Dow Dowsil JCR 6140 Optical Encapsulant

Dow Dowsil JCR 6140 Optical Encapsulant Datasheet
  • Description for Dow Dowsil JCR 6140 Optical Encapsulant

    Transparent, medium-modulus LED encapsulant; medium viscosity

    *See Terms of Use Below

    Brand Dowsil
    Application Type Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Al
    Industry Light Emitting Diodes (LEDs), Optical, Semiconductor protective coating, CCD image sensor, PCB Systems Assembly, Protecting the bonding wires, Protecting the chip
    Manufacturer Dow
    Chemistry Silicone, Very high purity, Polydimethylsiloxane
    Cure Method Heat, 2-Part Cure, Addition cure
    Cure Temperature (°C) 150
    Cure Time (min) 60
    Viscosity (cPs) Medium, 3,100
    Color Transparent
    High Temperature Resistance (°C) 200, Excellent thermal stability
    Low Temperature Resistance (°C) -45, -55
    Elastomeric Elastomer
    Light Refractive Index (RI) 1.4060, 1.3990, 1.3970, 1.4100
  • Technical Data for Dow Dowsil JCR 6140 Optical Encapsulant

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Liquid
    • Substrate
    • Industry
      • Optical
      • Semiconductor - Semiconductor protective coating
      • LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
      • Electronics - Protecting the bonding wires, Protecting the chip
      • Sensors - CCD image sensor
      • Printed Circuit Board (PCB) - PCB Systems Assembly
    • Chemistry
      • Other - Very high purity, Polydimethylsiloxane
      • Silicone
    • Cure Method
      • Addition cure - Addition cure
      • Heat
      • 2-Part Cure
    • Color
      • Clear / Transparent - Transparent
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 150 Test Method
    Cure Time (min) 60 Test Method
    Viscosity (cPs) Medium, 3,100 Test Method
    Thixotropic 1.2
    Mix Ratio 1:1
    Bond Strength
    General Bond Strength (psi) High
    Shear Strength (psi) 200 Test Method
    Tensile Strength (psi) 770
    Material Resistance
    High Temperature Resistance (°C) 200, Excellent thermal stability
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance High moisture resistance
    Conductivity
    Dissipation Factor 9.3E-40 Test Method
    Dielectric Strength (V/mil) Durable, 700
    Dielectric Constant 2.80 Test Method
    Thermal Conductivity (W/m°K) 0.20
    Volume Resistivity (O) 6.4E+15 (ohm*cm)
    Hardness
    Shore A Hardness 40
    Elastomeric Elastomer
    Elongation (%) 180
    Flexibility Flexible
    Modulus (psi) 145 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) -119
    Light Refractive Index (RI) 1.4060, 1.3990, 1.3970, 1.4100 Test Method
    Specific Gravity 1.000 Test Method
    Coefficient of Thermal Expansion (CTE) 320 (ppm/°C) Test Method
    Flash Point (°F) 212.0
    % Solids (%) 100
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label., Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life., Shelf life is indicated by the “Use Before” date found on the product label. Dow two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life. Check the product label for specific storage conditions.
    Shelf Life Temperature (°F) <77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
    Not Good For
    Don't Use For Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials, Some solder flux residues
  • Best Practices for Dow Dowsil JCR 6140 Optical Encapsulant

    *See Terms of Use Below

    1. Curing

      Dow OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure
Viscosity Test Methods
Viscosity Test Method
Medium
3,100 cPs Mixed
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
200 psi Lap Shear AL Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.80 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
9.3E-40 1 MHz
Modulus Test Methods
Modulus Test Method
145 psi Youngs Modulus
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
320 (ppm/°C) by TMA
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4060 Cures at 633 nm
1.3990 Cured at 1321 nm
1.3970 Cured at 1554 nm
1.4100
Specific Gravity Test Methods
Specific Gravity Test Method
1.000 Cured