Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant Datasheet
  • Description for Dow Sylgard Q3-3600 Thermally ConDuctive Encapsulant

    Two-part; rapid heat cure; long pot life; excellent flow; self-priming.

    *See Terms of Use Below

    Brand Sylgard
    Application Type Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Ceramics, Metals, Filled plastics, Epoxy laminate boards
    Industry Electronic, Transportation: Automotive applications, Electronics: Sensors, Electronics: High voltage transformers, Heat sinks
    Manufacturer Dow
    Chemistry Silicone
    Cure Method 2-Part Cure, Versatile heat cure
    Cure Temperature (°C) 100, 150, 150
    Cure Time (min) Rapid, 60, 60, 30
    Viscosity (cPs) Highly Flowable, 3,200, Self-leveling, Low
    Color Gray
    Ozone Resistance Ozone resistance
    Chemical Resistance Good
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
150°C Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Cure Time Test Methods
Cure Time Test Method
Rapid
60 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature
60 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
30 min Time to 90 percent of final hardness and adhesion or 90 percent of curve height for elastic modulus, additional time may be required for the part to warm to near oven temperature.
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long Room temperature
1,440 min Working time 25°C
Good Working time
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
0.80 W/m°K 25°C
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
89 Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
2.150 Cured