Resin Designs TP-2101 Thermally ConDuctive Pad Datasheet Resin Designs TP-2101 Thermally ConDuctive Pad

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  • Description for Resin Designs TP-2101 Thermally ConDuctive Pad

    Gap filler interface; foam-based flame retardant thermal gel; both sides tacky.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Chemical Resistance Good
    1 Part or 2 Part 1-Part
    Material Form Gel, Solid, Pad
    Industry Heat sinks of power components
    Manufacturer Resin Designs
    Chemistry Silicone
    Cure Method Pressure Sensitive
    Gap Fill (in) Gap Filler Interface
    Color Gray
    Ozone Resistance Ozone resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Volume Resistivity (O) 1e11 (ohms/cm)
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-0, UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1
  • Technical Data for Resin Designs TP-2101 Thermally ConDuctive Pad

    Overview
    • Chemical Resistance
      • Chemical Resistance - Good
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Gel
      • Other - Solid
      • Pad
    • Industry
    • Chemistry
    • Cure Method
      • Pressure Sensitive (min) - Pressure Sensitive
    • Color
      • Gray
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V0 - UL 94 V-0
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association) : UL 94 : V-1 - UL 94 V-1
    Specifications
    Cure Specs
    Gap Fill (in) Gap Filler Interface
    Bond Strength
    Tensile Strength (psi) 40
    Material Resistance
    Ozone Resistance Ozone resistance
    UV Resistance UV resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -40
    Conductivity
    Filler Alumina
    Dielectric Strength (V/mil) 225
    Thermal Conductivity (W/m°K) 0.70
    Volume Resistivity (O) 1e11 (ohms/cm)
    Hardness
    Elongation (%) 2
    Shore OO Hardness 50
    Flexibility Conformal
    Other Properties
    Specific Gravity 1.900
    Coefficient of Thermal Expansion (CTE) 380 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details The product should be stored in the original packaging under normal warehouse conditions to maintain the integrity of the packaging materials.
  • Best Practices for Resin Designs TP-2101 Thermally ConDuctive Pad

    *See Terms of Use Below

    1. Clean-Up

      The material can be removed easily and cleanly, with no special tools, for access.

  • Comparable Materials for Resin Designs TP-2101 Thermally ConDuctive Pad

    *See Terms of Use Below

    Spec Engine® Results

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