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Description for Resin Designs TP-2101 Thermally ConDuctive Pad
Gap filler interface; foam-based flame retardant thermal gel; both sides tacky.Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.
Chemical Resistance Good 1 Part or 2 Part 1-Part Material Form Gel, Solid, Pad Industry Heat sinks of power components Manufacturer Resin Designs Chemistry Silicone Cure Method Pressure Sensitive Gap Fill (in) Gap Filler Interface Color Gray Ozone Resistance Ozone resistance High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -40 Volume Resistivity (O) 1e11 (ohms/cm) Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1 -
Technical Data for Resin Designs TP-2101 Thermally ConDuctive Pad
Overview
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Chemical Resistance
- Chemical Resistance - Good
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1 Part or 2 Part
- 1-Part
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Material Form
- Gel
- Other - Solid
- Pad
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Industry
- Electronics - Heat sinks of power components
- Industrial - Heat sources
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Chemistry
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Cure Method
- Pressure Sensitive (min) - Pressure Sensitive
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Color
- Gray
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Key Specifications
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
- UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V-1 - UL 94 V-1
Specifications
Cure Specs
Gap Fill (in) Gap Filler Interface Bond Strength
Tensile Strength (psi) 40 Material Resistance
Ozone Resistance Ozone resistance UV Resistance UV resistance High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -40 Conductivity
Filler Alumina Dielectric Strength (V/mil) 225 Thermal Conductivity (W/m°K) 0.70 Volume Resistivity (O) 1e11 (ohms/cm) Hardness
Elongation (%) 2 Shore OO Hardness 50 Flexibility Conformal Other Properties
Specific Gravity 1.900 Coefficient of Thermal Expansion (CTE) 380 (Linear (micron/m °C or ppm )) Business Information
Shelf Life Details The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials. -
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Best Practices for Resin Designs TP-2101 Thermally ConDuctive Pad
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Clean-Up
The material can be removed easily and cleanly, with no special tools, for access.
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Comparable Materials for Resin Designs TP-2101 Thermally ConDuctive Pad
Spec Engine® Results
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