Dow Dowsil 3-4170 Dielectric Gel

Dow Dowsil 3-4170 Dielectric Gel Datasheet
  • Description for Dow Dowsil 3-4170 Dielectric Gel

    • Clear • Fast heat cure • Long working time and low viscosity aid process flexibility • Impregnation may be successful without vacuum

    *See Terms of Use Below

    Brand Dowsil
    Application Type Seal, Coating, Encapsulating , Potting
    1 Part or 2 Part 2 Part
    Material Form Gel
    Industry Circuits, Electronics: PCB system assemblies, Electronics, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Addition Cure, Heat
    Cure Temperature (°C) 100, 125, 150
    Cure Time (min) 9, 5.00, 3.00
    Viscosity (cPs) 475, Low
    Color Soft Clear
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Light Refractive Index (RI) High
  • Technical Data

    Overview
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    Specifications
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  • Best Practices

    *See Terms of Use Below

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Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
100°C Heat
125°C Heat
150°C Heat
Cure Time Test Methods
Cure Time Test Method
9 min Heat
5.00 min Heat
3.00 min Heat
Viscosity Test Methods
Viscosity Test Method
475 cPs Mixed
Low
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Long
>1,440 min Pot Life 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 At 100 Hz
2.85 At 100 Hz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00160 At 100 hz
0.00007 At 100 kHz
Coefficient of Thermal Expansion (CTE) Test Methods
Coefficient of Thermal Expansion (CTE) CTE Test Method
425 (ppm/ºC) By TMA