Dow Dowsil JCR 6126 WC Encapsulant Datasheet Dow Dowsil JCR 6126 WC Encapsulant

Information provided by Gluespec
  • Description for Dow Dowsil JCR 6126 WC Encapsulant

    • Two-part • Thixotropic • Very long working time • Medium-modulus • Optically clear • Controlled flow • Seal and protect LEDs

    *See Terms of Use Below

    Brand Dowsil
    Application Type Encapsulant, Seal
    1 Part or 2 Part 2-Part
    Material Form Liquid, Silicone elastomer
    Industry Optoelectronic packaging, Light Emitting Diodes (LEDs), Displays, Protecting the bonding wires, Micro-electronic packaging, Protect LEDs, Protecting the chip, Seal LEDs
    Manufacturer Dow
    Chemistry Silicone elastomer, Solvent-free
    Cure Method 2-Part Cure, Heat cure, Oven
    Cure Temperature (°C) 150
    Cure Time (min) 60
    Viscosity (cPs) 86,400, 91,800, Controlled flow
    Color Translucent, Clear / Transparent: Optically clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45
    Volume Resistivity (O) 3.4E15 (ohm*cm)
    Stress Relief Absorb the stress caused by CTE mismatches
    Light Refractive Index (RI) 1.4000, 1.3900, 1.3900
  • Technical Data for Dow Dowsil JCR 6126 WC Encapsulant

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Industry
      • Displays
      • LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs), Seal LEDs, Protect LEDs
      • Wirebond - Protecting the bonding wires
      • Electronics - Optoelectronic packaging, Micro-electronic packaging, Protecting the chip
      • Packaging - Micro-electronic packaging, Optoelectronic packaging
    • Chemistry
    • Application Method
      • Dispenser - Commercially available equipment, Industry standard processes, Molded, Dispensed
    • Cure Method
      • Heat - Heat cure, Oven
      • 2-Part Cure
    • Color
      • Translucent
      • Clear / Transparent : Optically Clear
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 150 Test Method
    Cure Time (min) 60 Test Method
    Viscosity (cPs) 86,400, 91,800, Controlled flow Test Method
    Work / Pot Time (min) Very long
    Thixotropic Thixotropic
    Mix Ratio 10:1
    Bond Strength
    General Bond Strength (psi) Excellent
    Tensile Strength (psi) 1.8 (Mpa)
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45
    Moisture/Humidity Resistance Moisture resistance
    Conductivity
    Dissipation Factor 0.00090 Test Method
    Insulation Resistance (O) Electrical stability
    Dielectric Strength (V/mil) Durable, 600, Thermal stability Test Method
    Dielectric Constant 2.80 Test Method
    Volume Resistivity (O) 3.4E15 (ohm*cm) Test Method
    Hardness
    Stress Relief Absorb the stress caused by CTE mismatches
    Shore A Hardness 26 Test Method
    Elongation (%) 3
    Flexibility Flexible
    Modulus (psi) Medium, 0.7 (Young's (MPa)), Low Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) -121
    Light Refractive Index (RI) 1.4000, 1.3900, 1.3900 Test Method
    Coefficient of Thermal Expansion (CTE) 300 (ppm/°C)
    Flash Point (°F) 212.0
    % Solids (%) 100
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. Check the product label for specific storage conditions (one part products require cold storage). One-part products produced in Japan for export are shipped using dry ice. One-part products produced in the United States are shipped using blue ice.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 9
    Not Good For
    Don't Use For Chemicals, Organotin, Other organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasitcizers, Some solder flux residues
    Don't Use With Certain materials, Curing agents, Plasticizers
  • Best Practices for Dow Dowsil JCR 6126 WC Encapsulant

    *See Terms of Use Below

    1. Surface Preparation

      Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.

    2. Application

      Dow encapsulants are compatible with commercially available equipment and industry standard processes. The encapsulants can be dispensed, printed or liquid injection molded.

    3. Curing

      Full cure to achieve final properties can be achieved in standard forced-air convection ovens or many other oven configurations.

    4. Clean-Up

      Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.

    5. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Heat Cure, Specification Writers: These values are not intended for use in preparing specifications.
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure, Specification Writers: These values are not intended for use in preparing specifications.
Viscosity Test Methods
Viscosity Test Method
86,400 cPs Mixed, Specification Writers: These values are not intended for use in preparing specifications.
91,800 cPs After 24 hours, Specification Writers: These values are not intended for use in preparing specifications.
Controlled flow
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.80 1 MHz, Specification Writers: These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Durable
600 V/mil Specification Writers: These values are not intended for use in preparing specifications.
Thermal stability
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00090 1 MHz, Specification Writers: These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
3.4E15 (ohm*cm) Specification Writers: These values are not intended for use in preparing specifications.
Modulus Test Methods
Modulus Test Method
Medium
0.7 (Young's (MPa))
Low Young’s
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
26 Durometer, JIS, Specification Writers: These values are not intended for use in preparing specifications.
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4000 @ 632.8 nm, Specification Writers: These values are not intended for use in preparing specifications.
1.3900 @ 1321 nm, Specification Writers: These values are not intended for use in preparing specifications.
1.3900 @ 1554 nm, Specification Writers: These values are not intended for use in preparing specifications.