Dow Sylgard 567 Primerless Silicone Encapsulant Datasheet Dow Sylgard 567 Primerless Silicone Encapsulant

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  • Description for Dow Sylgard 567 Primerless Silicone Encapsulant

    A two-part, heat cure, 1 to 1 mix, black encapsulant with good flame resistance, flowable, self-priming, good dielectric properties

    *See Terms of Use Below

    Brand Sylgard
    Chemical Resistance Good
    Application Type Pot, Encapsulant
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Substrate Primerless
    Industry Relays, E-Mobility Solutions, Smart Meters, Insulation, Smart Home Devices, Headlamp assemblies, Solar cells, Amplifiers, Connectors, LED lighting, Automotive assembly, High voltage resistor packs, PCB system assembly applications, Electronics, Electrical assembly applications, Electrical devices
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Heat cure, 2-Part Cure, Room temperature cure
    Cure Temperature (°C) 70, 100, 25 Room temperature
    Cure Time (min) 180, 120, Rapid
    Viscosity (cPs) 1,540, Flowable, Self-priming, Low
    Color Black
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200, <60
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0 Recognized, Mil-Spec (United States Military Standard): PRF-23586F (Grade B2): MIL-PRF-2358 6F (Grade B2) Type 1, Class IV QPL

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
70°C These values are not intended for use in preparing specifications.
100°C These values are not intended for use in preparing specifications.
25°C Room temperature
Cure Time Test Methods
Cure Time Test Method
180 min These values are not intended for use in preparing specifications.
120 min These values are not intended for use in preparing specifications.
Rapid
Viscosity Test Methods
Viscosity Test Method
1,540 cPs
Flowable
Self-priming
Low
Work / Pot Time Test Methods
Work / Pot Time Temperature
>4,320 min 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz, These values are not intended for use in preparing specifications.
2.79 at 100 kHz, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good dielectric properties
Durable
405 V/mil These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00800 At 100 Hz, These values are not intended for use in preparing specifications.
0.00200 At 100 kHz, These values are not intended for use in preparing specifications.
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.502 (BTU/hr ft °F) These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
6e16 (ohm *cm) These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
40 Durometer, These values are not intended for use in preparing specifications.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
300 (µm/m- °C) Linear CTE (by DMA), These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
1.240 Uncured, These values are not intended for use in preparing specifications.