Dow Dowsil JCR 6140 Optical Encapsulant Datasheet Dow Dowsil JCR 6140 Optical Encapsulant

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  • Description for Dow Dowsil JCR 6140 Optical Encapsulant

    Transparent, medium-modulus LED encapsulant; medium viscosity

    *See Terms of Use Below

    Brand Dowsil
    Application Type Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Al
    Industry Protecting the chip, Light Emitting Diodes (LEDs), Semiconductor protective coating, Optical, CCD image sensor, PCB Systems Assembly, Protecting the bonding wires
    Manufacturer Dow
    Chemistry Very high purity, Polydimethylsiloxane, Silicone
    Cure Method 2-Part Cure, Heat, Addition cure
    Cure Temperature (°C) 150
    Cure Time (min) 60
    Viscosity (cPs) Medium, 3,100
    Color Transparent
    High Temperature Resistance (°C) 200, Excellent thermal stability
    Low Temperature Resistance (°C) -45, -55
    Elastomeric Elastomer
    Light Refractive Index (RI) 1.4060, 1.3990, 1.3970, 1.4100

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
150°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
60 min Heat Cure
Viscosity Test Methods
Viscosity Test Method
3,100 cPs Mixed
Shear Strength Test Methods
Shear Strength Type Substrate Test Method
200 psi Lap Shear AL Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.80 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
9.3E-40 1 MHz
Modulus Test Methods
Modulus Test Method
145 psi Youngs Modulus
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
320 (ppm/°C) by TMA
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4060 Cures at 633 nm
1.3990 Cured at 1321 nm
1.3970 Cured at 1554 nm
Specific Gravity Test Methods
Specific Gravity Test Method
1.000 Cured