

-
Description for Resin Designs TP-1560 Thermally Conductive Pad
Thin thermal interface; fiberglass reinforced; one side tacky.Chemical Resistance Good Application Type Gap Pad 1 Part or 2 Part 1-Part Material Form Pad Industry Heat sinks of power components Manufacturer Resin Designs Chemistry Silicone Cure Method Low Pressures Color Gray Ozone Resistance Ozone resistance High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -40 Volume Resistivity (O) 1e12 (ohms/cm) Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB -
Technical Data for Resin Designs TP-1560 Thermally Conductive Pad
Overview
-
Chemical Resistance
- Chemical Resistance - Good
-
Application Type
- Gap Pad
-
1 Part or 2 Part
- 1-Part
-
Material Form
- Pad
-
Industry
- Electronics - Heat sinks of power components
- Industrial - Heat sources
-
Chemistry
-
Cure Method
- Pressure Sensitive (min) - Low Pressures
-
Color
- Gray
-
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 HB
Specifications
Bond Strength
Tear Strength (piw) 30 (lb/in) Material Resistance
Ozone Resistance Ozone resistance UV Resistance UV resistance High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -40 Conductivity
Filler Alumina Dielectric Strength (V/mil) 250 Thermal Conductivity (W/m°K) 1.10, Reinforced Thermally Conductive-cured silicone gel Volume Resistivity (O) 1e12 (ohms/cm) Hardness
Flexibility Conformal Other Properties
Specific Gravity 2.000 Coefficient of Thermal Expansion (CTE) 590 (Linear (micron/m °C or ppm )) Business Information
Shelf Life Details The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials. -
-
Best Practices for Resin Designs TP-1560 Thermally Conductive Pad
-
Clean-Up
The material can be removed easily and cleanly, with no special tools, for access.
-
-
Comparable Materials for Resin Designs TP-1560 Thermally Conductive Pad
Spec Engine® Results
Closest Results from this Manufacturer
Popular Articles
6 objects held together by adhesives you probably can't live without
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleTesting the effectiveness of surface treatments
Read ArticleElectrically Conductive Adhesives
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads


1 VIEW FREE
Don't Leave!
View Resin Designs - TP-1560 Thermally Conductive Pad now.