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Description for Dow Dowsil JCR 6140 Optical Encapsulant
Transparent, medium-modulus LED encapsulant; medium viscosityBrand Dowsil Application Type Encapsulate 1 Part or 2 Part 2-Part Material Form Liquid Substrate Al Industry Protecting the chip, Light Emitting Diodes (LEDs), Semiconductor protective coating, Optical, CCD image sensor, PCB Systems Assembly, Protecting the bonding wires Manufacturer Dow Chemistry Very high purity, Polydimethylsiloxane, Silicone Cure Method 2-Part Cure, Heat, Addition cure Cure Temperature (°C) 150 Cure Time (min) 60 Viscosity (cPs) Medium, 3,100 Color Transparent High Temperature Resistance (°C) 200, Excellent thermal stability Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 6.4E+15 (ohm*cm) Elastomeric Elastomer Light Refractive Index (RI) 1.4060, 1.3990, 1.3970, 1.4100 -
Technical Data for Dow Dowsil JCR 6140 Optical Encapsulant
Overview
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Application Type
- Pottant / Encapsulant - Encapsulate
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Substrate
- Aluminum - Al
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Industry
- Semiconductor - Semiconductor protective coating
- Optical
- LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
- Wirebond - Protecting the bonding wires
- Electronics - Protecting the chip
- Sensors - CCD image sensor
- Printed Circuit Board (PCB) - PCB Systems Assembly
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Chemistry
- Other - Very high purity, Polydimethylsiloxane
- Silicone
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Cure Method
- Addition cure - Addition cure
- Heat
- 2-Part Cure
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Color
- Clear / Transparent - Transparent
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Brand
- Dowsil
Specifications
Cure Specs
Cure Temperature (°C) 150 Test Method Cure Time (min) 60 Test Method Viscosity (cPs) Medium, 3,100 Test Method Thixotropic 1.2 Mix Ratio 1:1 Bond Strength
General Bond Strength (psi) High Shear Strength (psi) 200 Test Method Tensile Strength (psi) 770 Material Resistance
High Temperature Resistance (°C) 200, Excellent thermal stability Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance High moisture resistance Conductivity
Dissipation Factor 9.3E-40 Test Method Dielectric Strength (V/mil) Durable, 700 Dielectric Constant 2.80 Test Method Thermal Conductivity (W/m°K) 0.20 Volume Resistivity (O) 6.4E+15 (ohm*cm) Hardness
Shore A Hardness 40 Elastomeric Elastomer Elongation (%) 180 Flexibility Flexible Modulus (psi) 145 Test Method Other Properties
Glass Transition Temp (Tg) (°C) -119 Light Refractive Index (RI) 1.4060, 1.3990, 1.3970, 1.4100 Test Method Specific Gravity 1.000 Test Method Coefficient of Thermal Expansion (CTE) 320 (ppm/°C) Test Method Flash Point (°F) 212.0 % Solids (%) 100 Business Information
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label., Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life., Shelf life is indicated by the “Use Before” date found on the product label. Dow two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life. Check the product label for specific storage conditions. Shelf Life Temperature (°F) <77 Shelf Life Type From date of manufacture Shelf Life (mon) 6 Not Good For
Don't Use For Organotin compounds, Unsaturated hydrocarbon plasitcizers, Organometallic compounds, Silicone rubber containing organotin catalyst, Sulfur, Polysulfides, Polysulfones, Other sulfur containing materials, Some solder flux residues -
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Best Practices for Dow Dowsil JCR 6140 Optical Encapsulant
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Curing
Dow OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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150°C | Heat Cure |
Cure Time Test Methods
Cure Time | Test Method |
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60 min | Heat Cure |
Viscosity Test Methods
Viscosity | Test Method |
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Medium | |
3,100 cPs | Mixed |
Shear Strength Test Methods
Shear Strength | Type | Substrate | Test Method |
---|---|---|---|
200 psi | Lap Shear | AL | Unprimed Adhesion |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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2.80 | 1 MHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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9.3E-40 | 1 MHz |
Modulus Test Methods
Modulus | Test Method |
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145 psi | Youngs Modulus |
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) | CTE Test Method |
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320 (ppm/°C) | by TMA |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
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1.4060 | Cures at 633 nm |
1.3990 | Cured at 1321 nm |
1.3970 | Cured at 1554 nm |
1.4100 |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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1.000 | Cured |

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