Dow 3-4222 Dielectric Firm Gel Kit Datasheet Dow 3-4222 Dielectric Firm Gel Kit

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  • Description for Dow 3-4222 Dielectric Firm Gel Kit

    Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    *See Terms of Use Below

    Application Type Seal
    1 Part or 2 Part 2-Part
    Material Form Liquid
    Industry Circuits, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electronics, Optoelectronics
    Manufacturer Dow Corning
    Chemistry Silicone, Solvent-free
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125
    Cure Time (min) 30, 60, 2.00, 1.00
    Viscosity (cPs) Low, 325
    Color Translucent green, Translucent green
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Volume Resistivity (O) 1E+15 (ohms/cm)
    Durability Tough
    Light Refractive Index (RI) High

  • Technical Data for Dow 3-4222 Dielectric Firm Gel Kit

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    Overview
    • Application Type
    • 1 Part or 2 Part
      • 2-Part
    • Material Form
      • Liquid
    • Industry
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Electronics - Circuits, Optoelectronics
    • Chemistry
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Translucent - Translucent green
      • Green - Translucent green
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25, 20 to 25, 100, 125
    Cure Time (min) 30, 60, 2.00, 1.00
    Viscosity (cPs) Low, 325
    Work / Pot Time (min) 3.00 Test Method
    Mix Ratio 1:1 (by volume)
    Material Resistance
    High Temperature Resistance (°C) 150
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00070, 0.00020 Test Method
    Dielectric Strength (V/mil) Excellent, 350
    Dielectric Constant 2.64, 2.64 Test Method
    Volume Resistivity (O) 1E+15 (ohms/cm)
    Hardness
    Durability Tough
    Shore A Hardness 270 g
    Flexibility Firm, Flexible, Resilient
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.970 Test Method
    Coefficient of Thermal Expansion (CTE) 320 (Linear (micron/m °C or ppm ))
    Flash Point (°F) 194.0
    Business Information
    Shelf Life Details Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35°C, unless otherwise noted.
    Shelf Life Type from date of manufacture
    Shelf Life (mon) 12

  • Best Practices for Dow 3-4222 Dielectric Firm Gel Kit

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. In general, gels are supplied as two-part products that are mixed in a 1:1 ratio (Parts A and B)

      one-part gels are available that eliminate the need for mixing. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    2. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.

  • Comparable Materials for Dow 3-4222 Dielectric Firm Gel Kit

    *See Terms of Use Below

    Spec Engine® Results

    • Dow
      Dowsil 3-4207 Dielectric Tough Gel(Dow)

      Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    • Dow
      OE-6635(Dow)

      2-part, high viscosity, solvent-less, high RI, transparent, heat-cure silicone resin, clear LED resin for fabricated parts

    • Compare All
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Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
3.00 min Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life. 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.64 Dielectric Constant, 100 Hz
2.64 Dielectric Constant, 100 KHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00070 Dissipation Factor, 100 Hz
0.00020 Dissipation Factor, 100 KHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.970 Cured or uncured A & B.