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Description for Dow Duroptix JCR 6109
One-part clear, low viscosity, optical gel, silicone LED (light emitting diode) encapsulants are designed to meet the challenging needs of the LED market, high purity, moisture resistance, thermal stability and optical transmittance.Application Type Encapsulant 1 Part or 2 Part 1-Part Material Form Gel Industry Light Emitting Diodes (LEDs), Optical encapsulant, Bonding wires Manufacturer Dow Chemistry High purity, Methyl phenyl siloxane, Non solvent Cure Method Heat curing Cure Temperature (°C) 70, 150 Cure Time (min) 60, 960 Viscosity (cPs) 3,700, Low Color Translucent High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45 Volume Resistivity (O) 1.7E+15 (ohm*cm) Light Refractive Index (RI) 1.4200 -
Technical Data for Dow Duroptix JCR 6109
Overview
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Application Type
- Pottant / Encapsulant - Encapsulant
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1 Part or 2 Part
- 1-Part
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Material Form
- Gel
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Industry
- Optical - Optical encapsulant
- LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
- Wirebond - Bonding wires
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Chemistry
- Solvent-Free - Non solvent
- Other - High purity
- Silicone - Methyl phenyl siloxane
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Cure Method
- Heat - Heat curing
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Color
- Translucent
Specifications
Cure Specs
Cure Temperature (°C) 70, 150 Test Method Cure Time (min) 60, 960 Test Method Viscosity (cPs) 3,700, Low Test Method Work / Pot Time (min) Long Material Resistance
High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45 Conductivity
Dissipation Factor 5.5E-04 Test Method Dielectric Strength (V/mil) 0.01 Test Method Dielectric Constant 2.70 Test Method Thermal Conductivity (W/m°K) Excellent thermal stability Volume Resistivity (O) 1.7E+15 (ohm*cm) Test Method Hardness
Flexibility Flexible Modulus (psi) 0.05 (Mpa) Test Method Other Properties
Light Refractive Index (RI) 1.4200 Test Method Specific Gravity 1.040 Test Method Business Information
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. For best results, DuPont one-part products require cold storage at or below -5°C (23°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed with head space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Check the product label for specific storage conditions. Shelf Life Temperature (°F) 23 Shelf Life Type From date of manufacture Shelf Life (mon) 6 -
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Best Practices for Dow Duroptix JCR 6109
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Surface Preparation
Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.
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Clean-Up
These products can be dispensed or molded depending on the product and application. OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
70°C | These values are not intended for use in .preparing specifications. |
150°C | These values are not intended for use in preparing specifications. |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
60 min | These values are not intended for use in .preparing specifications. |
960 min | These values are not intended for use in preparing specifications. |
Viscosity Test Methods
Viscosity | Test Method |
---|---|
3,700 cPs | These values are not intended for use in preparing specifications. |
Low |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
2.70 | At 1MHz, these values are not intended for use in preparing specifications. |
Dielectric Strength Test Methods
Dielectric Strength | Test Method |
---|---|
0.01 V/mil | These values are not intended for use in preparing specifications. |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|---|
5.5E-04 | At 1MHz, These values are not intended for use in preparing specifications |
Volume Resistivity Test Methods
Volume Resistivity | Test Method |
---|---|
1.7E+15 (ohm*cm) | These values are not intended for use in preparing specifications. |
Modulus Test Methods
Modulus | Test Method |
---|---|
0.05 (Mpa) | Youngs modulus, These values are not intended for use in preparing specifications |
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) | Test Method |
---|---|
1.4200 | These values are not intended for use in preparing specifications. |
Specific Gravity Test Methods
Specific Gravity | Test Method |
---|---|
1.040 | Cured, These values are not intended for use in preparing specifications. |