Dow TC-5021 Thermally Conductive Compound

Dow TC-5021 Thermally Conductive Compound Datasheet
  • Description for Dow TC-5021 Thermally Conductive Compound

    Non-curing, thermally conductive silicone paste; low thermal resistance; high thermal conductivity.

    *See Terms of Use Below

    Application Type Grease
    1 Part or 2 Part 1 Part
    Material Form Grease
    Industry Electronics, Thermal interface for CPUs, Chassis, E-Mobility Solutions, Smart Meters, Smart Home Devices, Heat sink
    Manufacturer Dow
    Chemistry Silicone, Polydimethylsiloxane
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) 82,650
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200, High- Temperature Stability
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance
  • Technical Data for Dow TC-5021 Thermally Conductive Compound

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Grease
    • Industry
      • Chassis
      • E-Mobility Solutions
      • Electronics - Heat sink
      • Storage & Graphics - Thermal interface for CPUs
      • Smart Meters
      • Smart Home Devices
      • Industrial - Gap fill
    • Chemistry
    • Application Method
      • Dispenser
      • Screen Print - Stencil print
    • Cure Method
      • None - Non-curing
    • Color
      • Gray
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25
    Viscosity (cPs) 82,650
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 200, High- Temperature Stability
    Low Temperature Resistance (°C) -45, -55, Low thermal resistance
    Conductivity
    Dissipation Factor 0.06000 Test Method
    Filler Heat conductive metal oxides
    Dielectric Strength (V/mil) Durable, Low, 125
    Thermal Conductivity (W/m°K) High, 3.30 Test Method
    Dielectric Constant 8.10 Test Method
    Volume Resistivity (O) 3.7E+11 (ohms/cm)
    Other Properties
    Specific Gravity 3.470
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers., Shelf Life Details
    Shelf Life Type From date of manufacture, From the date of manufacture
    Shelf Life (mon) 24, 12
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
  • Best Practices for Dow TC-5021 Thermally Conductive Compound

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    3. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Thermal Conductivity Test Methods
Thermal Conductivity Temperature
High 25°C
3.30 W/m°K
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.06000 1 kHz
Dielectric Constant Test Methods
Dielectric Constant Test Method
8.10 1 kHz