Dow TC-5021 Thermally Conductive Compound

CONTACT REP

Description for Dow TC-5021 Thermally Conductive Compound

Non-curing, thermally conductive silicone paste; low thermal resistance; high thermal conductivity.

Chemical Resistance	Good
Application Type	Grease
1 Part or 2 Part	1-Part
Material Form	Grease
Industry	Electronics, Thermal interface for CPUs, Smart Meters, E-Mobility Solutions, Chassis, Smart Home Devices, Heat sink
Manufacturer	Dow
Chemistry	Polydimethylsiloxane, Silicone
Cure Temperature (°C)	20 to 25
Viscosity (cPs)	82,650
Color	Gray
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	200, High- Temperature Stability
Low Temperature Resistance (°C)	-45, -55, Low thermal resistance
Volume Resistivity (O)	3.7E+11 (ohms/cm)

Best Practices for Dow TC-5021 Thermally Conductive Compound

Register for FREE to view more details

Why register?

View Technical Details
View Test Methods
View Key Specifications
View Similar Materials
Save your Project Searches

See what Gluespec offers

Sign up now Already registered? Sign in!

Email: *

Password: *

Confirm Password: *

Do you prefer to see data in °F or °C?

First Name: *

Last Name: *

Phone: *

Company Name: *

Address: *

Postal Code: *

Country: *

Job Function: *

Industry: *

Describe: *

I agree to the terms of use *

*: Required

Technical Data for Dow TC-5021 Thermally Conductive Compound

*See Terms of Use Below

Overview

Chemical Resistance
- Chemical Resistance - Good
Application Type
- Lubricant - Grease
1 Part or 2 Part
- 1-Part
Material Form
- Grease
Industry
- Storage & Graphics - Thermal interface for CPUs
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Chassis
- Electronics - Heat sink
- Industrial - Gap fill
Chemistry
- Other - Polydimethylsiloxane
- Silicone
Application Method
- Dispenser
- Screen Print - Stencil print
Cure Method
- None - Non-curing
Color
- Gray

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25
Viscosity (cPs)	82,650

Material Resistance

Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
High Temperature Resistance (°C)	200, High- Temperature Stability
Low Temperature Resistance (°C)	-45, -55, Low thermal resistance

Conductivity

Dissipation Factor	0.06000	Test Method
Filler	Heat conductive metal oxides
Dielectric Strength (V/mil)	Durable, Low, 125
Dielectric Constant	8.10	Test Method
Thermal Conductivity (W/m°K)	High, 3.30	Test Method
Volume Resistivity (O)	3.7E+11 (ohms/cm)

Other Properties

Specific Gravity	3.470

Business Information

Shelf Life Details	Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers., Shelf Life Details
Shelf Life Type	From date of manufacture, From the date of manufacture
Shelf Life (mon)	24, 12

Not Good For

Don't Use With	non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.

Best Practices for Dow TC-5021 Thermally Conductive Compound

*See Terms of Use Below
1. Surface Preparation
  
  All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
2. Curing
  
  The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.
3. Testing
  
  Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.
Comparable Materials for Dow TC-5021 Thermally Conductive Compound

*See Terms of Use Below

Spec Engine^® Results
- Dowsil 340 Heat Sink Compound(Dow)
  One-Part, White, Moderate thermal conductivity compound. Suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks.
- Dowsil SE 4490 CV Thermally Conductive Compound(Dow)
  • One part • Non-flowing • Good thermal conductivity • Controlled silicone volatility • White • Heat flow away from PCB system components can increase reliability
- CircuitWorks Silver Conductive Grease(Chemtronics (ITW))
  • High electrical conductivity • Excellent thermal conductivity • Provides protection against wear • Protects against moisture and corrosion • Very low viscosity vs. temperature change • Lubrication of Substation Switches orCircuit Breakers • Heat Dissipation from Transformers • Low or Medium Speed SlidingContacts • Static Grounding on Seals or O-Rings • Extending the Life of RotatingSwitches
- Compare All