AOS Thermal Compounds Sure-Form Gap Filling Gel 52057

AOS Thermal Compounds Sure-Form Gap Filling Gel 52057 Datasheet
  • Description for AOS Thermal Compounds Sure-Form Gap Filling Gel 52057

    A one part, non-silicone, synthetic-based thermal grease.

    *See Terms of Use Below

    Application Type Gap Filling, Thermal Grease
    1 Part or 2 Part 1 Part
    Material Form Grease
    Substrate Most plastic components, Most metal
    Industry Most electronic materials, Circuit
    Manufacturer AOS Thermal Compounds
    Chemistry Non-silicone, Synthetic-based
    Cure Method Moisture
    Viscosity (cPs) Will not run, Very viscous, 280,000, 90,000
    Color Gray
    High Temperature Resistance (°C) Excellent thermal resistance, 180
    Low Temperature Resistance (°C) -40
    Evaporation (%) 0
    Key Specifications RoHS Compliant
  • Technical Data for AOS Thermal Compounds Sure-Form Gap Filling Gel 52057

    Overview
    • Application Type
      • Gap Filler - Gap Filling
      • Lubricant - Thermal Grease
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Grease
    • Substrate
    • Industry
    • Chemistry
      • Other - Synthetic-based, Non-silicone
    • Cure Method
      • Moisture / Condensation Cure - Moisture
    • Color
      • Gray
    • Key Specifications
      • RoHS (Restriction of Hazardous Substances) - RoHS Compliant
    Specifications
    Cure Specs
    Viscosity (cPs) Will not run, Very viscous, 280,000, 90,000 Test Method
    Bond Strength
    General Bond Strength (psi) Very tacky
    Material Resistance
    High Temperature Resistance (°C) Excellent thermal resistance, 180 Test Method
    Low Temperature Resistance (°C) -40 Test Method
    Vibration Resistance/Shock Resistance Resists shock, Resists vibration
    Conductivity
    Dissipation Factor 0.00270 Test Method
    Dielectric Strength (V/mil) 318, 212 Test Method
    Dielectric Constant 5.00 Test Method
    Thermal Conductivity (W/m°K) 1.70, Excellent Test Method
    Volume Resistivity (O) 2.15e15 (ohm-cm) Test Method
    Other Properties
    Evaporation (%) 0
    Specific Gravity 2.500 Test Method
    Business Information
    Shelf Life (mon) 61
  • Best Practices for AOS Thermal Compounds Sure-Form Gap Filling Gel 52057

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  • Comparable Materials for AOS Thermal Compounds Sure-Form Gap Filling Gel 52057

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Viscosity Test Methods
Viscosity Test Method Temperature
Will not run
Very viscous
280,000 cPs ARES G-2 RHEOMETE, 1 sec-1 25°C
90,000 cPs ARES G-2 RHEOMETE, 1 sec-1 50°C
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Operating Temperature
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Excellent thermal resistance
180°C Operating Temperature
Volume Resistivity Test Methods
Volume Resistivity Test Method
2.15e15 (ohm-cm) ASTM D-257
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.00270 25°C ASTM D-150, @ 1000 Hz
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
5.00 25°C ASTM D-150, @ 1000 Hz
Dielectric Strength Test Methods
Dielectric Strength Test Method
318 V/mil
212 V/mil ASTM D-149, after exposure to 85°C/85% R.H. for 48 hours
Thermal Conductivity Test Methods
Thermal Conductivity Temperature Test Method
1.70 W/m°K 36°C ASTMD 5470-06
Excellent 36°C ASTMD 5470-06
Specific Gravity Test Methods
Specific Gravity Temperature Test Method
2.500 25°C ASTM D-70