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Description for Dow Dowsil 3-4150 Dielectric Gel
A two-part, transparent green, 1:1 mix ratio, fast RT cure gelBrand Dowsil Application Type Encapsulating, Seal, Potting 1 Part or 2 Part 2-Part Material Form Gel Industry Circuits, Smart Meters, E-Mobility Solutions, Smart Home Devices, Electronics, Optoelectronics, Interconnections Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method 2-Part Cure, Room temperature cure Cure Temperature (°C) 20 to 25 RT, 25 Cure Time (min) Fast, 90 Viscosity (cPs) 475 Color Transparent green, Transparent green High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 7.0 E+15 (ohm*cm) Stress Relief Stress relief Light Refractive Index (RI) High -
Technical Data for Dow Dowsil 3-4150 Dielectric Gel
Overview
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Application Type
- Pottant / Encapsulant - Potting, Encapsulating
- Sealant - Seal
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1 Part or 2 Part
- 2-Part
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Material Form
- Gel
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Industry
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Electronics - Circuits, Optoelectronics, Interconnections
- Industrial - Delicate components
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Chemistry
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Application Method
- Dispenser - Dispensed manually, Meter mix equipment, Automated dispensing equipment
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Cure Method
- Room Temperature / Air Dry - Room temperature cure
- 2-Part Cure
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Color
- Clear / Transparent - Transparent green
- Green - Transparent green
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25 RT, 25 Test Method Cure Time (min) Fast, 90 Test Method Viscosity (cPs) 475 Test Method Mix Ratio 1:1 (by volume) Material Resistance
High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture resistance Conductivity
Dissipation Factor 0.00200, 0.00010 Test Method Dielectric Strength (V/mil) Excellent, 375, Electrical insulation Test Method Dielectric Constant 2.85, 2.85 Test Method Volume Resistivity (O) 7.0 E+15 (ohm*cm) Test Method Hardness
Stress Relief Stress relief Flexibility Flexibility, Resilient Other Properties
Light Refractive Index (RI) High Specific Gravity 0.970 Test Method Coefficient of Thermal Expansion (CTE) 400 (Linear (micron/m °C or ppm )) Business Information
Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label. Shelf Life Temperature (°F) 77 Shelf Life Type from date of manufacture Shelf Life (mon) 12 Not Good For
Don't Use For Sulfur, Polysulfones, Unsaturated hydrocarbon plasitcizers, Chemicals, Organotin, Silicone rubber containing organotin catalyst, Polysulfides, Other sulfur containing materials, Some solder flux residues, Curing agents, Organometallic compounds Don't Use With Certain materials, Plasticizers -
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Best Practices for Dow Dowsil 3-4150 Dielectric Gel
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Application
Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
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Mixing
Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics.
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Deairing/Degassing
If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher viscosity and faster-curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
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Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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Comparable Materials for Dow Dowsil 3-4150 Dielectric Gel
Spec Engine® Results
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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20 to 25°C RT | |
25°C | These values are not intended for use in preparing specifications. |
Cure Time Test Methods
Cure Time | Test Method |
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Fast | |
90 min | These values are not intended for use in preparing specifications. |
Set Time Test Methods
Set Time | Set Temperature | Test Method |
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Viscosity Test Methods
Viscosity | Test Method |
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475 cPs | Mixed, These values are not intended for use in preparing specifications. |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
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Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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2.85 | At 100 Hz, These values are not intended for use in preparing specifications. |
2.85 | At 100 kHz, These values are not intended for use in preparing specifications. |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
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Excellent | |
375 V/mil | These values are not intended for use in preparing specifications. |
Electrical insulation |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00200 | At 100 hz, These values are not intended for use in preparing specifications. |
0.00010 | At 100 kHz, These values are not intended for use in preparing specifications. |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
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7.0 E+15 (ohm*cm) | These values are not intended for use in preparing specifications. |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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0.970 | Cured, These values are not intended for use in preparing specifications. |