Dow Dowsil 3-6371 UV Gel

Dow Dowsil 3-6371 UV Gel Datasheet
  • Description for Dow Dowsil 3-6371 UV Gel

    One-part, very soft, translucent, UV cure, low temperature gel, Moisture secondary cure, No mixing required, Is suitable for potting and protecting of PCB system assemblies in very high throughput manufacturing process

    *See Terms of Use Below

    Brand Dowsil
    Application Type Seal, Potting
    1 Part or 2 Part 1 Part
    Material Form Gel
    Industry Isolate circuits from the harmful effects of moisture, PCB system assemblies, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electronics Devices, Optoelectronics, Isolate circuits from the harmful effects of other contaminants, Protect circuits thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Addition cure, UV, Moisture secondary cure
    Cure Time (min) 0.42
    Viscosity (cPs) 850, Controlled flow
    Color Translucent , Light Amber
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low
    Stress Relief Stress relief
    Light Refractive Index (RI) High
  • Technical Data for Dow Dowsil 3-6371 UV Gel

    Overview
    • Application Type
    • 1 Part or 2 Part
      • 1 Part or 2 Part - 1 Part
    • Material Form
      • Gel
    • Industry
      • E-Mobility Solutions
      • Electronics - Isolate circuits from the harmful effects of moisture, Electronics Devices, Optoelectronics, Isolate circuits from the harmful effects of other contaminants, Protect circuits thermal and mechanical stresses, Protect interconnections from thermal and mechanical stresses
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Smart Meters
      • Smart Home Devices
      • Industrial - Delicate components
    • Application Method
      • Dispenser - Automated dispensing equipment
      • Other - Meter Mix Equipment
    • Cure Method
      • UV / Visible Light - UV
      • Moisture / Condensation Cure - Moisture secondary cure
      • Other - Addition cure
    • Color
      • Translucent - Translucent
      • Red - Light Amber
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Time (min) 0.42 Test Method
    Viscosity (cPs) 850, Controlled flow
    Work / Pot Time (min) 10,080 Test Method
    Thixotropic Thixotropic
    Material Resistance
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low
    Moisture/Humidity Resistance Moisture/humidity resistance
    Conductivity
    Dissipation Factor 0.00470, 0.00006 Test Method
    Dielectric Strength (V/mil) Electrical insulation for high voltages, 300
    Dielectric Constant 2.81, 2.81 Test Method
    Volume Resistivity (O) 1.9E+12 (ohms/cm)
    Hardness
    Dimensional Stability Dimensional Stability
    Stress Relief Stress relief
    Shore A Hardness 40 (grams)
    Flexibility Resilient, Flexible, Very soft
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.980 Test Method
    Coefficient of Thermal Expansion (CTE) 385 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life Type "Use By” date
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Sulfur, Some solder flux residues, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasticizers, Polysulfides, Organotin compounds, Other organometallic compounds
    Don't Use With Silicone rubber containing organotin catalyst
  • Best Practices for Dow Dowsil 3-6371 UV Gel

    *See Terms of Use Below

    1. Mixing

      No mixing required

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination. Gels can be dispensed manually or by using one of the available types of meter mix equipment. If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and fastercuring gels. Degassing at >28 inches (10-20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer.

    2. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, a small-scale compatibility test should be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure. In certain situations, toughened gels may appear fully cured but have reduced or no adhesion. This may result from slight inhibition at the interface.

    3. Removal

      In the manufacture of electronic devices, salvage or rework of damaged or defective units is often required. Removal of Dow Corning® Dielectric Gels to allow necessary repairs can be assisted by using Dow Corning® OS Fluids. Additional information regarding these products is available from Dow Corning. Digestive stripping agents, such as SU100 Silicone Sealant/Adhesive Remover from Silicones Unlimited, can also be used. In addition, if only one component needs to be replaced, a soldering iron may be applied directly through the gel to remove the component. After work has been completed, the repaired area should be cleaned with forced air or a brush, dried, and patched with additional silicone gel.

  • Comparable Materials for Dow Dowsil 3-6371 UV Gel

    *See Terms of Use Below

    Spec Engine® Results

Questions about this material?

Get personal assistance with your specific application needs.

Your Profile Edit
  1. 28fe328c-ab07-4555-830e-e0ce44997f1d
  2. 28fe328c-ab07-4555-830e-e0ce44997f1d

Popular Articles

What Are the Differences Between Adhesives and Sealants?

Read Article

Silicones in LED Lighting | Gluespec

Read Article

Testing the effectiveness of surface treatments

Read Article

Infographic: ENSURING A STRONG BOND - 6 Basic Methods of Surface Preparation

Read Article

Sponsored Articles

Unique Advantages of Contact Adhesives

Read Article

Using LOCTITE® 454™ is a Valid Option for Engineers Working with a Wide Variety of Materials

Read Article

Sylgard 184 by DOW is the Top Choice for a Transparent, Silicone Encapsulant. Read Why:

Read Article

Case Study: Creating reliable, corrosion-free bonds with LORD® 406 acrylic adhesive

Read Article
Information provided by Gluespec

Why Register?

  • View Technical Details
  • View Test Methods
  • View Key Specifications
  • View Similar Materials
  • Save your Project Searches

Already registered? Sign in.

Questions? Learn more about Gluespec

Gluespec Poll

Who do you read or follow for engineering news and entertainment?
Cure Time Test Methods
Cure Time Test Method
0.42 min UV Cure, Time to 90% Gel Hardness (15 mm thickness @ 4000 mJ/cm²)
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
10,080 min Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life., Moisture secondary cure converts a 5-mm-thick layer to a nonflow gel after 7 days at ambient conditions. 25°C
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.81 At 100 Hz
2.81 At 100 kHz
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00470 At 100 hz
0.00006 At 100 kHz
Specific Gravity Test Methods
Specific Gravity Test Method
0.980 Uncured