Resin Designs TP-2160 Thermally ConDuctive Pad

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Description for Resin Designs TP-2160 Thermally ConDuctive Pad

Gap filler interface; foam-based thermal gel; one side tacky.

Chemical Resistance	Good
Application Type	Gap filler
1 Part or 2 Part	1-Part
Material Form	Pad
Industry	Heat sinks of power components
Manufacturer	Resin Designs
Chemistry	Silicone
Cure Method	Pressure Sensitive
Color	Gray
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40
Volume Resistivity (O)	1e11 (ohms/cm)
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB

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Chemical Resistance
- Chemical Resistance - Good
Application Type
- Gap Filler
1 Part or 2 Part
- 1-Part
Material Form
- Pad
Industry
- Electronics - Heat sinks of power components
- Industrial - Heat sources
- Other - Low mounting
Chemistry
- Silicone
Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
Color
- Gray
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB

General Bond Strength (psi)	Tacky
Tensile Strength (psi)	40

Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-40

Specific Gravity	1.900
Coefficient of Thermal Expansion (CTE)	380 (Linear (micron/m °C or ppm ))

Shelf Life Details	The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.