Dow 3-4130 Dielectric Gel Kit

Dow 3-4130 Dielectric Gel Kit Datasheet
  • Description for Dow 3-4130 Dielectric Gel Kit

    Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    Note: This material has been discontinued. Please view the Comparable Materials tab or call us at (262) 293-7970 for additional help.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel, Liquid
    Industry Circuits, Electronics, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Addition cure, Part A/Part B
    Cure Temperature (°C) 20 to 25, 100, 125, 150
    Viscosity (cPs) 760
    Color Clear
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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  • Comparable Materials

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.88 Dielectric constant, 100 Hz
2.88 Dielectric constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00100 Dissipation factor, 100 Hz
<0.00010 Dissipation factor, 100 KHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.