Dow 3-4222 Dielectric Firm Gel Kit

Dow 3-4222 Dielectric Firm Gel Kit Datasheet
  • Description for Dow 3-4222 Dielectric Firm Gel Kit

    Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

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    Application Type Seal
    1 Part or 2 Part 2 Part
    Material Form Liquid
    Industry Circuits, Electronics, Optoelectronics
    Manufacturer Dow Corning
    Chemistry Silicone, Solvent-free
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 100, 125, 20 to 25
    Cure Time (min) 30, 2.00, 1.00, 60
    Viscosity (cPs) Low, 325
    Color Translucent green, Translucent green
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
3.00 min Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life. 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.64 Dielectric Constant, 100 Hz
2.64 Dielectric Constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00070 Dissipation Factor, 100 Hz
0.00020 Dissipation Factor, 100 KHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.