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Description for Dow HV 1551/55P
Low viscosity; sustained hydrophobicity; high tear strength; low cure temperature; good tracking resistance.Application Type Pot, Encapsulate 1 Part or 2 Part 2-Part Material Form Liquid Manufacturer Dow Chemistry Silicone rubber Cure Method 2-Part Cure Cure Temperature (°C) 120, Low Cure Time (min) 0.13 to 0.23 Viscosity (cPs) Low Other Resistance Tracking Resistance Volume Resistivity (O) 1E+15 -
Technical Data for Dow HV 1551/55P
Overview
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Application Type
- Pottant / Encapsulant - Pot, Encapsulate
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Chemistry
- Silicone - Silicone rubber
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Cure Method
- 2-Part Cure
Specifications
Cure Specs
Cure Temperature (°C) 120, Low Cure Time (min) 0.13 to 0.23 Viscosity (cPs) Low Mix Ratio 1:1 (by volume) Bond Strength
Tear Strength (piw) High, 172 Material Resistance
Other Resistance Tracking Resistance Conductivity
Dielectric Constant 2.80 Volume Resistivity (O) 1E+15 Hardness
Shore A Hardness 42 Elongation (%) 5 Other Properties
Flash Point (°F) 212.0 -
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Best Practices for Dow HV 1551/55P
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Comparable Materials for Dow HV 1551/55P
Spec Engine® Results
Closest Results from this Manufacturer
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