Dow 3-4190 Dielectric Silicone Gel Kit Datasheet Dow 3-4190 Dielectric Silicone Gel Kit

CONTACT REP
Information provided by Gluespec

  • Description for Dow 3-4190 Dielectric Silicone Gel Kit

    Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, Electronics, Optoelectronics, Electronic devices
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2 Parts
    Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125, 150
    Cure Time (min) 1,500, 1,800, 7, 5.00, 4.00
    Viscosity (cPs) Low, 250
    Color Transparent green
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  Download Technical Data Sheet   Save This Material   Compare Saved Items

Popular Articles

Testing the effectiveness of surface treatments

Read Article

What Are the Differences Between Adhesives and Sealants?

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Silicones in LED Lighting | Gluespec

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article

Featured Ads

Gluespec Poll

Which answer best describes a project you are currently working on?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
20 to 25°C Time to non-flow/full cure.
100°C
125°C
150°C
Cure Time Test Methods
Cure Time Test Method
1,500 min
1,800 min Time to non-flow/full cure.
7 min
5.00 min
4.00 min
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.86 100 Hz
2.87 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00070 100 Hz
0.00010 100 kHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.
0.960 Cured or uncured A & B.