Dow Dowsil 3-6635 Dielectric Gel

Dow Dowsil 3-6635 Dielectric Gel Datasheet
  • Description for Dow Dowsil 3-6635 Dielectric Gel

    Extremely soft to medium hardness, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wider temperature range than the other types of gels.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Encapsulants
    1 Part or 2 Part 1 Part
    Material Form Gel
    Industry Optoelectronics, PCB system assemblies, Smart Meters, E-Mobility Solutions, Smart Home Devices
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Heat
    Cure Temperature (°C) 100, 125, 150, 100
    Cure Time (min) 48, 7, 6, 120
    Viscosity (cPs) Low, 700
    Color Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data for Dow Dowsil 3-6635 Dielectric Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Electronics - Optoelectronics
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Smart Meters
      • Smart Home Devices
    • Chemistry
    • Application Method
      • Other - Manual or automated equipment
    • Cure Method
      • Heat
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 125, 150, 100 Test Method
    Cure Time (min) 48, 7, 6, 120 Test Method
    Viscosity (cPs) Low, 700
    Set Time (min) 11 Test Method
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00020, <0.00010 Test Method
    Dielectric Strength (V/mil) 525, Excellent
    Dielectric Constant 2.83, 2.84 Test Method
    Volume Resistivity (O) 4.8E+13 (ohms/cm)
    Hardness
    Shore A Hardness 75 g, Soft to Medium
    Flexibility Resilient, Flexible
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 1.000 Test Method
    Flash Point (°F) 231.8
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 6
    Not Good For
    Don't Use For Other sulfur containing materials, Polysulfones, Polysulfides, Sulfur, Silicone rubber containing organotin catalyst, Organometallic compounds, Organotin compounds, Unsaturated hydrocarbon plasitcizers, Some solder flux residues
  • Best Practices for Dow Dowsil 3-6635 Dielectric Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.

    2. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    3. Curing

      Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). For one-part products the viscosity either increases at a much lower rate or does not change significantly at RT. Cure conditions are shown in the typical properties table. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    4. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.

  • Comparable Materials for Dow Dowsil 3-6635 Dielectric Gel

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Rheometer T90 Cure Time
125°C Rheometer T90 Cure Time
150°C Rheometer T90 Cure Time
100°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
48 min Rheometer T90 Cure Time
7 min Rheometer T90 Cure Time
6 min Rheometer T90 Cure Time
120 min Heat Cure
Set Time Test Methods
Set Time Set Temperature Test Method
11 min 135°C Gel Time
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.83 100 Hz
2.84 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00020 100 hz
<0.00010 100 kHz
Specific Gravity Test Methods
Specific Gravity Test Method
1.000 Uncured