Dow Dowsil CY 52-276 Gel

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Description for Dow Dowsil CY 52-276 Gel

A two-part, clear, 1:1 mix ratio, gel with controlled volatility.<br/>

Brand	Dowsil
Application Type	Encapsulants
1 Part or 2 Part	2 Part
Material Form	Gel
Industry	Isolate circuits from the harmful effects of moisture, E-Mobility Solutions, Smart Meters, Smart Home Devices, Protect circuits from thermal and mechanical stresses, Optoelectronics, Isolate circuits from the harmful effects of other contaminants , Protect interconnections from thermal and mechanical stresses
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	2-Part Cure
Cure Temperature (°C)	Low, 70
Cure Time (min)	30
Viscosity (cPs)	Low, Controlled flow
Color	Clear
Chemical Resistance	Resistance to some fuels
Relative Solvent Resistance	Chemical Resistance: Resistance to some solvents
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Elastomeric	Elastomer
Light Refractive Index (RI)	High

Best Practices for Dow Dowsil CY 52-276 Gel

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Technical Data for Dow Dowsil CY 52-276 Gel

*See Terms of Use Below

Overview

Application Type
- Pottant / Encapsulant - Encapsulants
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
Material Form
- Gel
Substrate
- Other - Extremely soft material
Industry
- E-Mobility Solutions
- Electronics - Isolate circuits from the harmful effects of moisture, Protect circuits from thermal and mechanical stresses, Optoelectronics, Isolate circuits from the harmful effects of other contaminants , Protect interconnections from thermal and mechanical stresses
- Smart Meters
- Smart Home Devices
- Industrial - Delicate components
- Other - Sensitive applications
Chemistry
- Volatile Content: VOC - Controlled volatility
- Solvent-Free
- Silicone
Application Method
- Other - Automated meter mixing
Cure Method
- 2-Part Cure
Color
- Clear / Transparent - Clear
Brand
- Dowsil
Also Known As
- Old Name - CY 52-276 Kit

Specifications

Cure Specs

Cure Temperature (°C)	Low, 70	Test Method
Cure Time (min)	30	Test Method
Viscosity (cPs)	Low, Controlled flow
Work / Pot Time (min)	30	Test Method
Thixotropic	Thixotropic
Mix Ratio	1:1

Material Resistance

Chemical Resistance	Resistance to some fuels
Relative Solvent Resistance	Chemical Resistance: Resistance to some solvents
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	<0.00010, <0.00010	Test Method
Dielectric Strength (V/mil)	350, Electrical insulation for high voltages
Dielectric Constant	2.50	Test Method
Volume Resistivity (O)	1.0 E+15 (ohm*cm)

Hardness

Dimensional Stability	Dimensional stability
Elastomeric	Elastomer
Flexibility	Resilient

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	0.980	Test Method
Coefficient of Thermal Expansion (CTE)	200 (Linear (micron/m °C or ppm ))

Business Information

Shelf Life Details	Storage conditions and shelf life (“Use By” date) are indicated on the product label.
Shelf Life Temperature (°F)	77
Shelf Life (mon)	18

Not Good For

Don't Use For	Some solder flux residues, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasticizers, Sulfur, Polysulfides, Organotin compounds, Other organometallic compounds
Don't Use With	Silicone rubber containing organotin catalyst

Best Practices for Dow Dowsil CY 52-276 Gel

*See Terms of Use Below
1. Deairing/Degassing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
Comparable Materials for Dow Dowsil CY 52-276 Gel

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Spec Engine^® Results
- Dowsil SE 1819 CV Kit(Dow)
  Two-part, 1-to-1 mix, controlled volatility, low density, flowable silicone encapsulant is well suited for the protection of electrical/PCB systems assembly applications.
- Dowsil SE 1817 CV M A/B(Dow)
  Two-part, 1-to-1 mix, controlled volatility, UL94 V-0, low hardness, flowable silicone is suitable for encapsulation of various transportation electronics devices.
- 2C51 Silicone Gel(HumiSeal)
  A two component high strength, fast curing silicone encapsulating gel, suitable for general printed circuit board applications.
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