-
Description for Elantas (Altana) Conap MR-5012
It is a low viscosity, silicone- based liquid mold release and parting agent, releases epoxy, polyurethane, polyester and most plastic resins from metal, plastic or other non-porous molds.Brand Cytec, Conap Application Type Mold Release, Parting agent 1 Part or 2 Part 1 Part Material Form Liquid Substrate Other non-porous molds, Metal, Plastic, Polyester, Polyurethane, Epoxy , Most plastic Resin Manufacturer Elantas (Altana) Chemistry Silicone-based Cure Method Heat Cure Temperature (°C) 20 to 25 Room Temperature Viscosity (cPs) Low, 20 Color Water-white, Water-white Can Be Used In Conjunction With These Materials Room temperature or heat curing systems
Popular Articles
Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read Article
Testing the effectiveness of surface treatments
Read Article
6 objects held together by adhesives you probably can't live without
Read Article
Electrically Conductive Adhesives
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read Article
Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read Article
Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read Article
Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads
Viscosity Test Methods
| Viscosity | Temperature |
|---|---|
| Low | |
| 20 cPs | 25°C |
Flash Point Test Methods
| Flash Point | Test Method |
|---|---|
| -0.4°F | ASTM D93, Material as Supplied |
Specific Gravity Test Methods
| Specific Gravity | Temperature | Test Method |
|---|---|---|
| 0.670 | 25°C | Material as Supplied |
% Solids Test Methods
| % Solids | Test Method |
|---|---|
| 8 % | Solids Content, Material as Supplied |
