Dow Sylgard 537 One Part Dielectric Gel

Dow Sylgard 537 One Part Dielectric Gel Datasheet
  • Description for Dow Sylgard 537 One Part Dielectric Gel

    Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    *See Terms of Use Below

    Brand Sylgard
    Application Type Encapsulating, Coating, Potting
    1 Part or 2 Part 1 Part
    Material Form Gel
    Industry Optoelectronics, E-Mobility Solutions, Smart Meters, Smart Home Devices, Various electronic devices
    Manufacturer Dow
    Chemistry Silicone
    Cure Method Heat
    Cure Temperature (°C) 20 to 25, 120
    Cure Time (min) 60
    Viscosity (cPs) Low, 375
    Color Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data for Dow Sylgard 537 One Part Dielectric Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Electronics - Various electronic devices, Optoelectronics
      • Smart Meters
      • Smart Home Devices
    • Chemistry
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • Heat
    • Color
      • Clear / Transparent - Clear
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 120 Test Method
    Cure Time (min) 60 Test Method
    Viscosity (cPs) Low, 375
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dielectric Strength (V/mil) Excellent, 559
    Volume Resistivity (O) 1.9E+15 (ohms/cm)
    Hardness
    Flexibility Flexible, Resilient
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.980 Test Method
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 41
    Shelf Life (mon) 9
    Not Good For
    Don't Use For Other sulfur containing materials, Polysulfones, Polysulfides, Sulfur, Silicone rubber containing organotin catalyst, Organometallic compounds, Unsaturated hydrocarbon plasitcizers, Organotin compounds, Some solder flux residues
  • Best Practices for Dow Sylgard 537 One Part Dielectric Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment.

    2. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    3. Curing

      Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). For one-part products the viscosity either increases at a much lower rate or does not change significantly at RT. Cure conditions are shown in the typical properties table. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application.

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    4. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.

  • Comparable Materials for Dow Sylgard 537 One Part Dielectric Gel

    *See Terms of Use Below

    Spec Engine® Results

Questions about this material?

Get personal assistance with your specific application needs.

Your Profile Edit
  1. 5a1a58b6-17ee-4aad-a631-e95bee5f6814
  2. 5a1a58b6-17ee-4aad-a631-e95bee5f6814

Popular Articles

Testing the effectiveness of surface treatments

Read Article

Silicones in LED Lighting | Gluespec

Read Article

Electrically Conductive Adhesives

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
120°C Heat cure
Cure Time Test Methods
Cure Time Test Method
60 min Heat cure
Specific Gravity Test Methods
Specific Gravity Test Method
0.980 Cured or uncured A & B.