Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

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Description for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Two-part; rapid heat cure; long pot life; excellent flow; self-priming.

Brand	Sylgard
Application Type	Encapsulate
1 Part or 2 Part	2 Part
Material Form	Liquid
Substrate	Ceramics, Metals, Filled plastics, Epoxy laminate boards
Industry	Electronic, Transportation: Automotive applications, Electronics: Sensors, Electronics: High voltage transformers, Heat sinks
Manufacturer	Dow
Chemistry	Silicone
Cure Method	2-Part Cure, Versatile heat cure
Cure Temperature (°C)	100, 150, 150
Cure Time (min)	Rapid, 60, 60, 30
Viscosity (cPs)	Highly Flowable, 3,200, Self-leveling, Low
Color	Gray
Ozone Resistance	Ozone resistance
Chemical Resistance	Good
High Temperature Resistance (°C)	200
Low Temperature Resistance (°C)	-45, -55
Key Specifications	UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1

Best Practices for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

*See Terms of Use Below

Surface Preparation

All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.
Mixing

Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.
Deairing/Degassing

Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.
Curing

The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.
Testing

Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

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Technical Data

Overview

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Specifications

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Best Practices

*See Terms of Use Below
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Cure Temperature Test Methods

Cure Temperature	Cure Time Test Method
100°C	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
150°C	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
150°C	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.

Cure Time Test Methods

Cure Time	Test Method
Rapid
60 min	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
60 min	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
30 min	Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.

Work / Pot Time Test Methods

Work / Pot Time	Test Method	Temperature
Long		Room temperature
1,440 min	Working time	25°C
Good	Working time

Thermal Conductivity Test Methods

Thermal Conductivity	Temperature
0.80 W/m°K	25°C

Shore A Hardness Test Methods

Shore A Hardness	Shore Hardness Test Method
89	Durometer

Specific Gravity Test Methods

Specific Gravity	Test Method
2.150	Cured

Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Description for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Best Practices for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Surface Preparation

Mixing

Deairing/Degassing

Curing

Testing

Register for FREE to view more details

Why register?

Sign up now Already registered? Sign in!

Technical Data

Overview

erat consectetuer aliquam.

ut sit tincidunt ipsum.

adipiscing laoreet.

Specifications

ut ut.

ut lorem.

elit.

Best Practices

aliquam magna aliquam magna adipiscing.

nibh elit ipsum euismod.

adipiscing dolore nonummy amet.

Comparable Materials

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Gluespec Poll

What level of expertise do you have in specialty chemicals like adhesives, sealants, conformal coatings, etc.?

Cure Temperature Test Methods

Cure Time Test Methods

Work / Pot Time Test Methods

Thermal Conductivity Test Methods

Shore A Hardness Test Methods

Specific Gravity Test Methods

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