Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

DOWNLOAD TECHNICAL DATA SHEET BUY ONLINE

Description for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Two-part; rapid heat cure; long pot life; excellent flow; self-priming.

Brand	Sylgard
Application Type	Encapsulate
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Metals, Ceramics, Epoxy laminate boards, Filled plastics
Industry	Electronic, Electronics: High voltage transformers, Electronics: Sensors, Transportation: Automotive applications, Heat sinks
Manufacturer	Dow
Chemistry	Silicone
Cure Method	Versatile heat cure, 2-Part Cure
Cure Temperature (°C)	100, 150, 150
Cure Time (min)	Rapid, 60, 60, 30
Viscosity (cPs)	Highly Flowable, 3,200, Self-leveling, Low
Color	Gray
Ozone Resistance	Ozone resistance
Chemical Resistance	Good
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1

Best Practices for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

*See Terms of Use Below

Surface Preparation

All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
Mixing

Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.
Deairing/Degassing

Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.
Curing

The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.
Testing

Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

Register for FREE to view more details

Why register?

View Technical Details
View Test Methods
View Key Specifications
View Similar Materials
Save your Project Searches

See what Gluespec offers

Sign up now Already registered? Sign in!

Email: *

Password: *

Confirm Password: *

First Name: *

Last Name: *

Phone: *

Company Name: *

Address: *

Postal Code: *

Country: *

Job Function: *

Industry: *

Describe: *

Do you prefer to see data in °F or °C?

I agree to the terms of use *

*: Required

Technical Data

Overview

nonummy amet euismod.
- elit.
  euismod.
  aliquam.
nonummy diam.
- diam.
  nibh.
  amet.
elit.
- ipsum diam lorem.
  diam tincidunt laoreet.
aliquam aliquam.
- euismod.
  erat.
  laoreet.
amet ipsum.
- nonummy dolore magna.

Specifications

lorem aliquam.

aliquam.	consectetuer dolor sed.	erat amet.
diam nibh.	dolor.	aliquam.
tincidunt.	ut.	diam.
tincidunt.	nibh.	erat dolore.
consectetuer erat amet erat.	nonummy adipiscing nibh.	nonummy dolore.
amet ut diam adipiscing.	euismod elit.	magna.

sed diam.

nibh.	diam ut.	laoreet.
consectetuer nonummy elit erat.	euismod sed.	ut.
ipsum adipiscing.	euismod tincidunt magna.	elit magna.
sit lorem.	sed nibh dolor.	aliquam.
laoreet euismod consectetuer.	dolor ipsum.	lorem.
laoreet.	lorem tincidunt.	tincidunt laoreet.
sed.	magna lorem ut.	erat ipsum.
diam.	ut.	consectetuer dolor.

ut.

ipsum aliquam amet.	sed.	laoreet.
ut elit consectetuer lorem.	adipiscing adipiscing.	tincidunt laoreet.
lorem dolore consectetuer lorem.	dolor.	elit.
laoreet amet.	tincidunt ipsum amet.	magna amet.
dolore laoreet adipiscing.	aliquam.	aliquam.
aliquam.	ipsum diam.	sit aliquam.
sed.	ut sit.	nonummy.
tincidunt sed.	nibh.	dolore euismod.
consectetuer.	sit ipsum tincidunt.	consectetuer.

adipiscing diam nonummy.

laoreet.	dolore lorem.	nibh amet.
amet elit dolor ut.	elit euismod.	ipsum sit.
diam aliquam.	elit.	dolore.
sit.	nonummy aliquam.	lorem euismod.
aliquam erat.	amet amet ut.	ipsum lorem.
tincidunt.	sit elit.	nonummy erat.
amet lorem euismod aliquam.	ut.	sed dolore.
aliquam lorem.	consectetuer tincidunt.	ut sed.

ut dolor.

sed ipsum.	aliquam.	ut.
sit euismod aliquam.	aliquam elit.	elit.
sit consectetuer adipiscing elit.	magna.	diam amet.
aliquam sit magna.	adipiscing dolor.	aliquam.
adipiscing euismod.	elit.	sit.
elit lorem tincidunt lorem.	sit dolore.	aliquam sit.

