Dymax Ultra Light-Weld 9008 Datasheet Dymax Ultra Light-Weld 9008

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  • Description for Dymax Ultra Light-Weld 9008

    A general purpose product for encapsulating and sealing electronic components in chip-on-Board or Chip-on-Flex (COF) applications. Forms flexible, highly moisture resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal and PET.

    *See Terms of Use Below

    Brand Ultra Light-weld
    Application Type Encapsulate
    1 Part or 2 Part 1-Part
    Material Form Liquid
    Substrate Ceramic, Glass, Metal, Polyimide, PET, Epoxy board
    Industry Chip on Flex, Camera Module, E-Mobility Solutions, Battery Systems, Avionics, Wire Bonding, Bare die, Chip on Board
    Manufacturer Dymax
    Chemistry Acrylated Urethane, No Nonreactive Solvents, Acrylated Urethane, Acrylated Urethane
    Cure Method UV/Visible Light Cure
    Cure Time (min) 0.08
    Viscosity (cPs) 4,500
    Color Clear, Light Straw, Lt. Yellow
    High Temperature Resistance (°C) 177
    Low Temperature Resistance (°C) -55
    Volume Resistivity (O) 1.80E+13 ohm-cm
    Light Refractive Index (RI) 1.5000
    Density (g/cm³) 1.03 g/ml
    Key Specifications In full compliance with RoHS Directives 2002/95/EC; In full compliance with RoHS Directives 2003/11/EC

  • Technical Data for Dymax Ultra Light-Weld 9008

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Liquid
    • Substrate
      • Ceramic
      • Glass
      • Metal
      • Polyimide (PI) - Polyimide
      • Polyethylene Terephthalate (PET) - PET
      • Epoxy - Epoxy board
      • Other - DAP
    • Industry
      • Cameras - Camera Module
      • Wirebond - Wire Bonding
      • Bare die
      • Chip-on-Board (COB) - Chip on Board
      • E-Mobility Solutions
      • Avionics
      • Electronics - Chip on Flex
      • Battery Systems
      • Other - Ideal for COF Applications
    • Chemistry
    • Cure Method
      • UV / Visible Light - UV/Visible Light Cure
    • Color
      • Clear / Transparent - Clear, Lt. Yellow
      • Yellow - Light Straw
    • Key Specifications
      • RoHS (Restriction of Hazardous Substances) - In full compliance with RoHS Directives 2002/95/EC; In full compliance with RoHS Directives 2003/11/EC
    • Brand
      • Ultra Light-weld
    Specifications
    Cure Specs
    Cure Time (min) 0.08 Test Method
    Viscosity (cPs) 4,500 Test Method
    Fixture or Handling Strength Time (min) 0.02, 0.02, 0.03, 0.03, 0.03, 8.2 m/min, 8.2 m/min Test Method
    Linear Shrinkage (%) 1.20 Test Method
    Bond Strength
    Tensile Strength (psi) 900, 1,500 Test Method
    Material Resistance
    High Temperature Resistance (°C) 177
    Low Temperature Resistance (°C) -55
    Moisture/Humidity Resistance Moisture resistance, Moisture Resistant Bonds
    Conductivity
    Dissipation Factor 0.06000 Test Method
    Dielectric Strength (V/mil) 0.01 Test Method
    Dielectric Constant 5.07 Test Method
    Surface Resistivity (O) 2.90E+14 ohm Test Method
    Volume Resistivity (O) 1.80E+13 ohm-cm Test Method
    Hardness
    Shore A Hardness 85 Test Method
    Shore D Hardness 35 Test Method
    Elongation (%) 300, 270 Test Method
    Flexibility Flexible, Flexible
    Modulus (psi) 6,500 Test Method
    Other Properties
    Glass Transition Temp (Tg) (°C) 55 Test Method
    Light Refractive Index (RI) 1.5000 Test Method
    Coefficient of Thermal Expansion (CTE) 131 µm/m/°C, 230 µm/m/°C Test Method
    Flash Point (°F) >199.4 Test Method
    Density (g/cm³) 1.03 g/ml Test Method
    Business Information
    Shelf Life Details Store the material in a cool, dark place when not in use. Do not expose to light. This product may polymerize upon prolonged exposure to ambient and artificial light. Keep covered when not in use. This material has a minimum 12-month shelf life from date of shipment, unless otherwise specified, when stored between 10 C [50 F] and 32 C [90 F] in the original, unopened container.
    Shelf Life Temperature (°F) 50 to 90
    Shelf Life Type From date of shipment
    Shelf Life (mon) 12

