Brand Sylgard Application Type Potting, Encapsulant 1 Part or 2 Part 2 Part Material Form Liquid, Silicone elastomer Industry Amplifiers, Connectors, Relays, High voltage resistor packs, Sensors, Transformers, General purpose, PCB system assembly applications, E-Mobility Solutions, Smart Meters, Insulation, Smart Home Devices, Headlamp assemblies, Electronics, Electrical system assembly applications Manufacturer Dow Chemistry Silicone elastomer, Solvent-free, Polydimethylsiloxane Cure Method Part A/Part B, Heat, Room temperature cure Cure Temperature (°C) 25, 100 Cure Time (min) 1,440, 4.00 Viscosity (cPs) 4,865, Good flowability Color Dark Grey to Black, Dark Grey to Black Ozone Resistance Ozone resistance Chemical Resistance Good High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0 Recognized
Technical Data for Dow Sylgard 160 Silicone Elastomer
- Pottant / Encapsulant - Potting, Encapsulant
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- Part A Name - Part A
- Part B Name - Part B
- Elastomer - Silicone elastomer
- E-Mobility Solutions
- Headlamp - Headlamp assemblies
- Electronics - Relays, Electrical system assembly applications
- Voltage Resistors - High voltage resistor packs
- Printed Circuit Board (PCB) - PCB system assembly applications
- Smart Meters
- Smart Home Devices
- Power Supplies
- Industrial - Industrial controls
- General Purpose
- Dispenser - Automated metered mixing and dispensing
- Other - Manual mixing
- Room Temperature / Air Dry - Room temperature cure
- 2-Part Cure - Part A/Part B
- Black - Dark Grey to Black
- Gray - Dark Grey to Black
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0 Recognized
Cure Temperature (°C) 25, 100 Test Method Cure Time (min) 1,440, 4.00 Test Method Viscosity (cPs) 4,865, Good flowability Linear Shrinkage (%) Minimal shrinkage Work / Pot Time (min) 20 Test Method Mix Ratio 1:1 (by volume), 1:1 (by volume), 1:1 (by weight), 1:1 (by weight)
Ozone Resistance Ozone resistance Flame Resistance Good flame resistance Chemical Resistance Good UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dissipation Factor Test Method Dielectric Strength (V/mil) Good, Durable, 475 Dielectric Constant 3.51, 3.45 Test Method Thermal Conductivity (W/m°K) Moderate, 0.62 Volume Resistivity (O) 5.6e14 (ohms/cm)
Shore A Hardness 56 Test Method Flexibility Flexible
Coefficient of Thermal Expansion (CTE) 200 (micron/m °C or ppm ) Test Method Flash Point (°F) 213.8
Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.
Best Practices for Dow Sylgard 160 Silicone Elastomer
In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone encapsulant. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.
These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases deairing is not required.
Thoroughly mixed Dow silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/ dispensed.
Dow silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure.
Cure reaction begins with the mixing process. Initially, cure is evidenced by a gradual increase in viscosity, followed by gelation and conversion to a solid elastomer.
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Cure Temperature Test Methods
|Cure Temperature||Cure Time Test Method|
Cure Time Test Methods
|Cure Time||Test Method|
|4.00 min||Heat Cure|
Work / Pot Time Test Methods
|Work / Pot Time||Test Method||Temperature|
|20 min||Pot Life||25°C|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|
Shore A Hardness Test Methods
|Shore A Hardness||Shore Hardness Test Method|
Coefficient of Thermal Expansion (CTE) Test Methods
|Coefficient of Thermal Expansion (CTE)||CTE Test Method|
|200 (micron/m °C or ppm )||Linear CTE, By DMA|