Resin Designs TP-2160 Thermally ConDuctive Pad Datasheet Resin Designs TP-2160 Thermally ConDuctive Pad

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  • Description for Resin Designs TP-2160 Thermally ConDuctive Pad

    Gap filler interface; foam-based thermal gel; one side tacky.

    *See Terms of Use Below

    Chemical Resistance Good
    Application Type Gap filler
    1 Part or 2 Part 1 Part
    Material Form Pad
    Industry Heat sinks of power components
    Manufacturer Resin Designs
    Chemistry Silicone
    Cure Method Pressure Sensitive
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB

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