Dow HV 1551/55P Datasheet Dow HV 1551/55P

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  • Description for Dow HV 1551/55P

    Low viscosity; sustained hydrophobicity; high tear strength; low cure temperature; good tracking resistance.

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    Application Type Pot, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Manufacturer Dow
    Chemistry Silicone rubber
    Cure Method 2-Part Cure
    Cure Temperature (°C) 120, Low
    Cure Time (min) 0.13 to 0.23
    Viscosity (cPs) Low
    Other Resistance Tracking Resistance
  • Technical Data for Dow HV 1551/55P

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Liquid
    • Chemistry
    • Cure Method
      • 2-Part Cure
    Specifications
    Cure Specs
    Cure Temperature (°C) 120, Low
    Cure Time (min) 0.13 to 0.23
    Viscosity (cPs) Low
    Mix Ratio 1:1 (by volume)
    Bond Strength
    Tear Strength (piw) High, 172
    Material Resistance
    Other Resistance Tracking Resistance
    Conductivity
    Dielectric Constant 2.80
    Volume Resistivity (O) 1E+15
    Hardness
    Shore A Hardness 42
    Elongation (%) 5
    Other Properties
    Flash Point (°F) 212.0
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