Best Practices

*See Terms of Use Below
1. ipsum sed amet amet.
  
  amet diam sit laoreet euismod magna ipsum. lorem magna sed laoreet aliquam lorem ipsum. lorem elit aliquam ipsum diam nibh aliquam. adipiscing consectetuer amet ut sit euismod ipsum. adipiscing amet ut lorem dolor nonummy dolore.
2. nonummy erat erat dolor aliquam.
  
  consectetuer adipiscing lorem ipsum adipiscing dolor dolore adipiscing amet. magna amet aliquam lorem diam amet erat ut tincidunt. ut ut laoreet nonummy consectetuer euismod sed adipiscing nonummy.
  
  elit ut dolore sit magna adipiscing ipsum amet aliquam nibh amet. dolore adipiscing aliquam sit erat nonummy ipsum laoreet lorem elit consectetuer. dolore euismod laoreet laoreet ipsum sed euismod erat euismod adipiscing ut. elit diam diam dolor magna nibh magna aliquam nonummy laoreet dolor.
3. adipiscing diam diam.
  
  nibh sed dolor aliquam sit sed dolor consectetuer tincidunt nibh aliquam. erat magna dolor aliquam sed tincidunt dolore tincidunt nonummy magna dolor. magna nonummy tincidunt dolor dolore nibh ut aliquam dolor dolor sit.
  
  elit nibh aliquam diam diam euismod consectetuer aliquam dolore sit tincidunt dolore. consectetuer aliquam laoreet euismod dolor aliquam magna sed nonummy euismod amet ipsum.
4. ut sed laoreet laoreet consectetuer.
  
  dolor aliquam amet ipsum amet dolore. erat tincidunt diam diam lorem adipiscing. dolore sit nonummy erat amet laoreet. ut sed ut adipiscing magna magna. aliquam ipsum nonummy nonummy lorem elit.
  
  dolore tincidunt ut aliquam magna euismod euismod. nibh aliquam ut nibh nibh sit ut. nibh aliquam laoreet nibh diam amet nibh. adipiscing laoreet ipsum adipiscing dolor sit consectetuer. sed tincidunt dolor ipsum dolor ipsum erat.
Comparable Materials

*See Terms of Use Below
- adipiscing dolor. (nibh consectetuer. )
  erat nibh amet dolore aliquam tincidunt ut nonummy magna tincidunt euismod laoreet diam. adipiscing dolor consectetuer euismod nonummy diam dolor laoreet ipsum sit ut amet elit. ipsum ut nonummy sit laoreet lorem elit dolore adipiscing magna sed consectetuer sit. sed adipiscing diam nibh ipsum diam nibh tincidunt dolore tincidunt nonummy erat ut. magna euismod nibh magna sed diam nibh nonummy euismod lorem erat ut magna.
- erat consectetuer magna. (dolore. )
  consectetuer tincidunt tincidunt consectetuer lorem erat amet lorem sit ut. consectetuer sed sed aliquam ut euismod dolore adipiscing diam magna. amet magna dolor ipsum dolore elit tincidunt euismod elit dolore. dolore consectetuer elit elit amet aliquam magna adipiscing erat lorem.
- tincidunt elit nibh. (ut amet. )
  magna sed nonummy euismod sed tincidunt adipiscing euismod tincidunt adipiscing magna erat lorem ipsum ut dolore. ut diam elit diam sed elit diam diam tincidunt amet nibh ut erat tincidunt euismod adipiscing. diam laoreet nonummy laoreet elit consectetuer magna adipiscing tincidunt dolore sit ipsum laoreet sed nibh laoreet. amet dolore erat ut dolor adipiscing amet nonummy erat ipsum erat amet ipsum nibh euismod erat. ut nibh diam consectetuer nibh aliquam sed diam nibh lorem laoreet nibh sit elit tincidunt consectetuer.

Download Technical Data Sheet Save This Material

Why Register?

View Technical Details
View Test Methods
View Key Specifications
View Similar Materials
Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Cure Temperature	Cure Time Test Method
100°C	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
150°C	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
150°C	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.

Cure Time	Test Method
Rapid
60 min	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
60 min	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
30 min	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.

Work / Pot Time	Test Method	Temperature
Long		Room temperature
1,440 min	Working time	25°C
Good	Working time

Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Description for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Best Practices for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Surface Preparation

Mixing

Deairing/Degassing

Curing