Dow Sylgard 567 Primerless Silicone Encapsulant Datasheet Dow Sylgard 567 Primerless Silicone Encapsulant

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  • Description for Dow Sylgard 567 Primerless Silicone Encapsulant

    • A two part component • Heat cure • Black color • Good flame resistance • Flowable • Good dielectric properties • Low viscosity • Encapsulant for solar cells • Rapid cure • Automotive assembly applications • Power supplies applications.

    *See Terms of Use Below

    Brand Sylgard
    Application Type Potting, Encapsulant
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Primerless
    Industry Relays applications, Automotive assembly applications, LED lighting applications, Solar cells applications, Suited for the protection of PCB system assembly applications, Connectors applications, Amplifiers applications, High voltage resistor packs applications, Electronics, Suited for the protection of electrical assembly applications, Electrical devices
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2-Part Cure, Heat cure, Room temperature cure
    Cure Temperature (°C) 70, 100
    Cure Time (min) 180, 120, Rapid
    Viscosity (cPs) Flowable, Self-priming, Low
    Color Black
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 6e16 (ohm *cm)
    Key Specifications Mil-Spec (United States Military Standard): PRF-23586F (Grade B2): MIL-PRF-2358 6F (Grade B2) Type 1, Class IV QPL, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0 Recognized

  • Technical Data for Dow Sylgard 567 Primerless Silicone Encapsulant

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
      • Primerless - Primerless
    • Industry
      • LED (Light-Emitting Diodes) - LED lighting applications
      • Automotive - Automotive assembly applications
      • Electronics - Relays applications, Suited for the protection of electrical assembly applications, Electrical devices
      • Solar cells - Solar cells applications
      • Printed Circuit Board (PCB) - Suited for the protection of PCB system assembly applications
      • Connectors - Connectors applications
      • Amplifiers - Amplifiers applications
      • Voltage Resistors - High voltage resistor packs applications
      • Power Supplies - Power supplies applications
      • Industrial - General potting applications, Industrial controls applications
    • Chemistry
    • Application Method
      • Dispenser - Automated metered mixing and dispensing
      • Other - Manual mixing
    • Cure Method
      • Room Temperature / Air Dry - Room temperature cure
      • Heat - Heat cure
      • 2-Part Cure
    • Color
      • Black
    • Key Specifications
      • Mil-Spec (United States Military Standard) : PRF-23586F (Grade B2) : Type I, Class IV, QPL - MIL-PRF-2358 6F (Grade B2) Type 1, Class IV QPL
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0 Recognized
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 70, 100 Test Method
    Cure Time (min) 180, 120, Rapid Test Method
    Viscosity (cPs) Flowable, Self-priming, Low
    Mix Ratio 1:1
    Material Resistance
    Flame Resistance Good flame resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Conductivity
    Dissipation Factor 0.00800, 0.00200 Test Method
    Dielectric Strength (V/mil) Good dielectric properties, 405 Test Method
    Dielectric Constant 2.85, 2.79 Test Method
    Thermal Conductivity (W/m°K) 0.17 (BTU/hr ft °F) Test Method
    Volume Resistivity (O) 6e16 (ohm *cm) Test Method
    Hardness
    Shore A Hardness 40 Test Method
    Other Properties
    Specific Gravity 1.240 Test Method
    Coefficient of Thermal Expansion (CTE) 300 (µm/m- °C) Test Method
    Business Information
    Shelf Life Temperature (°F) 77
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 24
    Not Good For
    Don't Use For Chemicals, Organotin, Sulfur, Silicone rubber containing organotin catalyst, Unsaturated hydrocarbon plasticizers, Curing agents, Other sulfur containing materials, Polysulfides, Some solder flux residues
    Don't Use With Certain materials, Plasticizers, Polysulfones, Other organometallic compounds

  • Best Practices for Dow Sylgard 567 Primerless Silicone Encapsulant

    *See Terms of Use Below

    1. Surface Preparation

      In applications requiring good adhesion, priming may be required for many of the silicone encapsulants which are “non-primerless”. For best results, the primer should be applied in a very thin, uniform coating and then wiped off after application. After application, it should be thoroughly cured prior to application of the silicone elastomer. Additional instructions for primer usage can be found in the information sheets specific to the individual primers.

    2. Application

      Thoroughly mixed SYLGARD silicone encapsulant may be poured/dispensed directly into the container in which it is to be cured. Care should be taken to minimize air entrapment. When practical, pouring/dispensing should be done under vacuum, particularly if the components being potted or encapsulated have many small voids. If this technique cannot be used, the unit should be evacuated after the silicone encapsulant has been poured/dispensed.

    3. Mixing

      These products are supplied in a 1 to 1 mix ratio, which is very robust in manufacturing environments and allows for some process and dispense equipment variation.

    4. Deairing/Degassing

      In most cases de-airing is not required.

    5. Curing

      SYLGARD™ silicone encapsulants may be either room temperature (25°C/77°F) or heat cured. Room temperature cure encapsulants may also be heat accelerated for faster cure. Ideal cure conditions for each product are given in the product selection table. Two-part condensation cure encapsulants should not be heat accelerated above 60°C (140°F).

      For most uses, silicone elastomers should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time. However, at both the low- and high temperature ends of the spectrum, behavior of the materials and performance in particular applications can become more complex and require additional considerations and should be adequately tested for the particular end use environment. For low-temperature performance, thermal cycling to conditions such as -55°C (-67°F) may be possible, but performance should be verified for your parts or assemblies. Factors that may influence performance are configuration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high-temperature end, the durability of the cured silicone elastomer is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain useable.

    6. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    7. Removal

      In the manufacture of electrical devices and PCB system assemblies it is often desirable to salvage or reclaim damaged or defective units. With most non-silicone rigid potting/encapsulating materials, removal or entry is difficult or impossible without causing excessive damage to internal circuitry. SYLGARD silicone encapsulants can be selectively removed with relative ease, depending on the chosen remove method and technique and repairs or changes accomplished, and the repaired area repotted in place with additional product. To remove silicone elastomers, simply cut with a sharp blade or knife and tear and remove unwanted material from the area to be repaired. Sections of the adhered elastomer are best removed from substrates and circuitry by mechanical action such as scraping or rubbing and can be assisted by applying Dow OS fluids to swell the elastomer. Before applying additional encapsulant to a repaired device, roughen the exposed surfaces of the cured encapsulant with an abrasive paper and rinse with a suitable solvent and dry. This will enhance adhesion and permit the repaired material to become an integral matrix with the existing encapsulant. Silicone prime coats are not recommended for adhering products to themselves.

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
70°C These values are not intended for use in preparing specifications.
100°C These values are not intended for use in preparing specifications.
Cure Time Test Methods
Cure Time Test Method
180 min These values are not intended for use in preparing specifications.
120 min These values are not intended for use in preparing specifications.
Rapid
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz, These values are not intended for use in preparing specifications.
2.79 At 100 kHz, These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Good dielectric properties
405 V/mil These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00800 At 100 Hz, These values are not intended for use in preparing specifications.
0.00200 At 100 kHz, These values are not intended for use in preparing specifications.
Thermal Conductivity Test Methods
Thermal Conductivity Test Method
0.17 (BTU/hr ft °F) These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
6e16 (ohm *cm) These values are not intended for use in preparing specifications.
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
40 Durometer, These values are not intended for use in preparing specifications.
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
300 (µm/m- °C) Linear CTE (by DMA), These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
1.240 Uncured, These values are not intended for use in preparing specifications.