• Description for Masterbond MasterSil 151

    Masterbond MasterSil 151 is a 2 Part Room temperature cure Silicone Liquid used to Pot and Encapsulate Aluminum

    *See Terms of Use Below

    Application Type Potting, Encapaulation
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Substrate Aluminum
    Industry Optical fiber cladding, Electronics: Connectors
    Manufacturer Masterbond
    Chemistry Silicone, No Solvent
    Cure Method Room temperature cure, Part A/Part B, Elevated temperatures
    Cure Temperature (°C) 25, 24, 93
    Cure Time (min) 1,440 to 2,880, 60 to 120
    Viscosity (cPs) Low
    Color Optically clear, Transparent
    Chemical Resistance Highly water resistance
    High Temperature Resistance (°C) 204
    Low Temperature Resistance (°C) -54
    Light Refractive Index (RI) 1.4300, Lower
    Key Specifications RoHS complaint
  • Technical Data

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  • Best Practices

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
120 to 240 min 100 gram batch 24°C
Very Long
Shear Strength Test Methods
Shear Strength Substrate Test Temperature
>50 psi Aluminum to Aluminum 24°C
Tensile Strength Test Methods
Tensile Strength Test Temperature
800 to 900 psi 24°C
Dielectric Strength Test Methods
Dielectric Strength Temperature Test Method
Superb electrical insulation properties
450 V/mil 24°C 1/8 inch thick test specimen
Dielectric Constant Test Methods
Dielectric Constant Temperature Test Method
2.70 24°C 100Hz
Volume Resistivity Test Methods
Volume Resistivity Temp (°C)
10(14) (ohm-cm) 24°C
Light Refractive Index (RI) Test Methods
Light Refractive Index (RI) Temperature
1.4300 24°C
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Temperature (°C)
220 to 240e-6 (in/in/°C) 24°C