Dow Hipec Q3-6646 SemiconDuctor Protective Coating
Application Type Encapsulant , Protective Coating 1 Part or 2 Part 2-Part Material Form Liquid Industry Light Emitting Diodes (LEDs) Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method Heat, 2-Part Cure Cure Temperature (°C) 150 Cure Time (min) 60 Viscosity (cPs) Low Color Transparent High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45 Light Refractive Index (RI) 1.4020, 1.3940, 1.3930
Technical Data for Dow Hipec Q3-6646 SemiconDuctor Protective Coating
1 Part or 2 Part
- LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
- 2-Part Cure
- Clear / Transparent - Transparent
Cure Temperature (°C) 150 Cure Time (min) 60 Viscosity (cPs) Low Work / Pot Time (min) Very long Mix Ratio 1:1 (by volume)
High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45
Dielectric Strength (V/mil) Durable
Flexibility Flexible Modulus (psi) Low
Light Refractive Index (RI) 1.4020, 1.3940, 1.3930 Test Method Flash Point (°F) 213.8 % Solids (%) 100
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label., Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life., Check the product label for specific storage conditions. Shelf Life Type From date of manufacture Shelf Life (mon) 12
Best Practices for Dow Hipec Q3-6646 SemiconDuctor Protective Coating
Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.
These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.
Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.
Comparable Materials for Dow Hipec Q3-6646 SemiconDuctor Protective Coating
Spec Engine® Results