Resin Designs TP-2160 Thermally ConDuctive Pad

Resin Designs TP-2160 Thermally ConDuctive Pad Datasheet
  • Description for Resin Designs TP-2160 Thermally ConDuctive Pad

    Gap filler interface; foam-based thermal gel; one side tacky.

    *See Terms of Use Below

    Application Type Thermally ConDuctive Pad , Low mounting
    1 Part or 2 Part 1 Part
    Material Form Pad
    Industry Heat sinks of power components
    Manufacturer Resin Designs
    Chemistry Silicone
    Cure Method Pressure Sensitive
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB
  • Technical Data for Resin Designs TP-2160 Thermally ConDuctive Pad

    Overview
    • Application Type
      • Other - Low mounting, Thermally ConDuctive Pad
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Pad
    • Industry
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94 HB
    Specifications
    Bond Strength
    General Bond Strength (psi) Tacky
    Tensile Strength (psi) 40
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Conductivity
    Filler Alumina
    Dielectric Strength (V/mil) 250
    Thermal Conductivity (W/m°K) 0.70
    Volume Resistivity (O) 1e11 (ohms/cm)
    Hardness
    Elongation (%) 2
    Shore OO Hardness 60
    Flexibility Conformal
    Other Properties
    Specific Gravity 1.900
    Coefficient of Thermal Expansion (CTE) 380 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.
  • Best Practices for Resin Designs TP-2160 Thermally ConDuctive Pad

    *See Terms of Use Below

    1. Clean-Up

      The material can be removed easily and cleanly, with no special tools, for access.

  • Comparable Materials for Resin Designs TP-2160 Thermally ConDuctive Pad

    *See Terms of Use Below

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