Dow Hipec Q3-6646 SemiconDuctor Protective Coating

Dow Hipec Q3-6646 SemiconDuctor Protective Coating Datasheet
  • Description for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

    Transparent, low-modulus LED gel encapsulant; low viscosity; long working time.

    *See Terms of Use Below

    Application Type Encapsulant , Protective Coating
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Industry Light Emitting Diodes (LEDs)
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Heat, 2-Part Cure
    Cure Temperature (°C) 150
    Cure Time (min) 60
    Viscosity (cPs) Low
    Color Transparent
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45
    Light Refractive Index (RI) 1.4020, 1.3940, 1.3930
  • Technical Data for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Liquid
    • Industry
      • LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
    • Cure Method
      • Heat
      • 2-Part Cure
    • Color
      • Clear / Transparent - Transparent
    Specifications
    Cure Specs
    Cure Temperature (°C) 150
    Cure Time (min) 60
    Viscosity (cPs) Low
    Work / Pot Time (min) Very long
    Mix Ratio 1:1 (by volume)
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45
    Conductivity
    Dielectric Strength (V/mil) Durable
    Hardness
    Flexibility Flexible
    Modulus (psi) Low
    Other Properties
    Light Refractive Index (RI) 1.4020, 1.3940, 1.3930 Test Method
    Flash Point (°F) 213.8
    % Solids (%) 100
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label., Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life., Check the product label for specific storage conditions.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
  • Best Practices for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

    *See Terms of Use Below

    1. Surface Preparation

      Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.

    2. Application

      These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.

    3. Clean-Up

      Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.

    4. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.

  • Comparable Materials for Dow Hipec Q3-6646 SemiconDuctor Protective Coating

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Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
1.4020 Cures at 633 nm
1.3940 Cured at 1321 nm
1.3930 Cured at 1554 nm