Brand Sylgard Application Type Encapsulating, Coating, Potting 1 Part or 2 Part 1 Part Material Form Gel Industry Optoelectronics, E-Mobility Solutions, Smart Meters, Various electronic devices Manufacturer Dow Chemistry Silicone Cure Method Heat Cure Temperature (°C) 20 to 25, 120 Cure Time (min) 60 Viscosity (cPs) Low, 375 Color Clear High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Light Refractive Index (RI) High
Technical Data for Dow Sylgard 537 One Part Dielectric Gel
1 Part or 2 Part
- 1 Part or 2 Part - 1 Part
- E-Mobility Solutions
- Electronics - Various electronic devices, Optoelectronics
- Smart Meters
- Dispenser - Automated dispensing equipment
- Clear / Transparent - Clear
Cure Temperature (°C) 20 to 25, 120 Test Method Cure Time (min) 60 Test Method Viscosity (cPs) Low, 375
High Temperature Resistance (°C) 200 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance
Dielectric Strength (V/mil) Excellent, 559 Volume Resistivity (O) 1.9E+15 (ohms/cm)
Flexibility Flexible, Resilient
Light Refractive Index (RI) High Specific Gravity 0.980 Test Method
Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label. Shelf Life Temperature (°F) 41 Shelf Life (mon) 9
Not Good For
Don't Use For Other sulfur containing materials, Polysulfones, Polysulfides, Sulfur, Silicone rubber containing organotin catalyst, Organometallic compounds, Unsaturated hydrocarbon plasitcizers, Organotin compounds, Some solder flux residues
Best Practices for Dow Sylgard 537 One Part Dielectric Gel
Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.
If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). For one-part products the viscosity either increases at a much lower rate or does not change significantly at RT. Cure conditions are shown in the typical properties table. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application.
Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.
If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.
Comparable Materials for Dow Sylgard 537 One Part Dielectric Gel
Spec Engine® Results
Questions about this material?
Get personal assistance with your specific application needs.