Elantas (Altana) Conathane EN-2534

Elantas (Altana) Conathane EN-2534 Datasheet
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  • Description for Elantas (Altana) Conathane EN-2534

    A two-part, non-mercury, fast setting, filled, flexible polyurethane potting system, that consists of two low viscosity liquids that have low vapor pressure and good handling properties at room temperature.

    *See Terms of Use Below

    Brand Conathane, Cytec
    Application Type Pot
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Industry Electrical components, Electronic components
    Manufacturer Elantas (Altana)
    Chemistry Polyurethane
    Cure Method Part A/Part B
    Cure Temperature (°C) 25, 80
    Cure Time (min) 10,080, 960
    Viscosity (cPs) Low, 2,200
    Color Black
    Arc Resistance (sec) Arc resistance
    Key Specifications UL Recognized, Mil-Spec (United States Military Standard): MIL-E-5272C; MIL-STD-810B

  • Technical Data for Elantas (Altana) Conathane EN-2534

    *See Terms of Use Below

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
      • Part A Name - Part A
      • Part B Name - Part B
    • Material Form
      • Liquid
    • Industry
      • Electronics - Electrical components, Electronic components
    • Chemistry
    • Application Method
      • Roll
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Black
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) - UL Recognized
      • Mil-Spec (United States Military Standard): E-5272C - MIL-E-5272C; MIL-STD-810B
      • Mil-Spec (United States Military Standard): STD-810B - MIL-E-5272C; MIL-STD-810B
    • Brand
      • Conathane
      • Cytec
    Specifications
    Cure Specs
    Cure Temperature (°C) 25, 80
    Cure Time (min) 10,080, 960
    Viscosity (cPs) Low, 2,200 Test Method
    Fixture or Handling Strength Time (min) Good
    Set Time (min) Fast
    Linear Shrinkage (%) 0.65
    Work / Pot Time (min) 15 Test Method
    Mix Ratio 20:100 (by weight)
    Bond Strength
    Tear Strength (piw) 125 (pli)
    Tensile Strength (psi) 1,970
    Material Resistance
    Arc Resistance (sec) Arc resistance
    Conductivity
    Dissipation Factor 0.18600, 0.08300, 0.13100, 0.07300, 0.09200, 0.03800, 0.02600, 0.06200, 0.12400 Test Method
    Filler Filled
    Dielectric Strength (V/mil) 584 (vpm)
    Dielectric Constant 4.39, 6.14, 5.60, 3.73, 5.57, 5.29, 3.30, 3.46, 3.84 Test Method
    Thermal Conductivity (W/m°K) 0.00
    Volume Resistivity (O) 6.1e13 (ohms/cm), 9.2e11 (ohms/cm), 1.1e11 (ohms/cm) Test Method
    Surface Resistivity (O) 5.3e14 (ohms), 3.1e13 (ohms), 5.3e12 (ohms) Test Method
    Hardness
    Shore D Hardness 50
    Elongation (%) 60
    Flexibility Flexible
    Business Information
    Shelf Life Details CONATHANE EN-2534 Part A and Part B should be stored at temperatures of 65ºF-85°F in tightly closed containers. If containers are opened and the contents only partially used, the container should be flushed with dry nitrogen (see CONAP® Dri-Purge) or dry air before being resealed. If crystallization has occurred, heat the component(s) to 140°F (60°C) and mix well to re-liquefy. Stabilize component(s) to room temperature (or selected pre-heat temperature) prior to use. The shelf life of CONATHANE EN-2534 Part A and Part B is 18 months from date of manufacture in the original unopened container.
    Shelf Life Temperature (°F) 65 to 85
    Shelf Life Type From date of manufacture
    Shelf Life (mon) 18

  • Best Practices for Elantas (Altana) Conathane EN-2534

    *See Terms of Use Below

    1. Mixing

      The two components should be mixed thoroughly in metal or glass containers using metal or glass stirrers. Degassing of the mixed material should be accomplished at room temperature to 60°C at =5 mm Hg vacuum. Containers should be large enough to allow for frothing during degassing. Any material or container that could introduce water into the system should be avoided.

    2. Deairing/Degassing

      The two components should be mixed thoroughly in metal or glass containers using metal or glass stirrers. Degassing of the mixed material should be accomplished at room temperature to 60°C at =5 mm Hg vacuum. Containers should be large enough to allow for frothing during degassing. Any material or container that could introduce water into the system should be avoided.

  • Comparable Materials for Elantas (Altana) Conathane EN-2534

    *See Terms of Use Below

    Spec Engine® Results

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      A two-component, low viscosity, semi-rigid polyurethane resin system exhibiting high electrical strength, toughness and adhesion. Encapsulation of delicate components, High chemical resistance, A wide range of applications.

    • Resinlab
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      Two-component polyurethane system, low viscosity, semi-rigid version of EL171H suitable for the potting and encapsulation of a wide variety of electrical and electronic devices. room temperature curing.

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    • Elantas (Altana)
      Conathane EN-2532(Elantas (Altana))

      A two-part, non-mercury, fast setting, semi-flexible filled polyurethane system. The system has good handling properties at room temperature, good work life, and minimum processing hazards. It can be cured at room or elevated temperatures without the formation of voids.

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Viscosity Test Methods
Viscosity Temperature
Low
2,200 cPs 25°C
Work / Pot Time Test Methods
Work / Pot Time Temperature
15 min 25°C
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.39 25°C Dielectric Constant 100 Hz
6.14 60°C Dielectric Constant 100 Hz
5.60 90°C Dielectric Constant 100 Hz
3.73 25°C Dielectric Constant 1 KHz
5.57 60°C Dielectric Constant 1 KHz
5.29 90°C Dielectric Constant 1 KHz
3.30 25°C Dielectric Constant 1 MHz
3.46 60°C Dielectric Constant 1 MHz
3.84 90°C Dielectric Constant 1 MHz
Dissipation Factor Test Methods
Dissipation Factor Temperature Test Method
0.18600 25°C Dissipation Factor 100 Hz
0.08300 60°C Dissipation Factor 100 Hz
0.13100 90°C Dissipation Factor 100 Hz
0.07300 25°C Dissipation Factor 1 KHz
0.09200 60°C Dissipation Factor 1 KHz
0.03800 90°C Dissipation Factor 1 KHz
0.02600 25°C Dissipation Factor 1 MHz
0.06200 60°C Dissipation Factor 1 MHz
0.12400 90°C Dissipation Factor 1 MHz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
6.1e13 (ohms/cm) 25°C
9.2e11 (ohms/cm) 60°C
1.1e11 (ohms/cm) 90°C
Surface Resistivity Test Methods
Surface Resistivity Temperature
5.3e14 (ohms) 25°C
3.1e13 (ohms) 60°C
5.3e12 (ohms) 90°C