Shinetsu X-23-8038

Shinetsu X-23-8038 Datasheet
  • Description for Shinetsu X-23-8038

    Shinetsu X-23-8038 is a 1 Part Addition cure 0.11% Grease used to Gap Fill

    *See Terms of Use Below

    Application Type Thermal interface gap filler, Grease
    1 Part or 2 Part 1 Part
    Material Form Grease
    Industry Electronics applications requiring thermal dissipation
    Manufacturer Shinetsu
    Chemistry 0.11%, Low Molecular Weight Siloxane Stripped, Liquid-dispensed Gap Filling Rubber
    Cure Method Addition cure
    Cure Temperature (°C) 120
    Cure Time (min) 60
    Viscosity (cPs) 177 (Pa·s)
    Color White
    High Temperature Resistance (°C) Low thermal resistance, 8 (mm2·K/W), 180
    Low Temperature Resistance (°C) -40
    Density (g/cm³) 3.470
  • Technical Data for Shinetsu X-23-8038

    Overview
    • Application Type
      • Gap Filler - Thermal interface gap filler
      • Lubricant - Grease
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Grease
    • Industry
      • Electronics - Electronics applications requiring thermal dissipation
    • Chemistry
      • Volatile Content - 0.11%
      • Other - Liquid-dispensed Gap Filling Rubber
      • Silicone - Low Molecular Weight Siloxane Stripped
    • Cure Method
      • Addition cure
    • Color
      • White
    Specifications
    Cure Specs
    Cure Temperature (°C) 120 Test Method
    Cure Time (min) 60 Test Method
    Viscosity (cPs) 177 (Pa·s) Test Method
    Bond Strength
    General Bond Strength (psi) High natural tackiness
    Material Resistance
    High Temperature Resistance (°C) Low thermal resistance, 8 (mm2·K/W), 180 Test Method
    Low Temperature Resistance (°C) -40 Test Method
    Conductivity
    Thermal Conductivity (W/m°K) Superior, 4.00 Test Method
    Hardness
    Reworkable Superior reworkability
    Other Properties
    Density (g/cm³) 3.470 Test Method
  • Best Practices

    Best Practices information currently not available.
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
120°C Values are not for specification purposes.
Cure Time Test Methods
Cure Time Test Method
60 min Values are not for specification purposes.
Viscosity Test Methods
Viscosity Test Method
177 (Pa·s) Values are not for specification purposes.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
Low thermal resistance
8 (mm2·K/W) Thermal Resistance, Values are not for specification purposes.
180°C Usable Temp., Values are not for specification purposes.
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-40°C Usable Temp., Values are not for specification purposes
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
Superior
4.00 W/m°K Values are not for specification purposes.
Density Test Methods
Density Temperature Test Method
3.470 g/cm³ 23°C Values are not for specification purposes.