Resin Designs TP-1560 Thermally Conductive Pad

Resin Designs TP-1560 Thermally Conductive Pad Datasheet
  • Description for Resin Designs TP-1560 Thermally Conductive Pad

    Thin thermal interface; fiberglass reinforced; one side tacky.

    *See Terms of Use Below

    Application Type Gap Pad
    1 Part or 2 Part 1 Part
    Material Form Pad
    Industry Heat sinks of power components
    Manufacturer Resin Designs
    Chemistry Silicone
    Cure Method Low Pressures
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB
  • Technical Data for Resin Designs TP-1560 Thermally Conductive Pad

    Overview
    • Application Type
      • Gap Pad
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Pad
    • Industry
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Low Pressures
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB
    Specifications
    Bond Strength
    Tear Strength (piw) 30 (lb/in)
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Conductivity
    Filler Alumina
    Dielectric Strength (V/mil) 250
    Thermal Conductivity (W/m°K) 1.10, Reinforced Thermally Conductive-cured silicone gel
    Volume Resistivity (O) 1e12 (ohms/cm)
    Hardness
    Flexibility Conformal
    Other Properties
    Specific Gravity 2.000
    Coefficient of Thermal Expansion (CTE) 590 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.
  • Best Practices for Resin Designs TP-1560 Thermally Conductive Pad

    *See Terms of Use Below

    1. Clean-Up

      The material can be removed easily and cleanly, with no special tools, for access.

  • Comparable Materials for Resin Designs TP-1560 Thermally Conductive Pad

    *See Terms of Use Below

    Spec Engine® Results

    Closest Results from this Manufacturer

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