Dow JCR 6110 A/B

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Description for Dow JCR 6110 A/B

Transparent, low-modulus LED gel encapsulant; long working time.

Application Type	Encapsulant
1 Part or 2 Part	2 Part
Material Form	Liquid
Industry	Light Emitting Diodes (LEDs)
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	Part A/Part B, Heat
Cure Temperature (°C)	150
Cure Time (min)	60
Color	Transparent
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45
Light Refractive Index (RI)	1.4230, 1.4130, 1.4110

Best Practices for Dow JCR 6110 A/B

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Surface Preparation

Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.
Application

These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.
Clean-Up

Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
Testing

If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.

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Technical Data

Overview

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Specifications

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Best Practices

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Comparable Materials

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