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Description for Dow Sylgard 170 Fast Cure Silicone Elastomer
Two-part, 1 to 1 mix, black, general purpose encapsulant with good flowability and flame resistance, faster cure at room temp.Brand Sylgard Application Type Encapsulant, Potting 1 Part or 2 Part 2-Part Material Form Liquid, Silicone Elastomer Industry Relays, Sensors, Transformers, Connectors, Amplifiers, High voltage resistor packs Manufacturer Dow Chemistry Silicone, Silicone Elastomer Cure Method 2-Part Cure, Heat Cure Temperature (°C) 25 to 50 Room temperature, 25 Cure Time (min) Fast, 12 Viscosity (cPs) Flowable, Low, 2,361 Color Black High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 2.42E+15 (ohms/cm) Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0 -
Technical Data for Dow Sylgard 170 Fast Cure Silicone Elastomer
Overview
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Application Type
- Pottant / Encapsulant - Potting, Encapsulant
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1 Part or 2 Part
- 2-Part
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Material Form
- Elastomer - Silicone Elastomer
- Liquid
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Industry
- Electronics - Relays
- Sensors
- Transformers
- Connectors
- Amplifiers
- Voltage Resistors - High voltage resistor packs
- Power Supplies
- Industrial - Industrial controls
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Chemistry
- Silicone - Silicone Elastomer
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Application Method
- Dispenser - Automated metered mixing, Automated metered Dispensing
- Other - Manual mixing
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Cure Method
- Heat
- 2-Part Cure
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Color
- Black
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
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Brand
- Sylgard
Specifications
Cure Specs
Cure Temperature (°C) 25 to 50 Room temperature, 25 Test Method Cure Time (min) Fast, 12 Test Method Viscosity (cPs) Flowable, Low, 2,361 Work / Pot Time (min) 3.90 Test Method Mix Ratio 1:1 (by volume) Material Resistance
Flame Resistance flame resistance High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Conductivity
Dissipation Factor Test Method Dielectric Strength (V/mil) 350 Dielectric Constant 3.53, 3.45 Test Method Thermal Conductivity (W/m°K) 0.40 Test Method Volume Resistivity (O) 2.42E+15 (ohms/cm) Hardness
Shore A Hardness 41 Flexibility Flexible Business Information
Shelf Life Details Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Exposure to moisture could reduce adhesion and cause bubbles to form. Encapsulant materials which contain higher levels of fillers that have been stored for long periods of time should typically be agitated or rolled prior to mixing to prevent separation and settle-out. -
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Best Practices for Dow Sylgard 170 Fast Cure Silicone Elastomer
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Surface Preparation
In applications requiring adhesion, priming will be required for many of the silicone encapsulants. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.
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Mixing
These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation. In most cases de-airing is not required.
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Curing
Thoroughly mixed Dow silicone encapsulants may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the component being potted or encapsulated has many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed. Dow silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two-part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
25 to 50°C Room temperature | |
25°C | Cure |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
Fast | |
12 min | Cure |
Work / Pot Time Test Methods
Work / Pot Time | Temperature |
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3.90 min | 25°C |
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
3.53 | 100 Hz |
3.45 | 100 kHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|
Thermal Conductivity Test Methods
Thermal Conductivity | Test Method |
---|---|
0.40 W/m°K | Moderate thermal conductivity |

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