Dow Sylgard 170 Fast Cure Silicone Elastomer

Dow Sylgard 170 Fast Cure Silicone Elastomer Datasheet
  • Description for Dow Sylgard 170 Fast Cure Silicone Elastomer

    Two part; 1:1 mix; RT/HA cure; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; repairable; good dielectric properties; deep section cure; flexible elastomer.

    *See Terms of Use Below

    Brand Sylgard
    Application Type Pot, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone Elastomer
    Industry Amplifiers, Connectors, Relays, High voltage resistor packs, Sensors, Transformers, Housing and Assembly, Smart Meters, Insulation, Smart Home Devices, Headlamp assemblies, Electronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free, Silicone Elastomer
    Cure Method Part A/Part B, Heat
    Cure Temperature (°C) 25, 25
    Cure Time (min) Fast, 12
    Viscosity (cPs) Low, 2,361, Flowable
    Color Black, Dark Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0
  • Technical Data for Dow Sylgard 170 Fast Cure Silicone Elastomer

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Elastomer - Silicone Elastomer
      • Liquid
    • Industry
      • Housing and Assembly
      • Headlamp - Headlamp assemblies
      • Electronics - Relays
      • Amplifiers
      • Connectors
      • Voltage Resistors - High voltage resistor packs
      • Sensors
      • Transformers
      • Smart Meters
      • Smart Home Devices
      • Power Supplies
      • Industrial - Industrial controls
      • Insulation
    • Chemistry
    • Application Method
      • Dispenser - Automated metered mixing, Dispensing equipment
      • Other - Manual mixing
    • Cure Method
      • Heat
      • 2-Part Cure - Part A/Part B
    • Color
      • Black
      • Gray - Dark Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 25 Test Method
    Cure Time (min) Fast, 12 Test Method
    Viscosity (cPs) Low, 2,361, Flowable
    Linear Shrinkage (%) Minimal shrinkage
    Work / Pot Time (min) 3.90 Test Method
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Material Resistance
    Ozone Resistance Ozone resistance
    Flame Resistance flame resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor Test Method
    Dielectric Strength (V/mil) Good, Durable, 350
    Dielectric Constant 3.53, 3.45 Test Method
    Thermal Conductivity (W/m°K) 0.40, Moderate
    Volume Resistivity (O) 2.42E+15 (ohms/cm)
    Hardness
    Shore A Hardness 41
    Flexibility Flexible
    Other Properties
    Specific Gravity 1.380
    Flash Point (°F) 213.8
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning silicone encapsulants should be stored at or below 25°C (77°F). Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18
  • Best Practices for Dow Sylgard 170 Fast Cure Silicone Elastomer

    *See Terms of Use Below

    1. Surface Preparation

      In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.

    2. Mixing

      These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.

    3. Deairing/Degassing

      These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.

    4. Curing

      Thoroughly mixed Dow Corning silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Dow Corning silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two-part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).

    5. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
25°C
25°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
Cure Time Test Methods
Cure Time Test Method
Fast
12 min These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
Work / Pot Time Test Methods
Work / Pot Time Temperature
3.90 min 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
3.53 100 Hz
3.45 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method