Dow Dowsil 3-6371 UV Gel Datasheet Dow Dowsil 3-6371 UV Gel

Information provided by Gluespec
  • Description for Dow Dowsil 3-6371 UV Gel

    • One-part • Very soft • Translucent • UV cure • Low temperature gel • Flexible • Moisture secondary cure.

    *See Terms of Use Below

    Brand Dowsil
    Chemical Resistance Resistance to some fuels, Chemical Resistance: Resistance to some solvents
    Application Type Seal, Potting
    1 Part or 2 Part 1-Part
    Material Form Gel
    Industry Isolate circuits from the harmful effects of moisture, PCB system assemblies, E-Mobility Solutions, Smart Meters, Smart Home Devices, Electronics Devices, Optoelectronics, Isolate circuits from the harmful effects of other contaminants, Protect circuits from thermal stresses, Protect interconnections from thermal stresses, Protect interconnections from mechanical stresses, Protect circuits from mechanical stresses
    Manufacturer Dow
    Chemistry Silicone, Solvent-free
    Cure Method Addition cure, UV cure, Moisture cure
    Cure Time (min) 0.42
    Viscosity (cPs) 850, Controlled flow
    Color Translucent, Light amber
    High Temperature Resistance (°C) 200
    Low Temperature Resistance (°C) -45, -55, Low
    Other Resistance Cure in place to form cushioning
    Volume Resistivity (O) 1.9E+12 (ohm*cm)
    Stress Relief Stress relief
    Light Refractive Index (RI) High
  • Technical Data for Dow Dowsil 3-6371 UV Gel

    Overview
    • Chemical Resistance
      • Chemical Resistance - Resistance to some fuels
      • Chemical Resistance : Relative Solvent Resistance - Resistance to some solvents
    • Application Type
    • 1 Part or 2 Part
      • 1-Part
    • Material Form
      • Gel
    • Industry
      • Smart Meters
      • Smart Home Devices
      • E-Mobility Solutions
      • Electronics - Isolate circuits from the harmful effects of moisture, Electronics Devices, Optoelectronics, Isolate circuits from the harmful effects of other contaminants, Protect circuits from thermal stresses, Protect interconnections from thermal stresses, Protect circuits from mechanical stresses, Protect interconnections from mechanical stresses
      • Printed Circuit Board (PCB) - PCB system assemblies
      • Industrial - Delicate components
      • Other - Sensitive applications
    • Application Method
      • Dispenser - Automated dispensing equipment, Manually
      • Other - Meter mix equipment
    • Cure Method
      • UV / Visible Light - UV cure
      • Moisture / Condensation Cure - Moisture cure
      • Other - Addition cure
    • Color
      • Translucent
      • Red - Light amber
    • Brand
      • Dowsil
    Specifications
    Cure Specs
    Cure Time (min) 0.42 Test Method
    Viscosity (cPs) 850, Controlled flow Test Method
    Work / Pot Time (min) 10,080 Test Method
    Thixotropic Thixotropic
    Material Resistance
    Dimensional Stability (%) Dimensional stability
    High Temperature Resistance (°C) 200 Test Method
    Low Temperature Resistance (°C) -45, -55, Low Test Method
    Moisture/Humidity Resistance Moisture resistance, Humidity resistance
    Other Resistance Cure in place to form cushioning
    Conductivity
    Dissipation Factor 0.00470, 0.00006 Test Method
    Dielectric Strength (V/mil) Electrical insulation for high voltages, 300 Test Method
    Dielectric Constant 2.81, 2.81 Test Method
    Volume Resistivity (O) 1.9E+12 (ohm*cm) Test Method
    Hardness
    Stress Relief Stress relief
    Flexibility Resilient, Flexible, Very soft
    Other Properties
    Light Refractive Index (RI) High
    Specific Gravity 0.980 Test Method
    Coefficient of Thermal Expansion (CTE) 385 (Linear (micron/m °C or ppm ))
    Business Information
    Shelf Life Details Storage conditions and shelf life (“Use By” date) are indicated on the product label.
    Shelf Life Temperature (°F) 77
    Shelf Life Type "Use By” date
    Shelf Life (mon) 12
    Not Good For
    Don't Use For Sulfur, Some solder flux residues, Polysulfones, Other sulfur containing materials, Unsaturated hydrocarbon plasticizers, Polysulfides, Organotin compounds, Other organometallic compounds
    Don't Use With Silicone rubber containing organotin catalyst, Certain materials, Curing agents, Plasticizers
  • Best Practices for Dow Dowsil 3-6371 UV Gel

    *See Terms of Use Below

    1. Application

      Gels can be dispensed manually or by using one of the available types of meter mix equipment.

