Dow Dowsil SE 4490 CV Thermally Conductive Compound

Dow Dowsil SE 4490 CV Thermally Conductive Compound Datasheet
  • Description for Dow Dowsil SE 4490 CV Thermally Conductive Compound

    • One part • Non-flowing • Good thermal conductivity • Controlled silicone volatility • White • Heat flow away from PCB system components can increase reliability

    *See Terms of Use Below

    Brand Dowsil
    Application Type Grease
    1 Part or 2 Part 1 Part
    Material Form Grease
    Industry Electronic heat sources, Chassis, PCB system components, Efficient thermal transfer for the cooling of driver IC’s for displays, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electronics, PCB system assembly device, Heat sinks, Thermal management of PCB system assemblies, Efficient thermal transfer for the cooling of automotive control modules, Efficient thermal transfer for the cooling of power supplies, Electrical device, Consumer devices, Cooler device
    Manufacturer Dow
    Chemistry Silicone
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) 520,000, Non-flowing, Low bleed
    Color White
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    Relative Solvent Resistance Chemical Resistance: Resistance to minimal solvent exposure, Chemical Resistance: Resistance to intermittent solvent exposure
    High Temperature Resistance (°C) 200, 0.77 (°C*cm2/W), High-temperature stability
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow Dowsil SE 4490 CV Thermally Conductive Compound

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Grease
    • Industry
      • Chassis
      • E-Mobility Solutions
      • Electronics - Electronic heat sources, Heat sinks, Efficient thermal transfer for the cooling of automotive control modules, Efficient thermal transfer for the cooling of power supplies, Electrical device, Consumer devices, Cooler device
      • Printed Circuit Board (PCB) - PCB system components, PCB system assembly device, Thermal management of PCB system assemblies
      • Electronic Displays - Efficient thermal transfer for the cooling of driver IC’s for displays
      • Smart Meters
      • Smart Home Devices
      • Industrial - Gap fill
    • Chemistry
      • Volatile Content: VOC - Controlled silicone volatility
      • Silicone
    • Application Method
      • Dispenser - Automated dispensing, Manual dispensing
    • Cure Method
      • None - Non-curing
    • Color
      • White
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) 520,000, Non-flowing, Low bleed
    Thixotropic 2.3, Thixotropy
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    Relative Solvent Resistance Chemical Resistance: Resistance to minimal solvent exposure, Chemical Resistance: Resistance to intermittent solvent exposure
    Relative Solvent Resistance Chemical Resistance: Resistance to minimal solvent exposure, Chemical Resistance: Resistance to intermittent solvent exposure
    UV Resistance UV resistance
    High Temperature Resistance (°C) 200, 0.77 (°C*cm2/W), High-temperature stability Test Method
    Low Temperature Resistance (°C) -45, -55
    Conductivity
    Filler Heavily filled with heat-conductive metal oxides.
    Dielectric Strength (V/mil) Durable, 100
    Thermal Conductivity (W/m°K) Thermally Conductive, 1.90
    Volume Resistivity (O) 2E+14 (ohms/cm)
    Other Properties
    Specific Gravity 2.630 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 11
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
  • Best Practices for Dow Dowsil SE 4490 CV Thermally Conductive Compound

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    3. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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    *See Terms of Use Below

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High Temperature Resistance Test Methods
High Temperature Resistance Test Method
200°C Thermal Resistance at 40 psi
0.77 (°C*cm2/W)
High-temperature stability
Specific Gravity Test Methods
Specific Gravity Test Method
2.630 Uncured