Dow Sylgard 170 Fast Cure Silicone Elastomer Datasheet Dow Sylgard 170 Fast Cure Silicone Elastomer

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  • Description for Dow Sylgard 170 Fast Cure Silicone Elastomer

    Two-part, 1 to 1 mix, black, general purpose encapsulant with good flowability and flame resistance, faster cure at room temp.

    *See Terms of Use Below

    Brand Sylgard
    Application Type Encapsulant, Potting
    1 Part or 2 Part 2-Part
    Material Form Liquid, Silicone Elastomer
    Industry Relays, Sensors, Transformers, Connectors, Amplifiers, High voltage resistor packs
    Manufacturer Dow
    Chemistry Silicone, Silicone Elastomer
    Cure Method 2-Part Cure, Heat
    Cure Temperature (°C) 25 to 50 Room temperature, 25
    Cure Time (min) Fast, 12
    Viscosity (cPs) Flowable, Low, 2,361
    Color Black
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 2.42E+15 (ohms/cm)
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
  • Technical Data for Dow Sylgard 170 Fast Cure Silicone Elastomer

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Elastomer - Silicone Elastomer
      • Liquid
    • Industry
    • Chemistry
    • Application Method
      • Dispenser - Automated metered mixing, Automated metered Dispensing
      • Other - Manual mixing
    • Cure Method
      • Heat
      • 2-Part Cure
    • Color
      • Black
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 25 to 50 Room temperature, 25 Test Method
    Cure Time (min) Fast, 12 Test Method
    Viscosity (cPs) Flowable, Low, 2,361
    Work / Pot Time (min) 3.90 Test Method
    Mix Ratio 1:1 (by volume)
    Material Resistance
    Flame Resistance flame resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Conductivity
    Dissipation Factor Test Method
    Dielectric Strength (V/mil) 350
    Dielectric Constant 3.53, 3.45 Test Method
    Thermal Conductivity (W/m°K) 0.40 Test Method
    Volume Resistivity (O) 2.42E+15 (ohms/cm)
    Hardness
    Shore A Hardness 41
    Flexibility Flexible
    Business Information
    Shelf Life Details Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Exposure to moisture could reduce adhesion and cause bubbles to form. Encapsulant materials which contain higher levels of fillers that have been stored for long periods of time should typically be agitated or rolled prior to mixing to prevent separation and settle-out.
  • Best Practices for Dow Sylgard 170 Fast Cure Silicone Elastomer

    *See Terms of Use Below

    1. Surface Preparation

      In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.

    2. Mixing

      These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.

    3. Curing

      Thoroughly mixed Dow silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Dow silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two-part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
25 to 50°C Room temperature
25°C Cure
Cure Time Test Methods
Cure Time Test Method
Fast
12 min Cure
Work / Pot Time Test Methods
Work / Pot Time Temperature
3.90 min 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.53 100 Hz
3.45 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.40 W/m°K Moderate thermal conductivity