Brand Sylgard Application Type Pot, Encapsulate 1 Part or 2 Part 2 Part Material Form Liquid, Silicone elastomer Industry Amplifiers, Connectors, Relays, High voltage resistor packs, Sensors, Transformers, E-Mobility Solutions, Smart Meters, Insulation, Smart Home Devices, Headlamp assemblies, Electronics Manufacturer Dow Chemistry Silicone, Solvent-free, Silicone elastomer Cure Method Part A/Part B, Heat Cure Temperature (°C) 25, 25 Cure Time (min) Fast, 36 Viscosity (cPs) 8,925, Flowable Color Gray Ozone Resistance Ozone resistance Chemical Resistance Good High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
Technical Data for Dow Sylgard 164 Silicone Elastomer
- Pottant / Encapsulant - Pot, Encapsulate
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
- Part A Name - Part A
- Part B Name - Part B
- Elastomer - Silicone elastomer
- Dispenser - Automated mixing, Dispensing equipment
- 2-Part Cure - Part A/Part B
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0
Cure Temperature (°C) 25, 25 Test Method Cure Time (min) Fast, 36 Test Method Viscosity (cPs) 8,925, Flowable Linear Shrinkage (%) Minimal shrinkage Work / Pot Time (min) 14 Test Method Mix Ratio 1:1 (by volume), 1:1 (by weight)
Tear Strength (piw) 2 (N/cm) Test Method
Ozone Resistance Ozone resistance Flame Resistance flame resistance Chemical Resistance Good UV Resistance UV resistance Environmental Resistance Environmental resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dissipation Factor 0.00780, <0.00090 Test Method Dielectric Strength (V/mil) Good, Durable, 475 Dielectric Constant 3.33, 3.28 Test Method Thermal Conductivity (W/m°K) moderate, 0.64 Volume Resistivity (O) 1.1e13 (ohms/cm)
Shore A Hardness 61 Flexibility Flexible
Specific Gravity 1.570 Coefficient of Thermal Expansion (CTE) 225 (Linear (micron/m °C or ppm )) Flash Point (°F) 213.8
Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Shelf Life Temperature (°F) 77 Shelf Life Type From date of manufacture Shelf Life (mon) 15
Best Practices for Dow Sylgard 164 Silicone Elastomer
In applications requiring adhesion, priming will be required for the silicone encapsulants. See the Primer Selection Guide or the correct primer to use with a given product. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly air dried prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the Dow Corning literature, “How To Use Dow Corning Primers and Adhesion Promoters” (Form No. 10-366) and in the information sheets specific to the individual primers.
Dow Corning silicone encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/electronic applications. The 1:1 mix ratio is very robust in manufacturing environments and allows for some process and dispense equipment variation. Dow Corning silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning silicone elastomers require no post cure and can be placed in service immediately following the completion of the cure schedule. Standard silicone encapsulants require a surface treatment with a primer in addition to good cleaning for adhesion while primerless silicone encapsulants require only good cleaning.
In applications sensitive to air entrapment, deairing with 28 to 30 inches Hg vacuum is required.
If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
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Cure Temperature Test Methods
|Cure Temperature||Cure Time Test Method|
|25°C||These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.|
Cure Time Test Methods
|Cure Time||Test Method|
|36 min||These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.|
Work / Pot Time Test Methods
|Work / Pot Time||Temperature|
Tear Strength Test Methods
|Tear Strength||Test Method|
|2 (N/cm)||(Die B)|
Dielectric Constant Test Methods
|Dielectric Constant||Test Method|
Dissipation Factor Test Methods
|Dissipation Factor||Test Method|