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Description for Dow 3-4190 Dielectric Silicone Gel Kit
Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.Application Type Seal 1 Part or 2 Part 2-Part Material Form Gel Industry Circuits, Electronics, Optoelectronics, Electronic devices Manufacturer Dow Chemistry Silicone, Solvent-free Cure Method 2 Parts Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125, 150 Cure Time (min) 1,500, 1,800, 7, 5.00, 4.00 Viscosity (cPs) Low, 250 Color Transparent green High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -45, -55 Volume Resistivity (O) 1.50E+15 (ohms/cm) Light Refractive Index (RI) High -
Technical Data for Dow 3-4190 Dielectric Silicone Gel Kit
Overview
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Application Type
- Sealant - Seal
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1 Part or 2 Part
- 2-Part
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Material Form
- Gel
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Industry
- Electronics - Circuits, Optoelectronics, Electronic devices
- Industrial - Delicate components
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Chemistry
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Application Method
- Dispenser - Automated dispensing equipment
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Cure Method
- 2-Part Cure - 2 Parts
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Color
- Green - Transparent green
Specifications
Cure Specs
Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125, 150 Test Method Cure Time (min) 1,500, 1,800, 7, 5.00, 4.00 Test Method Viscosity (cPs) Low, 250 Mix Ratio 1:1 (by volume) Material Resistance
High Temperature Resistance (°C) 150 Low Temperature Resistance (°C) -45, -55 Moisture/Humidity Resistance Moisture/humidity resistance Conductivity
Dissipation Factor 0.00070, 0.00010 Test Method Dielectric Strength (V/mil) Excellent, 500 Dielectric Constant 2.86, 2.87 Test Method Volume Resistivity (O) 1.50E+15 (ohms/cm) Hardness
Flexibility Flexible, Resilient Other Properties
Light Refractive Index (RI) High Specific Gravity 0.970, 0.960 Test Method Coefficient of Thermal Expansion (CTE) 430 (Linear (micron/m °C or ppm )) Flash Point (°F) 212.0 Business Information
Shelf Life Details Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35°C, unless otherwise noted. Shelf Life Type from date of manufacture Shelf Life (mon) 24 -
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Best Practices for Dow 3-4190 Dielectric Silicone Gel Kit
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Mixing
Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)
one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.
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Testing
If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.
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Comparable Materials for Dow 3-4190 Dielectric Silicone Gel Kit
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Cure Temperature Test Methods
Cure Temperature | Cure Time Test Method |
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20 to 25°C | |
20 to 25°C | Time to non-flow/full cure. |
100°C | |
125°C | |
150°C |
Cure Time Test Methods
Cure Time | Test Method |
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1,500 min | |
1,800 min | Time to non-flow/full cure. |
7 min | |
5.00 min | |
4.00 min |
Work / Pot Time Test Methods
Work / Pot Time | Test Method | Temperature |
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Dielectric Constant Test Methods
Dielectric Constant | Test Method |
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2.86 | 100 Hz |
2.87 | 100 kHz |
Dissipation Factor Test Methods
Dissipation Factor | Test Method |
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0.00070 | 100 Hz |
0.00010 | 100 kHz |
Specific Gravity Test Methods
Specific Gravity | Test Method |
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0.970 | Cured or uncured A & B. |
0.960 | Cured or uncured A & B. |

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