Dow 3-4190 Dielectric Silicone Gel Kit Datasheet Dow 3-4190 Dielectric Silicone Gel Kit

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  • Description for Dow 3-4190 Dielectric Silicone Gel Kit

    Extremely soft or firm, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2-Part
    Material Form Gel
    Industry Circuits, Electronics, Optoelectronics, Electronic devices
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method 2 Parts
    Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125, 150
    Cure Time (min) 1,500, 1,800, 7, 5.00, 4.00
    Viscosity (cPs) Low, 250
    Color Transparent green
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 1.50E+15 (ohms/cm)
    Light Refractive Index (RI) High
  • Technical Data for Dow 3-4190 Dielectric Silicone Gel Kit

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Gel
    • Industry
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • 2-Part Cure - 2 Parts
    • Color
      • Green - Transparent green
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125, 150 Test Method
    Cure Time (min) 1,500, 1,800, 7, 5.00, 4.00 Test Method
    Viscosity (cPs) Low, 250
    Mix Ratio 1:1 (by volume)
    Material Resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00070, 0.00010 Test Method
    Dielectric Strength (V/mil) Excellent, 500
    Dielectric Constant 2.86, 2.87 Test Method
    Volume Resistivity (O) 1.50E+15 (ohms/cm)
    Hardness
    Flexibility Flexible, Resilient
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.970, 0.960 Test Method
    Coefficient of Thermal Expansion (CTE) 430 (Linear (micron/m °C or ppm ))
    Flash Point (°F) 212.0
    Business Information
    Shelf Life Details Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35°C, unless otherwise noted.
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 24
  • Best Practices for Dow 3-4190 Dielectric Silicone Gel Kit

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)

      one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    2. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.

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    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C
20 to 25°C Time to non-flow/full cure.
100°C
125°C
150°C
Cure Time Test Methods
Cure Time Test Method
1,500 min
1,800 min Time to non-flow/full cure.
7 min
5.00 min
4.00 min
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.86 100 Hz
2.87 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00070 100 Hz
0.00010 100 kHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.
0.960 Cured or uncured A & B.