Dow Sylgard 567 Primerless Silicone Encapsulant

Dow Sylgard 567 Primerless Silicone Encapsulant Datasheet
  • Description for Dow Sylgard 567 Primerless Silicone Encapsulant

    A two-part, heat cure, 1 to 1 mix, black encapsulant with good flame resistance, flowable, self-priming, good dielectric properties

    *See Terms of Use Below

    Brand Sylgard
    Application Type Pot, Encapsulant
    1 Part or 2 Part 2 Part
    Material Form Liquid, Silicone elastomer
    Substrate Primerless
    Industry Relays, E-Mobility Solutions, Smart Meters, Insulation, Smart Home Devices, Headlamp assemblies, Solar cells, Amplifiers, Connectors, LED lighting, Automotive assembly, High voltage resistor packs, PCB system assembly applications, Electronics, Electrical assembly applications, Electrical devices
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Heat cure, 2-Part Cure, Room temperature cure
    Cure Temperature (°C) 70, 100, 25 Room temperature
    Cure Time (min) 180, 120, Rapid
    Viscosity (cPs) 1,540, Flowable, Self-priming, Low
    Color Black
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200, <60
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0 Recognized, Mil-Spec (United States Military Standard): PRF-23586F (Grade B2): MIL-PRF-2358 6F (Grade B2) Type 1, Class IV QPL
  • Technical Data for Dow Sylgard 567 Primerless Silicone Encapsulant

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Elastomer - Silicone elastomer
      • Liquid
    • Substrate
      • Primerless
    • Industry
      • LED (Light-Emitting Diodes) - LED lighting
      • Automotive - Automotive assembly
      • E-Mobility Solutions
      • Headlamp - Headlamp assemblies
      • Electronics - Relays, Electrical assembly applications, Electrical devices
      • Smart Meters
      • Smart Home Devices
      • Solar cells
      • Amplifiers
      • Connectors
      • Voltage Resistors - High voltage resistor packs
      • Printed Circuit Board (PCB) - PCB system assembly applications
      • Power Supplies
      • Industrial - General potting applications, Industrial controls
      • Insulation
    • Application Method
      • Dispenser - Automated metered mixing and dispensing, Manual mixing
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • Heat - Heat cure
      • 2-Part Cure
    • Color
      • Black
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V0 - UL 94 V-0 Recognized
      • Mil-Spec (United States Military Standard): PRF-23586F (Grade B2): Type I, Class IV, QPL - MIL-PRF-2358 6F (Grade B2) Type 1, Class IV QPL
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 70, 100, 25 Room temperature Test Method
    Cure Time (min) 180, 120, Rapid Test Method
    Viscosity (cPs) 1,540, Flowable, Self-priming, Low Test Method
    Linear Shrinkage (%) Minimal shrinkage
    Work / Pot Time (min) >4,320 Test Method
    Mix Ratio 1:1 (by volume), 1:1 (by weight)
    Material Resistance
    Ozone Resistance Ozone resistance
    Flame Resistance Good flame resistance
    Chemical Resistance Good
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200, <60
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00800, 0.00200 Test Method
    Dielectric Strength (V/mil) Good dielectric properties, Durable, 405 Test Method
    Dielectric Constant 2.85, 2.79 Test Method
    Thermal Conductivity (W/m°K) 0.502 (BTU/hr ft °F) Test Method
    Volume Resistivity (O) 6e16 (ohm *cm) Test Method
    Hardness
    Shore A Hardness 40 Test Method
    Other Properties
    Specific Gravity 1.240 Test Method
    Coefficient of Thermal Expansion (CTE) 300 (µm/m- °C) Test Method
    Flash Point (°F) 239.0
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.aShelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.
    Shelf Life Temperature (°F) 77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
    Not Good For
    Don't Use For Chemicals, Organotin, Silicone rubber containing organotin catalyst, Polysulfones, Unsaturated hydrocarbon plasticizers, Curing agents, Other organometallic compounds, Polysulfides, Other sulfur containing materials, Some solder flux residues
    Don't Use With Certain materials, Sulfur, Plasticizers
  • Best Practices for Dow Sylgard 567 Primerless Silicone Encapsulant

    *See Terms of Use Below

    1. Surface Preparation

      In applications requiring good adhesion, priming may be required for many of the silicone encapsulants which are “non–primerless”. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.

    2. Application

      Thoroughly mixed SYLGARD silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the components being potted or encapsulated have many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed.

    3. Mixing

      These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation.

    4. Deairing/Degassing

      In most cases de-airing is not required.

    5. Curing

      SYLGARD silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).

    6. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    7. Removal

      In the manufacture of electrical devices and PCB system assemblies it is often desirable to salvage or reclaim damaged or defective units. With most non-silicone rigid potting/encapsulating materials, removal or entry is difficult or impossible without causing excessive damage to internal circuitry. SYLGARD silicone encapsulants can be selectively removed with relative ease, depending on the chosen remove method and technique and repairs or changes accomplished, and the repaired area repotted in place with additional product. To remove silicone elastomers, simply cut with a sharp blade or knife and tear and remove unwanted material from the area to be repaired. Sections of the adhered elastomer are best removed from substrates and circuitry by mechanical action such as scraping or rubbing and can be assisted by applying Dow OS fluids to swell the elastomer. Before applying additional encapsulant to a repaired device, roughen the exposed surfaces of the cured encapsulant with an abrasive paper and rinse with a suitable solvent and dry. This will enhance adhesion and permit the repaired material to become an integral matrix with the existing encapsulant. Silicone prime coats are not recommended for adhering products to themselves.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
70°C These values are not intended for use in preparing specifications.
100°C These values are not intended for use in preparing specifications.
25°C Room temperature
Cure Time Test Methods
Cure Time Test Method
180 min These values are not intended for use in preparing specifications.
120 min These values are not intended for use in preparing specifications.
Rapid
Viscosity Test Methods
Viscosity Test Method
1,540 cPs
Flowable
Self-priming
Low
Work / Pot Time Test Methods
Work / Pot Time Temperature
>4,320 min 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz, These values are not intended for use in preparing specifications.
2.79 at 100 kHz, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good dielectric properties
Durable
405 V/mil These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00800 At 100 Hz, These values are not intended for use in preparing specifications.
0.00200 At 100 kHz, These values are not intended for use in preparing specifications.
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.502 (BTU/hr ft °F) These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
6e16 (ohm *cm) These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
40 Durometer, These values are not intended for use in preparing specifications.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
300 (µm/m- °C) Linear CTE (by DMA), These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
1.240 Uncured, These values are not intended for use in preparing specifications.