

-
Description for Dow 96-082 A & B Encapsulant
Two part; 1:1 mix; RT/HA cure; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; repairable; good dielectric properties; deep section cure; flexible elastomer.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Chemical Resistance Good Application Type Pot, Encapsulate 1 Part or 2 Part 2-Part Material Form Liquid, Silicone elastomer Industry Electronics Manufacturer Dow Chemistry Silicone, Solvent-free, Silicone elastomer Cure Method Part A/Part B, RT/HA Cure Temperature (°C) 150 Cure Time (min) 30 Viscosity (cPs) Very low, 1,100, Flowable Color Black Ozone Resistance Ozone resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 9.5e15 (ohms/cm) Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0 -
Technical Data for Dow 96-082 A & B Encapsulant
Overview
-
Chemical Resistance
- Chemical Resistance - Good
-
Application Type
- Pottant / Encapsulant - Pot, Encapsulate
-
1 Part or 2 Part
- 2-Part
-
Material Form
- Elastomer - Silicone elastomer
- Liquid
-
Industry
-
Chemistry
- Solvent-Free
- Silicone - Silicone elastomer
-
Application Method
- Dispenser - Automated mixing, Dispensing equipment, Manual mixing
-
Cure Method
- 2-Part Cure - Part A/Part B, RT/HA
-
Color
- Black
-
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
Specifications
Cure Specs
Cure Temperature (°C) 150 Test Method Cure Time (min) 30 Test Method Viscosity (cPs) Very low, 1,100, Flowable Linear Shrinkage (%) Minimal shrinkage Work / Pot Time (min) Long, 20,160 Test Method Mix Ratio 1:1 (by volume), 1:1 (by weight) Material Resistance
Ozone Resistance Ozone resistance UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.00500, <0.00100 Test Method Dielectric Strength (V/mil) Good, 19,685,039, Durable Dielectric Constant 3.14, 3.12 Test Method Thermal Conductivity (W/m°K) 0.30, 0.30 Volume Resistivity (O) 9.5e15 (ohms/cm) Hardness
Shore A Hardness 31 Flexibility Flexible Other Properties
Specific Gravity 1.210 Coefficient of Thermal Expansion (CTE) 285 (Linear (micron/m °C or ppm )) Business Information
Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Shelf Life Type From date of manufacture Shelf Life (mon) 12 -
-
Best Practices for Dow 96-082 A & B Encapsulant
-
Surface Preparation
In applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide or the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the Dow Corning literature, “How To Use Dow Corning Primers and Adhesion Promoters” (Form No. 10-366) and in the information sheets specific to the individual primers.
-
Mixing
Dow Corning silicone 1:1 encapsulants are supplied in two parts that do not require lot matching. The 1:1 mix ratio, by weight or volume, simplifies the proportioning process. To ensure uniform distribution of filler, Parts A and B must each be thoroughly mixed prior to their combination in a 1:1 ratio. When thoroughly blended, the Part A and B liquid mixture should have a uniform appearance. The presence of light-colored streaks or marbling indicates inadequate mixing and will result in incomplete cure. Due to the fast-curing characteristics of some encapsulants included in this data sheet, automated mix and dispense equipment should be utilized.
-
Deairing/Degassing
In applications sensitive to air entrapment, deairing with 28 to 30 inches Hg vacuum is required.
-
Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
-
-
Comparable Materials for Dow 96-082 A & B Encapsulant
Spec Engine® Results
Popular Articles
Staking materials and properties
Read ArticleWhat Are the Differences Between Adhesives and Sealants?
Read ArticleInfographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation
Read ArticleTesting the effectiveness of surface treatments
Read ArticleSponsored Articles
Unique Advantages of Contact Adhesives
Read ArticleUsing LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials
Read ArticleSylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:
Read ArticleCase Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive
Read ArticleFeatured Ads

Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
150°C | These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature. |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
30 min | These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature. |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
---|---|
Long | |
20,160 min | Room temperature |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
3.14 | Dielectric constant, 1 Hz |
3.12 | Dielectric constant, 1 KHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|---|
0.00500 | Dissipation factor, 100 Hz |
<0.00100 | Dissipation factor, 100 KHz |