Henkel SIP

Surface Preparation

Before using the kit prepare the surfaces as follows: Slightly dusty, but otherwise clean surfaces should be wiped with a damp cloth. Heavy soiling and oily surfaces should be treated with an appropriate solvent.

Application

Apply a thin film of primer solution to the surfaces to be bonded using either a clean brush or tissue.

If the surface is clean enough for bonding then this wet film will remain continuous without any breaks or dry patches. If a continuous film is achieved, wipe off the primer with a clean tissue or cloth and allow the damp surface to dry. The part is then ready to bond (see note 1).

If the film does not remain continuous, lightly abrade the wet surface with wet or dry paper. Use 320 grade or finer for smooth surfaces. For dimpled or irregular surfaces 100 grade is more appropriate.

Remove the debris with a clean tissue or cloth and re-apply the primer. A thin continuous wet film indicates adequate preparation. Repeat as necessary until the surface is ready for bonding.

Mixing

Using the Part C container as the mixing vessel pour in the other two components, replace the lid and then shake to ensure thorough mixing. The mixture is then ready for use.