    2. Mixing

      Some gels are supplied in bladder packs that avoid direct air contact with the liquid gel components, allowing use of air pressure over the pack in a pressure pot for dispensing. Do not apply air pressure directly to the liquid gel surface (without the bladder pack) as the gel can become supersaturated with air and bubbling can occur when the material is dispensed and cured. Use of bladder packs prevents bubbling, maintains cleanliness and avoids gel contamination.

    3. Deairing/Degassing

      If possible, the potential for entrapment and incorporation of gas (typically air) should be considered during design of the part and selection of a process to dispense the gel. This is especially important with higher-viscosity and faster curing gels. Degassing at > 28 inches (10–20 mm) Hg vacuum may be necessary to ensure a void-free, protective layer

    4. Testing

      If a substrate or material is questionable with respect to potentially causing inhibition of cure, it is recommended that a small scale compatibility test be run to ascertain suitability in a given application. The presence of liquid or uncured product at the interface between the questionable substrate and the cured gel indicates incompatibility and inhibition of cure.

    5. Removal

      In the manufacture of PCB system assemblies, salvage or rework of damaged or defective units is often required. Removal of Dow dielectric gels to allow necessary repairs can be assisted by using Dow OS fluids. Digestive stripping agents, such as SU100 Silicone Sealant/Adhesive Remover from Silicones Unlimited, can also be used. In addition, if only one component needs to be replaced, a soldering iron may be applied directly through the gel to remove the component. After work has been completed, the repaired area should be cleaned with forced air or a brush, dried, and patched with additional silicone gel.

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    *See Terms of Use Below

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Cure Time Test Methods
Cure Time Test Method
0.42 min UV Cure, Time to 90% Gel Hardness (15 mm Thickness @ 4000 mJ/cm²), Specification Writers: These values are not intended for use in preparing specifications.
Viscosity Test Methods
Viscosity Test Method
850 cPs Specification Writers: These values are not intended for use in preparing specifications.
Controlled flow
Work / Pot Time Test Methods
Work / Pot Time Test Method Temperature
10,080 min Time to double initial viscosity initial mixed viscosity for two-part products at room temperature. This property is sometimes referred to as pot life., Moisture secondary cure converts a 5-mm-thick layer to a nonflow gel after 7 days at ambient conditions. 25°C
High Temperature Resistance Test Methods
High Temperature Resistance Test Method
200°C For long periods
Low Temperature Resistance Test Methods
Low Temperature Resistance Test Method
-45°C For long periods
-55°C
Low
Dielectric Constant Test Methods
Dielectric Constant Test Method
2.81 At 100 Hz, Specification Writers: These values are not intended for use in preparing specifications.
2.81 At 100 kHz, Specification Writers: These values are not intended for use in preparing specifications.
Dielectric Strength Test Methods
Dielectric Strength Test Method
Electrical insulation for high voltages
300 V/mil Specification Writers: These values are not intended for use in preparing specifications.
Dissipation Factor Test Methods
Dissipation Factor Test Method
0.00470 At 100 hz, Specification Writers: These values are not intended for use in preparing specifications.
0.00006 At 100 kHz, Specification Writers: These values are not intended for use in preparing specifications.
Volume Resistivity Test Methods
Volume Resistivity Test Method
1.9E+12 (ohm*cm) Specification Writers: These values are not intended for use in preparing specifications.
Specific Gravity Test Methods
Specific Gravity Test Method
0.980 Uncured, Specification Writers: These values are not intended for use in preparing specifications.