Shinetsu X-23-8032 Datasheet Shinetsu X-23-8032

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  • Description for Shinetsu X-23-8032

    Shinetsu X-23-8032 is a 1 Part Addition cure 0.11% Grease used to Gap Fill

    *See Terms of Use Below

    Application Type Thermal interface gap filler, Grease
    1 Part or 2 Part 1 Part
    Material Form Grease
    Industry Electronics applications requiring thermal dissipation
    Manufacturer Shinetsu
    Chemistry Low Molecular Weight Siloxane Stripped, Liquid-dispensed Gap Filling Rubber
    Cure Method Addition cure
    Cure Temperature (°C) 120
    Cure Time (min) 60
    Viscosity (cPs) 236 (Pa·s)
    Color White
    High Temperature Resistance (°C) Low thermal resistance, 8 (mm2·K/W), 180
    Low Temperature Resistance (°C) -40
    Density (g/cm³) 3.370

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
120°C Values are not for specification purposes
Cure Time Test Methods
Cure Time Test Method
60 min Values are not for specification purposes
Viscosity Test Methods
Viscosity Test Method
236 (Pa·s) Values are not for specification purposes
Shear Strength Test Methods
Shear Strength Type Test Method
0.1 (MPa) Lap Shear Strength Values are not for specification purposes
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Low thermal resistance
8 (mm2·K/W) Thermal Resistance, Values are not for specification purposes
180°C Usable Temp., Values are not for specification purposes
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Usable Temp., Values are not for specification purposes
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
Excellent
3.00 W/m°K Values are not for specification purposes
Density Test Methods
Density Temperature Test Method
3.370 g/cm³ 23°C Values are not for specification purposes