Dow Dowsil 3-4207 Dielectric Tough Gel

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Description for Dow Dowsil 3-4207 Dielectric Tough Gel

Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

*See Terms of Use Below

Brand	Dowsil
Application Type	Encapsulant, Sealant, Pottant
1 Part or 2 Part	2-Part
Material Form	Gel (Post-cure), Liquid (Pre-cure)
Industry	Circuits, LEDs, Smart Meters, E-Mobility Solutions, Smart Home Devices, Insulation, Headlamp assemblies, Electronics, Optoelectronics
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	Part A/Part B
Cure Temperature (°C)	20 to 25 Room Temperature, 25, 50, 75, 100
Cure Time (min)	Fast, 90, 10, 5.00, 3.00
Viscosity (cPs)	Low
Fluorescent	UV indicator allows for automated inspection
Color	Translucent green, Translucent green
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	7.1E+13 (ohms/cm)
Durability	Tough
Light Refractive Index (RI)	High
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1

Best Practices for Dow Dowsil 3-4207 Dielectric Tough Gel

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Technical Data for Dow Dowsil 3-4207 Dielectric Tough Gel

*See Terms of Use Below

Overview

Application Type
- Pottant / Encapsulant - Encapsulant, Pottant
- Sealant
1 Part or 2 Part
- 2-Part
Material Form
- Liquid - Liquid (Pre-cure)
- Gel - Gel (Post-cure)
Industry
- LED (Light-Emitting Diodes) - LEDs
- Smart Meters
- Smart Home Devices
- E-Mobility Solutions
- Headlamp - Headlamp assemblies
- Electronics - Circuits, Optoelectronics
- Insulation
Chemistry
- Solvent-Free
- Silicone
Application Method
- Dispenser - Automated dispensing equipment
Cure Method
- 2-Part Cure - Part A/Part B
Color
- Translucent - Translucent green
- Green - Translucent green
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V-1 - UL 94 V-1
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25 Room Temperature, 25, 50, 75, 100	Test Method
Cure Time (min)	Fast, 90, 10, 5.00, 3.00	Test Method
Viscosity (cPs)	Low
Fluorescent	UV indicator allows for automated inspection
Mix Ratio	1:1 (by volume)

Bond Strength

Peel Strength (piw)	3 (ppi)	Test Method

Material Resistance

Flame Resistance	Good flame resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.03000, <0.00010	Test Method
Dielectric Strength (V/mil)	Excellent, 420
Dielectric Constant	2.85, 2.86	Test Method
Volume Resistivity (O)	7.1E+13 (ohms/cm)

Hardness

Durability	Tough
Shore A Hardness	9500 g	Test Method
Shore OO Hardness	59	Test Method
Flexibility	Flexible, Resilient

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	0.980	Test Method
Coefficient of Thermal Expansion (CTE)	325 (Linear (micron/m °C or ppm ))
Flash Point (°F)	190.4

Business Information

Shelf Life Details	Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.
Shelf Life Temperature (°F)	77
Shelf Life (mon)	12

Best Practices for Dow Dowsil 3-4207 Dielectric Tough Gel

*See Terms of Use Below
1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics.
2. Deairing/Degassing
  
  If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
3. Curing
  
  Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). The cure reaction begins when Parts A and B are mixed. As the cure progresses, viscosity increases until the material becomes a soft gel. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additioncure silicone gels may be RT and heat cure or exclusively heat cure. Adding heat accelerates the cure reaction. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application.
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
4. Removal
  
  In the manufacture of PCB system assemblies, salvage or rework of damaged or defective units is often required. Removal of DOWSIL™ dielectric gels to allow necessary repairs can be assisted by using DOWSIL™ OS fluids. Additional information regarding these products is available from Dow.
  
  Digestive stripping agents, such as SU100 from Silicones Unlimited, can also be used. In addition, if only one component needs to be replaced, a soldering iron may be applied directly through the gel to remove the component. After work has been completed, the repaired area should be cleaned with forced air or a brush, dried, and patched with additional silicone gel.
Comparable Materials for Dow Dowsil 3-4207 Dielectric Tough Gel

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Spec Engine^® Results
- Dowsil 3-4150 Dielectric Gel(Dow)
  A two-part, transparent green, 1:1 mix ratio, fast RT cure gel
- Dowsil 3-4170 Dielectric Gel(Dow)
  • Clear • Fast heat cure • Long working time and low viscosity aid process flexibility • Impregnation may be successful without vacuum
- Dowsil 3-6512 Elastomer(Dow)
  Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.
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