Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant Datasheet Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

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  • Description for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

    Two-part; rapid heat cure; long pot life; excellent flow; self-priming.

    *See Terms of Use Below

    Brand Sylgard
    Chemical Resistance Good
    Application Type Encapsulate
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Substrate Ceramics, Metals, Filled plastics, Epoxy laminate boards
    Industry Electronic, Automotive applications, Sensors, High voltage transformers, Smart Meters, E-Mobility Solutions, Smart Home Devices, Heat sinks
    Manufacturer Dow
    Chemistry Silicone
    Cure Method 2-Part Cure, Versatile heat cure
    Cure Temperature (°C) 100, 150, 150
    Cure Time (min) Rapid, 60, 60, 30
    Viscosity (cPs) 3,200, Highly Flowable, Self-leveling, Low
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 1E+13 (ohms/cm)
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1

  • Technical Data for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

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    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Substrate
      • Ceramic - Ceramics
      • Metal - Metals
      • Plastic - Filled plastics
      • Wood - Epoxy laminate boards
      • Other - Hybrid substrates, A variety of common substrates, Reactive materials
    • Industry
      • Smart Meters
      • Smart Home Devices
      • Automotive - Automotive applications
      • E-Mobility Solutions
      • Electronics - Electronic, Heat sinks
      • Sensors
      • Transformers - High voltage transformers
      • Industrial - Industrial applications
    • Chemistry
    • Application Method
      • Dispenser - Automated, Manual dispensing
    • Cure Method
      • Heat - Versatile heat cure
      • 2-Part Cure
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V-1 - UL 94 V-1
    • Brand
      • Sylgard
    Specifications
    Cure Specs
    Cure Temperature (°C) 100, 150, 150 Test Method
    Cure Time (min) Rapid, 60, 60, 30 Test Method
    Viscosity (cPs) 3,200, Highly Flowable, Self-leveling, Low
    Work / Pot Time (min) Long, 1,440, Good Test Method
    Thixotropic Excellent
    Mix Ratio 1:1 (by volume)
    Bond Strength
    Tensile Strength (psi) 957
    Material Resistance
    Flame Resistance Flame resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    Environmental Resistance Environmental resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dielectric Strength (V/mil) Durable, 660
    Thermal Conductivity (W/m°K) 0.80 Test Method
    Volume Resistivity (O) 1E+13 (ohms/cm)
    Hardness
    Shore A Hardness 89 Test Method
    Elongation (%) 55
    Flexibility Flexible
    Other Properties
    Specific Gravity 2.150 Test Method
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use By” date found on the product label. For best results, Dow Corning thermally conductive materials should be stored at or below the maximum specified storage temperature. Special precautions must be taken to prevent moisture from contacting these materials. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. Any special storage and handling instructions will be printed on the product containers.
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 12
    Not Good For
    Don't Use With non-reactive metal substrates, non-reactive plastic surfaces, Teflon, polyethylene, polypropylene.

  • Best Practices for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces should be thoroughly cleaned and/or degreased with solvents such as Dow Corning® brand OS Fluids, naphtha, mineral spirits, or methyl ethyl ketone (MEK). Light surface abrasion is recommended whenever possible, because it promotes good cleaning and increases the surface area for bonding. A final surface wipe with acetone or IPA is also useful to remove residues that may be left behind by other cleaning methods. On some surfaces, different cleaning techniques will give better results than others. Users should determine the best techniques for their applications.

    2. Mixing

      Upon standing, some filler may settle to the bottom of the liquid after several weeks. To ensure a uniform product mix, the material in each container should be thoroughly mixed prior to use. Two-part materials should be mixed in the proper ratio either by weight or volume. The presence of light-colored streaks or marbling indicates inadequate mixing.

    3. Deairing/Degassing

      Automated airless dispense equipment can be used to reduce or avoid the need to de-air. If de-airing is required to reduce voids in the cured elastomer, consider a vacuum de-air schedule of >28 inches Hg (or a residual pressure of 10-20 mm of Hg) for 10 minutes or until bubbling subsides.

    4. Curing

      The one-part moisture-cure adhesives are generally cured at room temperature and in a range of 20 to 80 percent relative humidity. Greater than 90 percent of their full physical properties should be attained within 24 to 72 hours depending on the product chosen. These materials are not typically used for highly confined or deep section cures. Materials will generally cure about 0.25 inch (6.35 mm) per 7 days. Addition-cure adhesives should be cured at 100ºC (212ºF) or above. The cure rate is rapidly accelerated with heat (see heat-cure times in Typical Properties table). Thin sections of less than 2 mils may be cured in 15 minutes at 150ºC (302ºF). For thicker sections, a pre-cure at 70ºC (158ºF) may be necessary to reduce voids in the elastomer. Length of pre-cure will depend on section thickness and confinement of adhesive. It is recommended that 30 minutes at 70ºC (158ºF) be used as a starting point for determining necessary pre-cure time. Addition-curing materials contain all the ingredients needed for cure with no by-products from the cure mechanism. Deep-section or confined cures are possible. Cure progresses evenly throughout the material. These adhesives generally have long working times.

    5. Testing

      Due to the wide variety of substrate types and differences in substrate surface conditions, general statements on adhesion and bond strength are impossible. To ensure maximum bond strength for elastomers and adhesives on a particular substrate, 100 percent cohesive failure of the adhesive in a lap shear or similar adhesive strength is needed. This ensures compatibility of the adhesive with the substrate being considered. Also, this test can be used to determine minimum cure time or to detect the presence of surface contaminants such as mold release agents, oils, greases and oxide films.

  • Comparable Materials for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

    *See Terms of Use Below

    Spec Engine® Results

    • Dow
      Sylgard 182 Silicone Elastomer(Dow)

      A transparent; long pot life; two-part, 10:1 mix, heat cure elastomer, no exotherm during cure, repairable, good dielectric properties, flexible elastomer, low stress

    • Dow
      Sylgard 160 Silicone Elastomer(Dow)

      Two part; 1:1 mix; RT/HA cure; minimal shrinkage; no exotherm during cure; no solvents or cure byproducts; repairable; good dielectric properties; deep section cure; flexible elastomer.

    • Dow
      SE 4410 Encapsulant(Dow)

      • Two-part • Heat cure • Polydimethylsiloxane encapsulant • Flexible elastomer •Durable dielectric insulation

    • Compare All
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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Cure Time Test Methods
Cure Time Test Method
Rapid
60 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
60 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
30 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long Room temperature
1,440 min Working time 25°C
Good Working time
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
0.80 W/m°K 25°C
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
89 Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
2.150 Cured