  • Best Practices for Dymax Ultra Light-Weld 9008

    *See Terms of Use Below

    1. Surface Preparation

      All surfaces in contact with the material should be clean and free from flux residue, grease, mold release, or other contaminants prior to dispensing the material.

    2. Curing

      Full cure is best determined empirically by curing at different times and intensities, and measuring the corresponding change in cured properties such as tackiness, adhesion, hardness, etc. Full cure is defined as the point at which more light exposure no longer improves cured properties. Higher intensities or longer cures (up to 5x) generally will not degrade Dymax light-curable materials.

      This product cures with exposure to UV and visible light. Exposure to ambient and artificial light should be kept to a minimum before curing. Dispensing components including needles and fluid lines should be 100% light blocking, not just UV blocking.

      Cure speed is dependent upon many variables, including lamp intensity, distance from the light source, required depth of cure, thickness, and percent light transmission of components between the material and light source.

      Oxygen in the atmosphere may inhibit surface cure. Surfaces exposed to air may require high-intensity (>100 mW/cm2) UV light to produce a dry surface cure. Flooding the curing area with an inert gas, such as nitrogen, can also reduce the effects of oxygen inhibition.

      Parts should be allowed to cool after cure before testing and subjecting to any loads or electrical testing.

      Light curing generally produces some heat. If necessary, cooling fans can be placed in the curing area to reduce the heating effect on components.

      At the point of curing, an air exhaust system is recommended to dissipate any heat and vapors formed during the curing process.

    3. Clean-Up

      Uncured material may be removed from dispensing components and parts with organic solvents. Cured material will be impervious to many solvents and difficult to remove. Cleanup of cured material may require mechanical methods of removal.

    4. Troubleshooting

      In rare cases, stress cracking may occur in assembled parts. Three options may be explored to eliminate this problem. One option is to heat anneal the parts to remove molded-in stresses. A second option is to open any gap between mating parts to reduce stress caused by an interference fit. The third option is to minimize the amount of time the liquid material remains in contact with the substrate(s) prior to curing.

  • Comparable Materials for Dymax Ultra Light-Weld 9008

    *See Terms of Use Below

    Spec Engine® Results

    • Dymax
      953(Dymax)

      A one component potting compound which cures to a depth of 1/8" in seconds upon exposure to UV/visible light. Bond strengths on polycarbonate and PVC usually exceed the strength of those substrates.

    • Dymax
      Ultra Light-Weld 954(Dymax)

      A one-component material which can be cured to >1/4" with in seconds upon exposure to UV/Visible light. Provides rapid potting and sealing of Valox® PBT, ABS, acrylic, polyurethane, styrene, and other plastic substrates

