Dow Dowsil 3-6121 Low Temperature Elastomer

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Description for Dow Dowsil 3-6121 Low Temperature Elastomer

Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.

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Brand	Dowsil
Chemical Resistance	Good
Application Type	Pot, Encapsulate
1 Part or 2 Part	2-Part
Material Form	Liquid, Silicone elastomer
Industry	Electronics, Optical applications requiring high refractive index, PCB system applications, Smart Meters, E-Mobility Solutions, Electrical applications
Manufacturer	Dow
Chemistry	Silicone elastomer, Solvent-free
Cure Method	2-Part Cure, Heat
Cure Temperature (°C)	100, 150, 125
Cure Time (min)	20, 10, 20
Viscosity (cPs)	19,250, Flowable
Color	Translucent
Ozone Resistance	Ozone resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55, -65
Volume Resistivity (O)	4.15 E+14 (ohms/cm)
Light Refractive Index (RI)	Higher

Best Practices for Dow Dowsil 3-6121 Low Temperature Elastomer

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Technical Data for Dow Dowsil 3-6121 Low Temperature Elastomer

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Overview

Chemical Resistance
- Chemical Resistance - Good
Application Type
- Pottant / Encapsulant - Pot, Encapsulate
1 Part or 2 Part
- 2-Part
Material Form
- Elastomer - Silicone elastomer
- Liquid
Industry
- Optical - Optical applications requiring high refractive index
- Smart Meters
- E-Mobility Solutions
- Electronics - Electrical applications
- Printed Circuit Board (PCB) - PCB system applications
- Industrial - Low-temperature encapsulating applications
Chemistry
- Solvent-Free
- Silicone - Silicone elastomer
Application Method
- Dispenser - Automated metered mixing and dispensing
Cure Method
- Heat
- 2-Part Cure
Color
- Translucent
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	100, 150, 125	Test Method
Cure Time (min)	20, 10, 20	Test Method
Viscosity (cPs)	19,250, Flowable	Test Method
Linear Shrinkage (%)	Minimal shrinkage
Work / Pot Time (min)	>120	Test Method
Mix Ratio	10:1 (by volume), 10:1 (by weight)

Bond Strength

General Bond Strength (psi)	Good
Tear Strength (piw)	High, 60 (ppi)	Test Method
Tensile Strength (psi)	High, 625

Material Resistance

Ozone Resistance	Ozone resistance
UV Resistance	UV resistance
Environmental Resistance	Environmental resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55, -65
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.01000, <0.00100	Test Method
Dielectric Strength (V/mil)	Good, Durable, 450
Dielectric Constant	2.92, 2.92	Test Method
Thermal Conductivity (W/m°K)	0.18, 0.18
Volume Resistivity (O)	4.15 E+14 (ohms/cm)

Hardness

Shore A Hardness	34	Test Method
Elongation (%)	275
Flexibility	Flexible

Other Properties

Light Refractive Index (RI)	Higher
Specific Gravity	1.120	Test Method
Coefficient of Thermal Expansion (CTE)	290 (Linear (micron/m °C or ppm ))

Business Information

Shelf Life Details	Shelf life is indicated by the “Use Before” date found on the product label. For best results, Dow silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.
Shelf Life Temperature (°F)	77
Shelf Life (mon)	18

Not Good For

Don't Use For	Organotin and other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasitcizers, Some solder flux residues

Best Practices for Dow Dowsil 3-6121 Low Temperature Elastomer

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1. Surface Preparation
  
  Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.
  
  In applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide for the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.
2. Mixing
  
  Dow silicone encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/PCB system applications. The 10:1 mix ratio gives one latitude to tune the modulus and hardness for specific application needs and production lines.
3. Curing
  
  Dow silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule.
  
  Thoroughly mixed Dow silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Dow silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).
  
  Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer.
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
4. Removal
  
  In the manufacture of electrical/PCB system assemblies it is often desirable to salvage or reclaim damaged or defective units. With most non-silicone rigid potting/encapsulating materials, removal or entry is difficult or impossible without causing excessive damage to internal circuitry. Dow silicone encapsulants can be selectively removed with relative ease, any repairs or changes accomplished, and the repaired area repotted in place with additional product. To remove silicone elastomers, simply cut with a sharp blade or knife and tear and remove unwanted material from the area to be repaired.
  
  Sections of the adhered elastomer are best removed from substrates and circuitry by mechanical action such as scraping or rubbing and can be assisted by applying Dow brand OS Fluids. Before applying additional encapsulant to a repaired device, roughen the exposed surfaces of the cured encapsulant with an abrasive paper and rinse with a suitable solvent. This will enhance adhesion and permit the repaired material to become an integral matrix with the existing encapsulant. Silicone prime coats are not recommended for adhering products to themselves.
Comparable Materials for Dow Dowsil 3-6121 Low Temperature Elastomer

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Spec Engine^® Results
- Sylgard 184 Silicone Elastomer(Dow)
  Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.
- Sylgard 186 Silicone Elastomer(Dow)
  Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.
- Fortasun PV-7030R Potting Agent(Dow)
  Silicone potting material providing environmental protection and thermal management. Supplied as two-part liquid component kits comprised of Part A/Part B to be mixed in a 1:1 ratio by weight.
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