Elantas (Altana) CONAPOXY FR-1612-1

Elantas (Altana) CONAPOXY FR-1612-1 Datasheet
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  • Description for Elantas (Altana) CONAPOXY FR-1612-1

    A high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on potted components.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Brand Cytec
    Application Type Pot, Encapsulate
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Industry Electrical
    Manufacturer Elantas (Altana)
    Chemistry Epoxy
    Cure Method 2 Parts
    Cure Temperature (°C) 120, 140
    Cure Time (min) 180, 120
    Viscosity (cPs) 70,000, 1,000, 11,000, 500, 900, 4,100
    Color Black
    Fungus Resistance Fungus resistance
    Key Specifications ASTM (American Standard Test Method): ASTM D-1924, Mil-Spec (United States Military Standard): MIL-K-16923E; MIL-E-5272C

  • Technical Data for Elantas (Altana) CONAPOXY FR-1612-1

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Liquid
    • Industry
    • Chemistry
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Black
    • Key Specifications
      • ASTM (American Standard Test Method): D-1924 - ASTM D-1924
      • Mil-Spec (United States Military Standard): E-5272C - MIL-K-16923E; MIL-E-5272C
      • Mil-Spec (United States Military Standard): K-16923E - MIL-K-16923E; MIL-E-5272C
    • Brand
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 120, 140
    Cure Time (min) 180, 120
    Viscosity (cPs) 70,000, 1,000, 11,000, 500, 900, 4,100 Test Method
    Linear Shrinkage (%) 1.30
    Work / Pot Time (min) 480, 90 Test Method
    Mix Ratio 100:25 (by weight)
    Material Resistance
    Fungus Resistance Fungus resistance
    Conductivity
    Dissipation Factor 0.00750, 0.04800, 0.04700, 0.03400, 0.02400, 0.01400, 0.01200, 0.01000, 0.00500, 0.00600, 0.00500, 0.01000, 0.01700, 0.00400, 0.00400, 0.00800, 0.01600, 0.03400 Test Method
    Insulation Resistance (O) 25000000 (megaohms/in2), 5000000 (megaohms/in2), Insulation resistance Test Method
    Dielectric Constant 3.67, 4.21, 4.32, 4.38, 4.33, 4.21, 3.83, 4.97, 4.85, 4.62, 4.48, 4.31, 3.90, 5.00, 4.88, 4.65, 4.52, 4.39 Test Method
    Thermal Conductivity (W/m°K) 0.27
    Volume Resistivity (O) 2.1e14 (ohms/cm), 3.9e13 (ohms/cm) Test Method
    Hardness
    Shore D Hardness 75
    Flexibility High performance flexible
    Other Properties
    Specific Gravity 1.700
    Coefficient of Thermal Expansion (CTE) 12.0e-5 (in./ in/°C) Test Method
    Business Information
    Shelf Life (mon) 18

  • Best Practices

    Best Practices information currently not available.

  • Comparable Materials for Elantas (Altana) CONAPOXY FR-1612-1

    *See Terms of Use Below

    Spec Engine® Results

    • Resinlab
      EP1112NC(Resinlab)

      Very low viscosity, fast cure speed, small mass potting, unfilled.

    • Henkel
      Loctite Stycast ES 2500(Henkel)

      A resilient, low cost, fast gelling, potting compound. Designed for easy 2 to 1 meter-mix-dispense machinery and low abrasion.

    • Henkel
      ES6005(Henkel)

      Fast gelling, flame retardant, black potting compound. Easy mix ratio, low viscosity, room temperature- cure, ideal for potting/encapsulating high volume parts. UL 1446 recognized and UL 94 HB flame retardant.

    • Compare All

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Viscosity Test Methods
Viscosity Test Method Temperature
70,000 cPs Brookfield Viscometer 25°C
1,000 cPs Brookfield Viscometer 80°C
11,000 cPs Viscosity Brookfield Cps @ 25°C 25°C
500 cPs Viscosity Brookfield Cps @ 80°C, initial 80°C
900 cPs Viscosity Brookfield Cps @ 80°C, 30 minutes 80°C
4,100 cPs Viscosity Brookfield Cps @ 80°(C), 60 minutes 80°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
480 min 25°C
90 min 80°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
3.67 25°C Frequency 1mc
4.21 90°C Frequency 1mc
4.32 105°C Frequency 1mc
4.38 130°C Frequency 1mc
4.33 155°C Frequency 1mc
4.21 175°C Frequency 1mc
3.83 25°C Frequency 1Kc
4.97 90°C Frequency 1Kc
4.85 105°C Frequency 1Kc
4.62 130°C Frequency 1Kc
4.48 155°C Frequency 1Kc
4.31 175°C Frequency 1Kc
3.90 25°C Frequency 100 Cycles
5.00 90°C Frequency 100 Cycles
4.88 105°C Frequency 100 Cycles
4.65 130°C Frequency 100 Cycles
4.52 155°C Frequency 100 Cycles
4.39 175°C Frequency 100 Cycles
Dielectric Strength Test Methods
Dielectric Strength Test Method
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.00750 25°C Frequency 1 mc
0.04800 90°C Frequency 1 mc
0.04700 105°C Frequency 1 mc
0.03400 130°C Frequency 1 mc
0.02400 155°C Frequency 1 mc
0.01400 175°C Frequency 1 mc
0.01200 25°C Frequency 1 Kc
0.01000 90°C Frequency 1 Kc
0.00500 105°C Frequency 1 Kc
0.00600 130°C Frequency 1 Kc
0.00500 155°C Frequency 1 Kc
0.01000 175°C Frequency 1 Kc
0.01700 25°C Frequency 100 Cycles
0.00400 90°C Frequency 100 Cycles
0.00400 105°C Frequency 100 Cycles
0.00800 130°C Frequency 100 Cycles
0.01600 155°C Frequency 100 Cycles
0.03400 175°C Frequency 100 Cycles
Insulation Resistance Test Methods
Insulation Resistance Temperature Test Method
25000000 (megaohms/in2) Room In humidity cabinet after conditioning 96 hours at 50°C - Relative Humidity 98%
5000000 (megaohms/in2) Room In humidity cabinet after conditioning 96 hours at 50°C - Relative Humidity 98%
Insulation resistance
Volume Resistivity Test Methods
Volume Resistivity Temp (°C) Test Method
2.1e14 (ohms/cm) 25°C In humidity cabinet after conditioning 96 hours at 50°C - Relative Humidity 98%
3.9e13 (ohms/cm) 25°C In humidity cabinet after conditioning 96 hours at 50°C - Relative Humidity 98%
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
12.0e-5 (in./ in/°C) 23 to 113°C
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