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Description for Elantas (Altana) EN-23
Two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin systems. These systems were formulated specifically for the potting, casting, embedding, and encapsulation of electronic circuits, components, and power devices.Brand Conathane, Cytec Application Type Pot, Encapsulate 1 Part or 2 Part 2-Part Material Form Liquid Manufacturer Elantas (Altana) Chemistry Low Toxicity, Polyurethane Resin Cure Method 2-Part Cure Cure Temperature (°C) 20 to 25, 25, 80 Cure Time (min) 10,080, 240 Viscosity (cPs) Low, 2,500 Volume Resistivity (O) 1.3e15 -
Technical Data for Elantas (Altana) EN-23
Overview
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Application Type
- Pottant / Encapsulant - Pot, Encapsulate
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1 Part or 2 Part
- 2-Part
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Material Form
- Liquid
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Chemistry
- Other - Low Toxicity, Polyurethane Resin
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Cure Method
- 2-Part Cure
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Brand
- Conathane
- Cytec
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25, 25, 80 Cure Time (min) 10,080, 240 Viscosity (cPs) Low, 2,500 Set Time (min) 70, 15 Test Method Linear Shrinkage (%) 0.014 (in./in.) Work / Pot Time (min) 40, 5.00 Test Method Mix Ratio 100:97 (by volume) Bond Strength
Tear Strength (piw) 300 (pli) Tensile Strength (psi) 2,600 Conductivity
Dissipation Factor 0.03000 Dielectric Constant 3.20 Thermal Conductivity (W/m°K) 0.00 Volume Resistivity (O) 1.3e15 Hardness
Shore D Hardness 55 Elongation (%) 102 -
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Best Practices for Elantas (Altana) EN-23
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Comparable Materials for Elantas (Altana) EN-23
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