Dow Dowsil SE 1713 Adhesive

Dow Dowsil SE 1713 Adhesive Datasheet
  • Description for Dow Dowsil SE 1713 Adhesive

    One-part, beige, flowable adhesive with high tensile strength.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Gaskets, Adhesive
    1 Part or 2 Part 1 Part
    Material Form Liquid
    Substrate Ceramics, Glass, Many Reactive Metals, Selected Plastics, Aluminum, Selected Resins
    Industry Fixturing parts to printed circuit board, Reinforcing or fixing parts of connectors, Electronic components, Flyback transformer, Sealing housings for ECUs, Electronic modules, Electronics parts, Sealing power modules
    Manufacturer Dow
    Chemistry Silicone, No added solvents
    Cure Method Heat, Addition Cure
    Cure Temperature (°C) Faster or lower, 20 to 25, >100, 150, 70
    Cure Time (min) 30, 30
    Viscosity (cPs) 91,200, Flowable, Self-leveling
    Color Beige
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil SE 1713 Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Electronic Control Unit - Sealing housings for ECUs
      • Electronics - Electronic components, Electronic modules, Electronics parts, Sealing power modules
      • Printed Circuit Board (PCB) - Fixturing parts to printed circuit board
      • Connectors - Reinforcing or fixing parts of connectors
      • Transformers - Flyback transformer
      • Industrial - Condensers, Housing seals, Sealing lids
    • Chemistry
    • Application Method
      • Dispenser - Automated or manual needle dispense
    • Cure Method
      • Addition cure
      • Heat
    • Color
      • Brown - Beige
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) Faster or lower, 20 to 25, >100, 150, 70 Test Method
    Cure Time (min) 30, 30 Test Method
    Viscosity (cPs) 91,200, Flowable, Self-leveling
    Tack Free Time (min) Fast Test Method
    Work / Pot Time (min) Long Test Method
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 740, 790, 830, 700 Test Method
    Tensile Strength (psi) 1,080, High
    Material Resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200 Test Method
    Low Temperature Resistance (°C) -45, -55 Test Method
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00300 Test Method
    Dielectric Strength (V/mil) Good, Durable, 725 Test Method
    Dielectric Constant 3.00 Test Method
    Volume Resistivity (O) 8.66 E+15 (ohm*cm) Test Method
    Hardness
    Shore A Hardness 61 Test Method
    Elongation (%) 205
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.270 Test Method
    Business Information
    Shelf Life Details Dow heat-cure adhesives should be stored at or below 25°C (77°C). Containers should be kept tightly closed and kept in cold storage at all times to extend shelf life. Shelf life is indicated by the “Use Before” date found on the product label.
    Shelf Life Temperature (°F) 41, 77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 8
    Not Good For
    Don't Use With Rubber, Non-reactive metal substrates, Non-reactive plastic surfaces, Teflon®, Polyethylene, Polypropylene, Plastic or Rubber Substrates that are Highly Plasticized
  • Best Practices for Dow Dowsil SE 1713 Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Solvents such as acetone or isopropyl alcohol (IPA) do not tend to remove oils well, and any oils remaining on the surface may interfere with adhesion. Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful. Some cleaning techniques may provide better results than others

      users should determine the best techniques for their particular applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid containers after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio (1:1 or 10:1) either by weight or volume. The presence of light colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg for 10 minutes or until bubbling subsides.

    4. Curing

      Heat cure (addition-curing) adhesives are typically cured at 100°C (212°F) or higher. Their cure rate is rapidly accelerated with heat (see cure schedules in table) and an optimum cure schedule will balance processing performance and costs. For thicker sections or if voiding is observed the use of a 30-minute pre-cure at 70°C (158°F) or the use of an adhesive with low-void technology may reduce voids. Addition-cure silicones are formulated with all necessary ingredients for cure and there are no by-products generated during the cure process. Deep-section or confined cures are possible as cure reactions progress evenly throughout the material.

    5. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength test is desired. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or can detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
Faster or lower
20 to 25°C
>100°C
150°C Heat Cure
70°C Pre-Cure
Cure Time Test Methods
Cure Time Test Method
30 min Heat Cure
30 min Pre-Cure
Tack Free Time Test Methods
Tack Free Time Tack Free Temperature
Fast
Work / Pot Time Test Methods
Work / Pot Time Temperature
Long
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
740 psi Lap shear strength Unprimed Adhesion
790 psi Lap Shear Strength Aluminum Unprimed Adhesion
830 psi Lap Shear Strength Glass Unprimed Adhesion
700 psi Lap Shear Strength FR4 Unprimed Adhesion
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
200°C Operational
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-45°C Operational
-55°C Operational
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.00 @ 1MHz (JIS K 6249)
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good
Durable
725 V/mil JIS K 6249
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00300 @ 1MHZ (JIS K 6249)
Volume Resistivity Test Methods
Volume Resistivity Test Method
8.66 E+15 (ohm*cm) JIS K 6249
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
61 Durometer (JIS)
Specific Gravity Test Methods
Specific Gravity Test Method
1.270 Cured