Dow JCR 6110 A/B

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Description for Dow JCR 6110 A/B

Transparent, low-modulus LED gel encapsulant; long working time.

Application Type	Encapsulant
1 Part or 2 Part	2 Part
Material Form	Liquid
Industry	Light Emitting Diodes (LEDs)
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	Part A/Part B, Heat
Cure Temperature (°C)	150
Cure Time (min)	60
Color	Transparent
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45
Light Refractive Index (RI)	1.4230, 1.4130, 1.4110

Best Practices for Dow JCR 6110 A/B

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Technical Data for Dow JCR 6110 A/B

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Overview

Application Type
- Pottant / Encapsulant - Encapsulant
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- Part A Name - Part A
- Part B Name - Part B
Material Form
- Liquid
Industry
- LED (Light-Emitting Diodes) - Light Emitting Diodes (LEDs)
Chemistry
- Solvent-Free
- Silicone
Cure Method
- Heat
- 2-Part Cure - Part A/Part B
Color
- Clear / Transparent - Transparent

Specifications

Cure Specs

Cure Temperature (°C)	150
Cure Time (min)	60
Work / Pot Time (min)	Long
Mix Ratio	10:1 (by volume)

Material Resistance

High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45

Conductivity

Dielectric Strength (V/mil)	Durable

Hardness

Flexibility	Flexible
Modulus (psi)	Low

Other Properties

Light Refractive Index (RI)	1.4230, 1.4130, 1.4110	Test Method
Flash Point (°F)	212.0
% Solids (%)	100

Business Information

Shelf Life Details	Shelf life is indicated by the “Use Before” date found on the product label., Dow Corning two-part products should be stored at or below 25°C (77°F). Containers should be kept tightly closed at all times to extend shelf life., Check the product label for specific storage conditions.
Shelf Life Type	From date of manufacture
Shelf Life (mon)	12

Best Practices for Dow JCR 6110 A/B

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1. Surface Preparation
  
  Surfaces should be clean and dry. Recommended cleaning methods include Dow Corning® brand OS Fluids, naphtha, mineral spirits, methyl ethyl ketone (MEK) or other suitable solvent. Rougher surfaces tend to promote adhesion of silicones to other surfaces.
2. Application
  
  These products are also compatible with commercially available equipment and industry standard processes. These materials can be dispensed or molded depending on the product and application.
3. Clean-Up
  
  Dow Corning OS Fluids are recommended to clean cured or uncured silicone residue from application equipment.
4. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured silicone indicates incompatibility and inhibition of cure.
Comparable Materials for Dow JCR 6110 A/B

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Spec Engine^® Results
- Sylgard 184 Silicone Elastomer(Dow)
  Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.
- OE-6635(Dow)
  2-part, high viscosity, solvent-less, high RI, transparent, heat-cure silicone resin, clear LED resin for fabricated parts
- Hipec Q3-6646 SemiconDuctor Protective Coating(Dow)
  Transparent, low-modulus LED gel encapsulant; low viscosity; long working time.
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