Dow Dowsil JCR 6140 Optical Encapsulant

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Description for Dow Dowsil JCR 6140 Optical Encapsulant

Transparent, medium-modulus LED encapsulant; medium viscosity

Brand	Dowsil
Application Type	Encapsulate
1 Part or 2 Part	2-Part
Material Form	Liquid
Substrate	Al
Industry	Protecting the chip, Light Emitting Diodes (LEDs), Semiconductor protective coating, Optical, CCD image sensor, PCB Systems Assembly, Protecting the bonding wires
Manufacturer	Dow
Chemistry	Very high purity, Polydimethylsiloxane, Silicone
Cure Method	2-Part Cure, Heat, Addition cure
Cure Temperature (°C)	150
Cure Time (min)	60
Viscosity (cPs)	Medium, 3,100
Color	Transparent
High Temperature Resistance (°C)	200, Excellent thermal stability
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	6.4E+15 (ohm*cm)
Elastomeric	Elastomer
Light Refractive Index (RI)	1.4060, 1.3990, 1.3970, 1.4100

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Technical Data for Dow Dowsil JCR 6140 Optical Encapsulant

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Overview

Application Type
- Pottant / Encapsulant - Encapsulate
1 Part or 2 Part
- 2-Part
Material Form
- Liquid
Substrate
- Aluminum - Al
Industry
- Semiconductor - Semiconductor protective coating
- Optical
- LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
- Wirebond - Protecting the bonding wires
- Electronics - Protecting the chip
- Sensors - CCD image sensor
- Printed Circuit Board (PCB) - PCB Systems Assembly
Chemistry
- Other - Very high purity, Polydimethylsiloxane
- Silicone
Cure Method
- Addition cure - Addition cure
- Heat
- 2-Part Cure
Color
- Clear / Transparent - Transparent
Brand
- Dowsil

Specifications

Cure Specs

Cure Temperature (°C)	150	Test Method
Cure Time (min)	60	Test Method
Viscosity (cPs)	Medium, 3,100	Test Method
Thixotropic	1.2
Mix Ratio	1:1

Bond Strength

General Bond Strength (psi)	High
Shear Strength (psi)	200	Test Method
Tensile Strength (psi)	770

Material Resistance

High Temperature Resistance (°C)	200, Excellent thermal stability
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	High moisture resistance

Conductivity

Dissipation Factor	9.3E-40	Test Method
Dielectric Strength (V/mil)	Durable, 700
Dielectric Constant	2.80	Test Method
Thermal Conductivity (W/m°K)	0.20
Volume Resistivity (O)	6.4E+15 (ohm*cm)

Hardness

Shore A Hardness	40
Elastomeric	Elastomer
Elongation (%)	180
Flexibility	Flexible
Modulus (psi)	145	Test Method

Other Properties

Glass Transition Temp (Tg) (°C)	-119
Light Refractive Index (RI)	1.4060, 1.3990, 1.3970, 1.4100	Test Method
Specific Gravity	1.000	Test Method
Coefficient of Thermal Expansion (CTE)	320 (ppm/°C)	Test Method
Flash Point (°F)	212.0
% Solids (%)	100

Business Information

Shelf Life Details	Shelf life is indicated by the “Use Before” date found on the product label., Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life., Shelf life is indicated by the “Use Before” date found on the product label. Dow two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life. Check the product label for specific storage conditions.
Shelf Life Temperature (°F)	<77
Shelf Life Type	From date of manufacture
Shelf Life (mon)	6

Not Good For

Don't Use For	Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials, Some solder flux residues

Best Practices for Dow Dowsil JCR 6140 Optical Encapsulant

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1. Curing
  
  Dow OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
  
  Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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