Bostik SGH0007-01 Datasheet Bostik SGH0007-01

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  • Description for Bostik SGH0007-01

    SFA Urethane Solid

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

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    Application Type Wrapping
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Manufacturer Bostik
    Chemistry SFA urethane solid
    Cure Method Room temperature cure
    Cure Temperature (°C) 73
    Viscosity (cPs) 15,000
    Color Green
    Density (g/cm³) 1.1 (g/cc)

  • Technical Data for Bostik SGH0007-01

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    Overview
    • Application Type
      • Other - Wrapping
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Industry
      • Other - Profile wrapping
    • Chemistry
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
    • Color
      • Green
    Specifications
    Cure Specs
    Cure Temperature (°C) 73 Test Method
    Viscosity (cPs) 15,000 Test Method
    Set Time (min) Seconds Test Method
    Work / Pot Time (min) Minutes Test Method
    Green Strength Time (min) High
    Bond Strength
    Green Strength (psi) High
    Other Properties
    Density (g/cm³) 1.1 (g/cc) Test Method

  • Best Practices

    Best Practices information currently not available.

  • Comparable Materials for Bostik SGH0007-01

    *See Terms of Use Below

    Spec Engine® Results

    • 3M
      Plastic Bonding Adhesive 2665(3M)

      One-component, moisture curing, urethane adhesive that is applied warm. This low viscosity adhesive has a long open time and is ideal for bonding plastics.

    • Hernon
      HASA 66071(Hernon)

      A single component structural anaerobic adhesive formulated for bonding rigid assemblies at high temperatures.

    • Hernon
      HASA 722(Hernon)

      A single-component, anaerobic, structural adhesive designed for bonding rigid assemblies.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
73°C @ 50% relative humidity
Set Time Test Methods
Set Time Test Method
Seconds The minimum amount of time required between when the bond was formed and when it will support a 5 lb. load. ASTM D638 Die C
Viscosity Test Methods
Viscosity Temperature
15,000 cPs 121°C
Work / Pot Time Test Methods
Work / Pot Time Test Method
Minutes ASTM D4497-84
Density Test Methods
Density Temperature
1.1 (g/cc) 25°C