Masterbond EP30AO

Masterbond EP30AO Datasheet
  • Description for Masterbond EP30AO

    Masterbond EP30AO is a 2 Part Room temperature cure Epoxy Liquid used to Potting

    *See Terms of Use Below

    Application Type Potting, Sealing, Coating, Bonding
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Manufacturer Masterbond
    Chemistry Epoxy
    Cure Method Room temperature cure, Part A/Part B
    Cure Temperature (°C) 25, 24, 93
    Cure Time (min) 1,440 to 2,880, 60 to 120
    Viscosity (cPs) Low, 2,000 to 6,000, Excellent flowability
    High Temperature Resistance (°C) 121
    Low Temperature Resistance (°C) -51
    Other Resistance Thermal Cycling Resistance
    Key Specifications RoHS COMPLIANT
  • Technical Data

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  • Best Practices

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  • Comparable Materials

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Viscosity Test Methods
Viscosity Temperature
2,000 to 6,000 cPs 24°C
Excellent flowability
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
30 to 45 min 100 gram batch 24°C
Compressive Strength Test Methods
Compressive Strength Test Temperature
24,000 to 26,000 psi 24°C
Shear Strength Test Methods
Shear Strength Type Substrate Test Temperature
1,200 to 1,400 psi Tensile lap shear strength Aluminum to Aluminum 24°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
6,000 to 7,000 psi 24°C
Thermal Conductivity Test Methods
Thermal Conductivity Temperature
15.57 to 17.30 W/m°K 24°C
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
>10(14) (ohm-cm) 24°C
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
>400 V/mil 24°C 1/8 inch thick test specimen
Excellent Electrical insulation
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
4.50 24°C 60 Hz
4.30 24°C 1 KHz
4.00 24°C 1 MHz
Shore D Hardness Test Methods
Shore D Hardness Shore Hardness Test Method
90 75°F
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
22 to 25e-6 (in/in/°C) 24°C