitrogen or dry air before being resealed.
    Shelf Life Temperature (°F) 149 to 185
  • Best Practices for Elantas (Altana) EN-16

    *See Terms of Use Below

    1. Application

      Mixed materials should be carefully poured into electrical/electronic units, devices, or molds to avoid any bubble or void entrapment. The material should then be cured at room temperature or elevated temperature as required.

    2. Mixing

      The components should be mixed thoroughly using metal, plastic, or glass stirrers. NOTE: Avoid paper cups and wooden stirrers!

    3. Deairing/Degassing

      For cosmetically clean and bubble-free castings, the mixed system should be degassed at 1 to 5mm Hg vacuum. Containers should be large enough to allow for frothing during degassing.

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Viscosity Test Methods
Viscosity Temperature
4,000 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 min (1 lb. Mass) 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
6.38 Dielectric Constant @ 100 Hz
4.48 Dielectric Constant @ 1 MHz
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
481 (vpm) 25°C 1/16"
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.02600 Dissipation Factor @ 100 Hz
0.08300 Dissipation Factor @ 1 MHz
Specific Gravity Test Methods
Specific Gravity Test Method
1.060 Cured