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Description for Dow HV 1540/20P
Very low viscosity, suitable for casting; hydrophobic; low temperature cure; good tracking resistance.Application Type Pot, Encapsulate 1 Part or 2 Part 1-Part Material Form Liquid Manufacturer Dow Chemistry Silicone rubber Cure Method Low-temperature cure Cure Temperature (°C) 100 Cure Time (min) 10 Viscosity (cPs) Very Low Other Resistance Tracking Resistance Volume Resistivity (O) 6E+14 -
Technical Data for Dow HV 1540/20P
Overview
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Application Type
- Pottant / Encapsulant - Pot, Encapsulate
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1 Part or 2 Part
- 1-Part
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Material Form
- Liquid
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Chemistry
- Silicone - Silicone rubber
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Cure Method
- Other - Low-temperature cure
Specifications
Cure Specs
Cure Temperature (°C) 100 Cure Time (min) 10 Viscosity (cPs) Very Low Mix Ratio 9:1 (by volume) Bond Strength
Tear Strength (piw) 170 Tensile Strength (psi) 1,130 Material Resistance
Other Resistance Tracking Resistance Test Method Conductivity
Dielectric Constant 2.80 Volume Resistivity (O) 6E+14 Hardness
Shore A Hardness 32 Elongation (%) 5 Other Properties
Flash Point (°F) 212.0 -
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Best Practices for Dow HV 1540/20P
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Comparable Materials for Dow HV 1540/20P
Spec Engine® Results
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