• Description for Dow Sylgard 184 Silicone Elastomer

    Two part; 10:1 mix; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; deep section cure; repairable; good dielectric properties; flexible elastomer.

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    Brand Sylgard
    Application Type Pot , Adhesive, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Industry Amplifiers, Electronics: Connectors, Electronics: Sensors, Electronics: Transformers, Electronics, High voltage resistor packs, Lead integrated circuit, Relays
    Manufacturer Dow
    Chemistry Silicone, Solvent-free, Silicone elastomer
    Cure Method Base/Curing Agent, Heat, Room Temperature Cure
    Cure Temperature (°C) 20 to 25, 100, 125, 150
    Viscosity (cPs) Flowable, 3,500
    Color Colorless
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) Good, 1.4118, 1.4225, 1.4028, 1.3997
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1, Mil-Spec (United States Military Standard): I-81550C: MIL-I-81550C, Type II, QPL
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
100°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
125°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
150°C These data were collected on 50-100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confrm adequate cure for your application, For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.
Cure Time Test Methods
Cure Time Test Method
Work / Pot Time Test Methods
Work / Pot Time Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.72 Dielectric constant, 100 Hz
2.68 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00257 Dissipation factor, 100 Hz
0.00133 Dissipation factor, 100 KHz
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
43 Durometer
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Test Method
Good
1.4118 @ 589 nm
1.4225 @ 632.8 nm
1.4028 @1321 nm
1.3997 @ 1554 nm