Dow 3-8264 Primerless Silicone Adhesive

Dow 3-8264 Primerless Silicone Adhesive Datasheet
  • Description for Dow 3-8264 Primerless Silicone Adhesive

    Two part; 1:1 mix; heat cure; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; repairable; good dielectric properties.

    Note: This material has been discontinued. Please view the Manufacturer's Recommended Replacement tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Encapsulate, Bond
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Industry Electronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free, Silicone elastomer
    Cure Method Heat, Part A/Part B
    Cure Temperature (°C) 70, 115
    Viscosity (cPs) 2,900, Flowable
    Color Black
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
  • Technical Data for Dow 3-8264 Primerless Silicone Adhesive

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
    • Chemistry
    • Application Method
      • Dispenser - Automated mixing, Dispensing equipment, Manual mixing
    • Cure Method
      • Heat
      • 2-Part Cure - Part A/Part B
    • Color
      • Black
    Specifications
    Cure Specs
    Cure Temperature (°C) 70, 115 Test Method
    Viscosity (cPs) 2,900, Flowable
    Linear Shrinkage (%) Minimal shrinkage
    Work / Pot Time (min) 300 Test Method
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Bond Strength
    Shear Strength (psi) 385 Test Method
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00700, <0.00100 Test Method
    Dielectric Strength (V/mil) Good, 21,456,693, Durable
    Dielectric Constant 3.11, 3.05 Test Method
    Thermal Conductivity (W/m°K) 0.35, 0.35
    Volume Resistivity (O) 3.5e14 (ohms/cm)
    Hardness
    Shore A Hardness 45
    Other Properties
    Specific Gravity 1.320
    Coefficient of Thermal Expansion (CTE) 290 (Linear (micron/m °C or ppm ))
    Flash Point (°F) 285.8
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 9
  • Best Practices for Dow 3-8264 Primerless Silicone Adhesive

    *See Terms of Use Below

    1. Surface Preparation

      In applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide or the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the Dow Corning literature, “How To Use Dow Corning Primers and Adhesion Promoters” (Form No. 10-366) and in the information sheets specific to the individual primers.

    2. Mixing

      Dow Corning silicone 1:1 encapsulants are supplied in two parts that do not require lot matching. The 1:1 mix ratio, by weight or volume, simplifies the proportioning process. To ensure uniform distribution of filler, Parts A and B must each be thoroughly mixed prior to their combination in a 1:1 ratio. When thoroughly blended, the Part A and B liquid mixture should have a uniform appearance. The presence of light-colored streaks or marbling indicates inadequate mixing and will result in incomplete cure. Due to the fast-curing characteristics of some encapsulants included in this data sheet, automated mix and dispense equipment should be utilized.

    3. Deairing/Degassing

      In applications sensitive to air entrapment, deairing with 28 to 30 inches Hg vacuum is required.

    4. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

  • Manufacturer's Recommended Replacement Materials

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
70°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
115°C For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at cure temeprature.
Cure Time Test Methods
Cure Time Test Method
Work / Pot Time Test Methods
Work / Pot Time Temperature
300 min Room temperature
Shear Strength Test Methods
Shear Strength Type
385 psi Lap shear strength
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.11 Dielectric constant, 100 Hz
3.05 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00700 Dissipation factor, 100 Hz
<0.00100 Dissipation factor, 100 KHz