Dow Dowsil 3-4207 Dielectric Tough Gel

Dow Dowsil 3-4207 Dielectric Tough Gel Datasheet
  • Description for Dow Dowsil 3-4207 Dielectric Tough Gel

    Firm or tough, thermal/mechanical shock and vibration damping, primerless chemical adhesion at room temperature (except 3-4237 Dielectric Firm Gel, which requires heat to develop chemical adhesion), excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wide temperature range.

    *See Terms of Use Below

    Brand Dowsil
    Application Type Sealant, Encapsulant, Pottant
    1 Part or 2 Part 2 Part
    Material Form Gel (Post-cure), Liquid (Pre-cure)
    Industry Circuits, LEDs, E-Mobility Solutions, Smart Meters, Insulation, Electronics, Optoelectronics
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Part A/Part B
    Cure Temperature (°C) 20 to 25 Room Temperature, 25, 50, 75, 100
    Cure Time (min) Fast, 90, 10, 5.00, 3.00
    Viscosity (cPs) Low
    Fluorescent UV indicator allows for automated inspection
    Color Translucent green, Translucent green
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Durability Tough
    Light Refractive Index (RI) High
    Key Specifications UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: UL 94 V-1
  • Technical Data for Dow Dowsil 3-4207 Dielectric Tough Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 2 Part
    • Material Form
      • Liquid - Liquid (Pre-cure)
      • Gel - Gel (Post-cure)
    • Industry
      • LED (Light-Emitting Diodes) - LEDs
      • E-Mobility Solutions
      • Electronics - Circuits, Optoelectronics
      • Smart Meters
      • Insulation
    • Application Method
      • Dispenser - Automated dispensing equipment
    • Cure Method
      • 2-Part Cure - Part A/Part B
    • Color
      • Translucent - Translucent green
      • Green - Translucent green
    • Key Specifications
      • UL (Underwriters Laboratory), ULC (Underwriters Laboratories of Canada), NFPA (National Fire Protection Association): UL 94: V-1 - UL 94 V-1
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Temperature (°C) 20 to 25 Room Temperature, 25, 50, 75, 100 Test Method
    Cure Time (min) Fast, 90, 10, 5.00, 3.00 Test Method
    Viscosity (cPs) Low
    Fluorescent UV indicator allows for automated inspection
    Mix Ratio 1:1 (by volume)
    Bond Strength
    Peel Strength (piw) 3 (ppi) Test Method
    Material Resistance
    Flame Resistance Good flame resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.03000, <0.00010 Test Method
    Dielectric Strength (V/mil) Excellent, 420
    Dielectric Constant 2.85, 2.86 Test Method
    Volume Resistivity (O) 7.1E+13 (ohms/cm)
    Hardness
    Durability Tough
    Shore A Hardness 9500 g Test Method
    Shore OO Hardness 59 Test Method
    Flexibility Flexible, Resilient
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.980 Test Method
    Coefficient of Thermal Expansion (CTE) 325 (Linear (micron/m °C or ppm ))
    Flash Point (°F) 190.4
    Business Information
    Shelf Life Details Shelf life is indicated by the “Use Before” date found on the product label. Refer to the product label for storage temperature requirements.
    Shelf Life Temperature (°F) 77
    Shelf Life (mon) 12
  • Best Practices for Dow Dowsil 3-4207 Dielectric Tough Gel

    *See Terms of Use Below

    1. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment. Typically, the two components are of matched viscosities and are readily mixed with static or dynamic mixers, with automated meter-mix normally used for high volume processes. For low-volume applications, manual weighing and simple hand mixing may be appropriate. Inaccurate proportioning or inadequate mixing may cause localized or widespread problems affecting the gel properties or cure characteristics.

    2. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to mix and dispense the gel. This is especially important with higher-viscosity and faster-curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    3. Curing

      Working time (or pot life) is the time required for the initial mixed viscosity to double at room temperature (RT). The cure reaction begins when Parts A and B are mixed. As the cure progresses, viscosity increases until the material becomes a soft gel. Cure is defined as the time required for a specific gel to reach 90% of its final properties. Gels will reach a no-flow state prior to full cure. Additioncure silicone gels may be RT and heat cure or exclusively heat cure. Adding heat accelerates the cure reaction. Additional time should be allowed for heating the part to near oven temperature. Cure schedules should be verified in each new application.

      Certain materials, chemicals, curing agents and plasticizers can inhibit the cure of addition cure adhesives. Most notable of these include: organotin and other organometallic compounds, silicone rubber containing organotin catalyst, sulfur, polysulfides, polysulfones or other sulfur containing materials, unsaturated hydrocarbon plasitcizers, and some solder flux residues. If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    4. Removal

      In the manufacture of PCB system assemblies, salvage or rework of damaged or defective units is often required. Removal of DOWSIL™ dielectric gels to allow necessary repairs can be assisted by using DOWSIL™ OS fluids. Additional information regarding these products is available from Dow.

      Digestive stripping agents, such as SU100 from Silicones Unlimited, can also be used. In addition, if only one component needs to be replaced, a soldering iron may be applied directly through the gel to remove the component. After work has been completed, the repaired area should be cleaned with forced air or a brush, dried, and patched with additional silicone gel.

  • Comparable Materials for Dow Dowsil 3-4207 Dielectric Tough Gel

    *See Terms of Use Below

    Spec Engine® Results

Questions about this material?

Dow - Dowsil 3-4207 Dielectric Tough Gel

Get personal assistance with your specific application needs.

Your Profile Edit

Popular Articles

Intro to Protecting Power Supplies

Read Article

What Are the Differences Between Adhesives and Sealants?

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Testing the effectiveness of surface treatments

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
Cure Temperature Test Methods
Cure Temperature Cure Time Test Method
20 to 25°C Room Temperature
25°C
50°C Heat Cure
75°C
100°C Heat Cure
Cure Time Test Methods
Cure Time Test Method
Fast
90 min
10 min Heat Cure
5.00 min
3.00 min Heat Cure
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
Set Time Test Methods
Set Time Set Temperature
Peel Strength Test Methods
Peel Strength Test Method
3 (ppi) 180 Degree Peel Strength, Unprimed Adhesion
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.85 Dielectric Constant, 100 Hz
2.86 Dielectric Constant, 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.03000 Dissipation Factor 100 Hz
<0.00010 Dissipation Factor 100 kHz
Shore A Hardness Test Methods
Shore A Hardness Shore Hardness Test Method
9500 g Durometer
Shore OO Hardness Test Methods
Shore OO Hardness Shore Hardness Test Method
59 Durometer
Specific Gravity Test Methods
Specific Gravity Test Method
0.980 Cured or uncured A & B.
;