    • Compare All
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Cure Time Test Methods
Cure Time Test Method
0.08 min Using 365 nanometer UV light, (0.25 inches)
Fixture or Handling Strength Time Test Methods
Fixture or Handling Strength Time Fixture-Handling Strength Test Method
0.02 min 2000-EC (50 mW/cm2); Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 50 Radiometer.; Curing through light-blocking substrates may require longer cure times if they obstruct wavelengths used for light curing (320-400 nm for UV light curing, 320-450 nm for UV/Visible light curing). These fixture times/belt speeds are typical for curing thin films through 100% light-transmitting substrates.
0.02 min 5000-EC (200 mW/cm2); Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 50 Radiometer.; Curing through light-blocking substrates may require longer cure times if they obstruct wavelengths used for light curing (320-400 nm for UV light curing, 320-450 nm for UV/Visible light curing). These fixture times/belt speeds are typical for curing thin films through 100% light-transmitting substrates.
0.03 min BlueWave® LED Prime UVA (10 W/cm2); Intensity was measured over the UVA/Visible range (350-450 nm) using a Dymax ACCU-CAL™ 50-LED Radiometer.; Curing through light-blocking substrates may require longer cure times if they obstruct wavelengths used for light curing (320-400 nm for UV light curing, 320-450 nm for UV/Visible light curing). These fixture times/belt speeds are typical for curing thin films through 100% light-transmitting substrates.
0.03 min BlueWave® 75 (5.0 W/cm2); Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 50 Radiometer.; Curing through light-blocking substrates may require longer cure times if they obstruct wavelengths used for light curing (320-400 nm for UV light curing, 320-450 nm for UV/Visible light curing). These fixture times/belt speeds are typical for curing thin films through 100% light-transmitting substrates.
0.03 min BlueWave® 200 (10 W/cm2); Intensity was measured over the UVA range (320-395 nm) using a Dymax ACCU-CAL™ 50 Radiometer.; Curing through light-blocking substrates may require longer cure times if they obstruct wavelengths used for light curing (320-400 nm for UV light curing, 320-450 nm for UV/Visible light curing). These fixture times/belt speeds are typical for curing thin films through 100% light-transmitting substrates.
8.2 m/min UVCS Conveyor with one 5000-EC (200 mW/cm2); At 53 mm [2.1 in] focal distance. Maximum speed of conveyor is 8.2 m/min [27 ft/min]. Intensity was measured over the UVA range (320-395 nm) using the Dymax ACCU-CAL™ 150 Radiometer.; Curing through light-blocking substrates may require longer cure times if they obstruct wavelengths used for light curing (320-400 nm for UV light curing, 320-450 nm for UV/Visible light curing). These fixture times/belt speeds are typical for curing thin films through 100% light-transmitting substrates.
8.2 m/min UVCS Conveyor with Fusion F300S (2.5 W/cm2); At 53 mm [2.1 in] focal distance. Maximum speed of conveyor is 8.2 m/min [27 ft/min]. Intensity was measured over the UVA range (320-395 nm) using the Dymax ACCU-CAL™ 150 Radiometer.; Curing through light-blocking substrates may require longer cure times if they obstruct wavelengths used for light curing (320-400 nm for UV light curing, 320-450 nm for UV/Visible light curing). These fixture times/belt speeds are typical for curing thin films through 100% light-transmitting substrates.
Linear Shrinkage Test Methods
Linear Shrinkage Test Method
1.20 % ASTM D-2556
Viscosity Test Methods
Viscosity Test Method
4,500 cPs ASTM D-2556, (nominal)
Tensile Strength Test Methods
Tensile Strength Test Method
900 psi ASTM D-638, at Break
1,500 psi at Break; ASTM D638; Cured
Dielectric Constant Test Methods
Dielectric Constant Test Method
5.07 1 MHz; ASTM D1304-99
Dielectric Strength Test Methods
Dielectric Strength Test Method
0.01 V/mil Dielectric Breakdown Voltage; MIL-I-46058C
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.06000 1 MHz; ASTM D1304-99
Surface Resistivity Test Methods
Surface Resistivity Test Method
2.90E+14 ohm ASTM D1304-99
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.80E+13 ohm-cm ASTM D1304-99
Elongation Test Methods
Elongation Test Method
300 % at Break; ASTM D-638
270 % at Break; ASTM D638; Cured
Modulus Test Methods
Modulus Test Method
6,500 psi Modulus of Elasticity; ASTM D638; Cured
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
85 ASTM D-2240
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
35 ASTM D-2240
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
131 µm/m/°C DSTM 610; a1; Cured
230 µm/m/°C DSTM 610; a2; Cured
Density Test Methods
Density Test Method
1.03 g/ml ASTM D1875
Flash Point Test Methods
Flash Point Test Method
>93.0°C Uncured
Glass Transition Temp (Tg) Test Methods
Glass Transition Temp (Tg) Glass Transition Temperature (Tg) Test Method
55°C DSTM 256; Cured
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Temperature Test Method
1.5000 20°C ASTM D542; Cured