Dow SE 4445 CV Thermally ConDuctive Gel

Dow SE 4445 CV Thermally ConDuctive Gel Datasheet
  • Description for Dow SE 4445 CV Thermally ConDuctive Gel

    Two-part; thermally conductive gel; heat cure; moderate viscosity.

    *See Terms of Use Below

    Application Type Pot, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Coils, Electronic device, Transformer, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electronic heat sources, Electronic modules, Electronics, Heat sinks, Relays
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Heat, 2 Parts
    Cure Temperature (°C) 20 to 25, 125
    Cure Time (min) 45
    Viscosity (cPs) Moderate, 14,000
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
  • Technical Data for Dow SE 4445 CV Thermally ConDuctive Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Electronics - Electronic device, Electronic heat sources, Electronic modules, Heat sinks, Relays
      • Coils
      • Transformers - Transformer
      • Smart Meters
      • Smart Home Devices
      • Power Supplies
      • Industrial - Gap fill, Thermally conductive gel sheet
    • Chemistry
    • Application Method
      • Dispenser - Automated, Manual dispensing
    • Cure Method
      • Heat
      • 2-Part Cure - 2 Parts
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 125 Test Method
    Cure Time (min) 45 Test Method
    Viscosity (cPs) Moderate, 14,000
    Work / Pot Time (min) 300 Test Method
    Mix Ratio 1:1 (by volume)
    Material Resistance
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45
    Conductivity
    Dissipation Factor 0.00900 Test Method
    Dielectric Strength (V/mil) Durable, 127
    Dielectric Constant 6.20 Test Method
    Thermal Conductivity (W/m°K) 1.26 Test Method
    Volume Resistivity (O) 7E+15 (ohms/cm)
    Hardness
    Shore A Hardness Reliable
    Flexibility Resilient
    Other Properties
    Specific Gravity 2.360
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 6
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.
  • Best Practices for Dow SE 4445 CV Thermally ConDuctive Gel

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Comparable Materials for Dow SE 4445 CV Thermally ConDuctive Gel

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
125°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus additional time may be required for the part to warm to near oven temperature.
Cure Time Test Methods
Cure Time Test Method
45 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus additional time may be required for the part to warm to near oven temperature.
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
300 min Time to double initial mixed viscosity. 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
6.20 Dielectric constant, 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00900 Dissipation factor, 1 MHz
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
1.26 W/m°K 25°C