Shinetsu X-23-7868-2D

Shinetsu X-23-7868-2D Datasheet
  • Description for Shinetsu X-23-7868-2D

    Shinetsu X-23-7868-2D is a 1 Part Solvent Solvent diluted Grease used to Lubricate

    *See Terms of Use Below

    Application Type Thermal interface grease
    1 Part or 2 Part 1 Part
    Material Form Grease
    Industry Heat sinks requiring high thermal conductivity, Semiconductor elements requiring high thermal conductivity, CPUs, MPUs
    Manufacturer Shinetsu
    Chemistry Solvent diluted, 2.7%, Low Molecular Weight Siloxane Stripped
    Cure Method Solvent
    Viscosity (cPs) 100 (Pa·s)
    Color Gray
    High Temperature Resistance (°C) 7 (mm2·K/W), 120
    Low Temperature Resistance (°C) -50
    Density (g/cm³) 2.500
  • Technical Data for Shinetsu X-23-7868-2D

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Grease
    • Industry
      • Semiconductor - Semiconductor elements requiring high thermal conductivity
      • Heat sink - Heat sinks requiring high thermal conductivity
      • Storage & Graphics - MPUs, CPUs
    • Chemistry
      • Volatile Content - 2.7%
      • Other - Solvent diluted
      • Silicone - Low Molecular Weight Siloxane Stripped
    • Cure Method
      • Solvent
    • Color
      • Gray
    Specifications
    Cure Specs
    Viscosity (cPs) 100 (Pa·s) Test Method
    Material Resistance
    High Temperature Resistance (°C) 7 (mm2·K/W), 120 Test Method
    Low Temperature Resistance (°C) -50 Test Method
    Conductivity
    Thermal Conductivity (W/m°K) Exceptional, 6.20 Test Method
    Other Properties
    Density (g/cm³) 2.500 Test Method
  • Best Practices

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Viscosity Test Methods
Viscosity Test Method
100 (Pa·s) Values are not for specification purposes.
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-50°C Usable Temp., Values are not for specification purposes.
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
7 (mm2·K/W) Thermal Resistance, Values are not for specification purposes.
120°C Usable Temp., Values are not for specification purposes.
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
Exceptional
6.20 W/m°K Values are not for specification purposes.
Density Test Methods
Density Temperature Test Method
2.500 g/cm³ 23°C Values are not for specification purposes.