Dow 3-4190 Dielectric Silicone Gel Kit

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Description for Dow 3-4190 Dielectric Silicone Gel Kit

Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

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Application Type	Seal
1 Part or 2 Part	2 Part
Material Form	Gel
Industry	Circuits, Electronics, Optoelectronics, Electronic devices
Manufacturer	Dow
Chemistry	Silicone, Solvent-free
Cure Method	2 Parts
Cure Temperature (°C)	20 to 25, 20 to 25, 100, 125, 150
Cure Time (min)	1,500, 1,800, 7, 5.00, 4.00
Viscosity (cPs)	Low, 250
Color	Transparent green
High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-45, -55
Light Refractive Index (RI)	High

Best Practices for Dow 3-4190 Dielectric Silicone Gel Kit

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Technical Data for Dow 3-4190 Dielectric Silicone Gel Kit

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Overview

Application Type
- Sealant - Seal
1 Part or 2 Part
- 1 Part or 2 Part - 2 Part
Material Form
- Gel
Industry
- Electronics - Circuits, Optoelectronics, Electronic devices
- Industrial - Delicate components
Chemistry
- Solvent-Free
- Silicone
Application Method
- Dispenser - Automated dispensing equipment
Cure Method
- 2-Part Cure - 2 Parts
Color
- Green - Transparent green

Specifications

Cure Specs

Cure Temperature (°C)	20 to 25, 20 to 25, 100, 125, 150	Test Method
Cure Time (min)	1,500, 1,800, 7, 5.00, 4.00	Test Method
Viscosity (cPs)	Low, 250
Mix Ratio	1:1 (by volume)

Material Resistance

High Temperature Resistance (°C)	150
Low Temperature Resistance (°C)	-45, -55
Moisture/Humidity Resistance	Moisture/humidity resistance

Conductivity

Dissipation Factor	0.00070, 0.00010	Test Method
Dielectric Strength (V/mil)	Excellent, 500
Dielectric Constant	2.86, 2.87	Test Method
Volume Resistivity (O)	1.50E+15 (ohms/cm)

Hardness

Flexibility	Flexible, Resilient

Other Properties

Light Refractive Index (RI)	High
Specific Gravity	0.970, 0.960	Test Method
Coefficient of Thermal Expansion (CTE)	430 (Linear (micron/m °C or ppm ))
Flash Point (°F)	212.0

Business Information

Shelf Life Details	Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35°C, unless otherwise noted.
Shelf Life Type	from date of manufacture
Shelf Life (mon)	24

Best Practices for Dow 3-4190 Dielectric Silicone Gel Kit

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1. Mixing
  
  Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)
  
  one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
2. Testing
  
  If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.
Comparable Materials for Dow 3-4190 Dielectric Silicone Gel Kit

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Spec Engine^® Results
- Sylgard 527 Silicone Dielectric Gel(Dow)
  Two-part, 1 to 1 mix ratio dielectric gel, Room temperature or heat accelerated cure, Available in clear or red, Low viscosity allows good flow under components, UL flammability rating
- Sylgard 528 Firm Gel Parts A & B(Dow)
  Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.
- SE 1896 FR(Dow)
  Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.
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