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Description for Dow 3-4190 Dielectric Silicone Gel Kit
Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.Application Type Seal 1 Part or 2 Part 2 Part Material Form Gel Industry Circuits, Electronics, Optoelectronics, Electronic devices Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method 2 Parts Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125, 150 Cure Time (min) 1,500, 1,800, 7, 5.00, 4.00 Viscosity (cPs) Low, 250 Color Transparent green High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -45, -55 Light Refractive Index (RI) High
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
---|---|
20 to 25°C | |
20 to 25°C | Time to non-flow/full cure. |
100°C | |
125°C | |
150°C |
Cure Time Test Methods
Cure Time | Test Method |
---|---|
1,500 min | |
1,800 min | Time to non-flow/full cure. |
7 min | |
5.00 min | |
4.00 min |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
---|
Dielectric Constant Test Methods
Dielectric Constant | Test Method |
---|---|
2.86 | 100 Hz |
2.87 | 100 kHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
---|---|
0.00070 | 100 Hz |
0.00010 | 100 kHz |
Specific Gravity Test Methods
Specific Gravity | Test Method |
---|---|
0.970 | Cured or uncured A & B. |
0.960 | Cured or uncured A & B. |

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