Dow Sylgard 170 Fast Cure Silicone Elastomer

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Description for Dow Sylgard 170 Fast Cure Silicone Elastomer

Two-part, 1 to 1 mix, black, general purpose encapsulant with good flowability and flame resistance, faster cure at room temp.

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Brand	Sylgard
Application Type	Encapsulant, Potting
1 Part or 2 Part	2-Part
Material Form	Liquid, Silicone Elastomer
Industry	Relays, Sensors, Transformers, Connectors, Amplifiers, High voltage resistor packs
Manufacturer	Dow
Chemistry	Silicone, Silicone Elastomer
Cure Method	2-Part Cure, Heat
Cure Temperature (°C)	25 to 50 Room temperature, 25
Cure Time (min)	Fast, 12
Viscosity (cPs)	Flowable, Low, 2,361
Color	Black
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Volume Resistivity (O)	2.42E+15 (ohms/cm)
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0

Best Practices for Dow Sylgard 170 Fast Cure Silicone Elastomer

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Technical Data for Dow Sylgard 170 Fast Cure Silicone Elastomer

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Overview

Application Type
- Pottant / Encapsulant - Potting, Encapsulant
1 Part or 2 Part
- 2-Part
Material Form
- Elastomer - Silicone Elastomer
- Liquid
Industry
- Electronics - Relays
- Sensors
- Transformers
- Connectors
- Amplifiers
- Voltage Resistors - High voltage resistor packs
- Power Supplies
- Industrial - Industrial controls
Chemistry
- Silicone - Silicone Elastomer
Application Method
- Dispenser - Automated metered mixing, Automated metered Dispensing
- Other - Manual mixing
Cure Method
- Heat
- 2-Part Cure
Color
- Black
Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
Brand
- Sylgard

Specifications

Cure Specs

Cure Temperature (°C)	25 to 50 Room temperature, 25	Test Method
Cure Time (min)	Fast, 12	Test Method
Viscosity (cPs)	Flowable, Low, 2,361
Work / Pot Time (min)	3.90	Test Method
Mix Ratio	1:1 (by volume)

Material Resistance

Flame Resistance	flame resistance
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55

Conductivity

Dissipation Factor		Test Method
Dielectric Strength (V/mil)	350
Dielectric Constant	3.53, 3.45	Test Method
Thermal Conductivity (W/m°K)	0.40	Test Method
Volume Resistivity (O)	2.42E+15 (ohms/cm)

Hardness

Shore A Hardness	41
Flexibility	Flexible

Business Information

Shelf Life Details	Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Exposure to moisture could reduce adhesion and cause bubbles to form. Encapsulant materials which contain higher levels of fillers that have been stored for long periods of time should typically be agitated or rolled prior to mixing to prevent separation and settle-out.

Best Practices for Dow Sylgard 170 Fast Cure Silicone Elastomer

*See Terms of Use Below
1. Surface Preparation
  
  In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.
2. Mixing
  
  These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.
3. Curing
  
  Thoroughly mixed Dow silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Dow silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two-part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).
Comparable Materials for Dow Sylgard 170 Fast Cure Silicone Elastomer

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Spec Engine^® Results
- Sylgard 182 Silicone Elastomer(Dow)
  A transparent; long pot life; two-part, 10:1 mix, heat cure elastomer, no exotherm during cure, repairable, good dielectric properties, flexible elastomer, low stress
- Sylgard 160 Silicone Elastomer(Dow)
  Two part; 1:1 mix; RT/HA cure; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; repairable; good dielectric properties; deep section cure; flexible elastomer.
- Sylgard 164 Silicone Elastomer(Dow)
  Two part; 1:1 mix; RT/HA cure; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; repairable; good dielectric properties; deep section cure; flexible elastomer.
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